Adhesives, Epoxies, Greases, Pastes

Results:
648
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining648
Select
ImageProduct DetailPriceAvailabilityECAD ModelColorShelf LifeStorage/Refrigeration TemperatureSeriesTypeSize / DimensionUsable Temperature RangeThermal ConductivityFeatures
A17170-02
1+
$234.8987
5+
$221.8488
10+
$208.7989
Quantity
124 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Green
6 Months
-
Tputty™ 508
Silicone Compound
180cc Cartridge
-40°F ~ 302°F (-40°C ~ 150°C)
3.70W/m-K
Low Outgassing (ASTM E595)
A16412-02
TPUTTY 506 180CC CARTRIDGE
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
-
Tputty™ 506
-
-
-
-
-
4951G
THERMALBOND EPOXY 3.5OZ PACKET
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
12 Months
-
Thermalbond™
Hardener Epoxy
3.5 oz Package
-85°F ~ 311°F (-65°C ~ 155°C)
1.34W/m-K
-
8327GL3-25ML
PREMIUM THERMAL GEL, 3 W/(MK)
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
61°F ~ 81°F (16°C ~ 27°C)
8327GL3
Non-Silicone Gel
25 ml Jar
-40°F ~ 248°F (-40°C ~ 120°C)
3.50W/m-K
-
TH833-3_0.5_0.5
Silicone thermal conductive pott
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Gray, White
12 Months
-
TH833-3
Silicone Compound, 2 Part
500 gram Jar
-40°F ~ 392°F (-40°C ~ 200°C)
2.0W/m-K
-
PT380-1_0.5_0.25
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Clear Yellowish
12 Months
-
PT380-1
Potting Compound, 2 Part
250 gram Jar, 500 gram Jar
-13°F ~ -112°F (-25°C ~ 80°C)
-
-
PT605_0.5_0.25
Flexible black potting epoxy (2-
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, Clear Yellowish
12 Months
-
PT605
Potting Compound, 2 Part
250 gram Jar, 500 gram Jar
-40°F ~ 392°F (-40°C ~ 200°C)
1.10W/m-K
-
TH833-3_0.1_0.1
Silicone thermal conductive pott
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray, White
12 Months
-
TH833-3
Silicone Compound, 2 Part
100 gram Jar
-40°F ~ 392°F (-40°C ~ 200°C)
2.0W/m-K
-
65-00-GEL20-0300
THERM-A-GAP GEL 20 2.4 W/M-K DIS
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
18 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 20
Gel Gap Filler
300cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
2.4W/m-K
Low Outgassing (ASTM E595)
8327GL6-180ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
24 Months
61°F ~ 81°F (16°C ~ 27°C)
8327GL6
Non-Silicone Gel
180 ml Cartridge
-40°F ~ 248°F (-40°C ~ 120°C)
6.00W/m-K
-
65-02-GEL20-0180
THERM-A-GAP GEL 20 2.4 W/M-K DIS
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
18 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 20
Gel Gap Filler
180cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
2.4W/m-K
Low Outgassing (ASTM E595)
65-02-GEL40NS-0180
THERM-A-GAP GEL 40NS 4.0 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 40NS
Non-Silicone Gel
180cc Cartridge
-58°F ~ 257°F (-50°C ~ 125°C)
4.0W/m-K
Low Outgassing (ASTM E595)
TG-N8000-30CC
NON-SILICONE PUTTY 30CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Yellow
-
-
TG-N8000
Non-Silicone Putty
30cc Syringe
-40°C ~ 125°C
8.00W/m-K
-
65-05-GEL40NS-0030
THERM-A-GAP GEL 40NS 4.0 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 40NS
Non-Silicone Gel
30cc Cartridge
-58°F ~ 257°F (-50°C ~ 125°C)
4.0W/m-K
Low Outgassing (ASTM E595)
8327GL6-30ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Gray
24 Months
61°F ~ 81°F (16°C ~ 27°C)
8327GL6
Non-Silicone Gel
30 ml Cartridge
-40°F ~ 248°F (-40°C ~ 120°C)
6.00W/m-K
-
TG-N8000-30
NON-SILICONE PUTTY 30G POT YELLO
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Yellow
-
-
TG-N8000
Non-Silicone Putty
30 gram Jar
-40°C ~ 125°C
8.00W/m-K
-
65-02-GEL20-0030
THERM-A-GAP GEL 20 2.4 W/M-K DIS
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Blue
18 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 20
Gel Gap Filler
30cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
2.4W/m-K
Low Outgassing (ASTM E595)
65-00-GEL40NS-0010
THERM-A-GAP GEL 40NS 4.0 W/M-K D
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
THERM-A-GAP™ GEL 40NS
Non-Silicone Gel
10cc Syringe
-58°F ~ 257°F (-50°C ~ 125°C)
4.0W/m-K
Low Outgassing (ASTM E595)
8327GL3-30ML
PREMIUM THERMAL GEL, 3 W/(MK)
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
White
24 Months
61°F ~ 81°F (16°C ~ 27°C)
8327GL3
Non-Silicone Gel
30 ml Cartridge
-40°F ~ 248°F (-40°C ~ 120°C)
3.50W/m-K
-
8327GL5-25ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Gray
-
61°F ~ 81°F (16°C ~ 27°C)
8327GL5
Non-Silicone Gel
25 ml Jar
-67°F ~ 302°F (-55°C ~ 150°C)
5.10W/m-K
-

Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.