Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
228-1277-09-0602J
SOCKET ADAPTER 28DIP TO 28DIP
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
97-68340-P
ADAPTER/PANEL QFP TO PGA 144POS
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 68340
QFP
PGA
144
0.026" (0.65mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
800-27-6-1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
24-35W000-10
SOCKET ADAPT SOIC-W TO 24DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-354000-11-RC
SOCKET ADAPTER DIP TO 16SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
16
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-35W000-10
SOCKET ADAPT SOIC-W TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
228-4817-09-0602J
RECEPTACLE DIP SOCKET 28POS .4"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-29-0602J
RECEPTACLE DIP SOCKET 24POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
1109523
SOCKET ADAPTER DIP TO TO-8
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1109523
DIP, 0.3" (7.62mm) Row Spacing
JEDEC
8
0.100" (2.54mm)
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
44-305263-20
SOCKET ADAPTER QFP TO 44PLCC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 305263
QFP
PLCC
44
0.024" (0.60mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
228-4817-19-0602J
RECEPTACLE DIP SOCKET 28POS .4"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-09-0602J
SOCKET ADAPTER 40DIP TO 40DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
68-505-110-RC
SOCKET ADAPTER PLCC TO 68PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
97-56001-P
SOCKET ADAPTER QFP TO 169PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 97-56001
QFP
PGA
169
0.025" (0.64mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
95-132I25-P
SOCKET ADAPTER QFP TO 132PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 95-132I25
QFP
PGA
132
0.025" (0.64mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-353000-10
SOCKET ADAPTER PLCC TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 353000
PLCC
DIP, 0.3" (7.62mm) Row Spacing
28
0.050" (1.27mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-352000-10
SOCKET ADAPTER PLCC TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 352000
PLCC
DIP, 0.3" (7.62mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
242-1281-09-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-3639-09-0602J
RECEPTACLE DIP SOCKET 40POS 1.0"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 1.0" (25.40mm) Row Spacing
DIP, 1.0" (25.40mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
232-1285-39-0602J
RECEPTACLE DIP SOCKET 32POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.