RP605Z183B-E2-F

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RP605Z183B-E2-F

Manufacturer:

Nisshinbo Micro Devices Inc.

Description:

300MA ULTRA-LOW POWER BUCK BOOST

Origin Data #:

8912316-RP605Z183B-E2-F

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TYPEDESCRIPTION
Category
ManufacturerNisshinbo Micro Devices Inc.
SeriesRP605x
Package / Case20-XFBGA, WLCSP
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Voltage - Supply1.8V ~ 5.5V
ApplicationsBattery Management, Power Supplies
Current - Supply300nA
Supplier Device Package20-WLCSP-P3 (2.32x1.71)

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RP605Z183B-E2-F - From Manufacturer: Nisshinbo Micro Devices Inc., it is an 300MA ULTRA-LOW POWER BUCK BOOST, part of Integrated Circuits (ICs), Power Management (PMIC), Power Management - Specialized. RP605Z183B-E2-F stock status: need to confirm with us, contact us! Quick Reply.

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ERAIESDAS 9120BISO 9001ISO 13485ISO 14001ISO 22301ISO 28000ISO 37001ISO 37301ISO 45001