Solder

Results:
1,741
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Results remaining1,741
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartMesh TypeDiameterTypeCompositionMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
84-7068-0118
SOLDER SOLID WIRE .118" 5KG SPL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
0.118" (3.00mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
-
9 AWG, 11 SWG
Lead Free
Spool, 11.02 lbs (5kg)
50°F ~ 104°F (10°C ~ 40°C)
SMD291AX
SOLDER PASTE NO-CLEAN 63/37 5CC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
12 Months
Date of Manufacture
3
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
-
Leaded
Syringe, 0.53 oz (15g), 5cc
37°F ~ 46°F (3°C ~ 8°C)
24-6337-7402
SOLDER FLUX-CORED/282 63/37 .031
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Quantity
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PCB Symbol, Footprint & 3D Model
282
-
-
-
0.031" (0.79mm)
Wire Solder
Sn63Pb37 (63/37)
361°F (183°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
-
SMDSWLF.059 3.3 1LB
SOLDER WIRE SN96.5/AG3.0/CU0.5
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
0.059" (1.50mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
-
Lead Free
Spool, 1 lb (453.59g)
-
NCSWLF.015 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
0.015" (0.38mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 1 lb (453.592g)
-
96-7069-9525
SN96.5AG3.0CU0.5 3.3%/268 .025 5
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Quantity
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PCB Symbol, Footprint & 3D Model
268
36 Months
Date of Manufacture
-
0.025" (0.64mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
22 AWG, 23 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
24-7150-9703
SOLDER FLUX-CORED/285 .015" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
285
-
-
-
0.015" (0.38mm)
Wire Solder
Sn62Pb36Ag2 (62/36/2)
354°F (179°C)
Rosin Mildly Activated (RMA)
27 AWG, 28 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
91-6040-0007
SOLDER FLUX-CORED/44 .015" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
44
-
-
-
0.015" (0.38mm)
Wire Solder
Sn60Pb40 (60/40)
361 ~ 374°F (183 ~ 190°C)
Rosin Activated (RA)
27 AWG, 28 SWG
Leaded
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
90-7068-9850
SOLDER FLUX-CORED/296 .010" 100G
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Quantity
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PCB Symbol, Footprint & 3D Model
296
-
-
-
0.010" (0.25mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
30 AWG, 33 SWG
Lead Free
Spool, 3.53 oz (100g)
-
86-7033-0118
SOLDER SOLID WIRE .118" 2.5KG SP
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Quantity
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PCB Symbol, Footprint & 3D Model
Solid Solder Wire
-
-
-
0.118" (3.00mm)
Wire Solder
Sn97Ag3 (97/3)
430 ~ 435°F (221 ~ 224°C)
-
9 AWG, 11 SWG
Lead Free
Spool, 5.51 lbs (2.5kg)
-
24-6337-9832
SOLDER FLUX-CORED/296 63/37 .031
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Quantity
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PCB Symbol, Footprint & 3D Model
296
-
-
-
0.031" (0.79mm)
Wire Solder
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
84-6337-0118
SOLDER SOLID WIRE 63/37 .118" 5K
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Quantity
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PCB Symbol, Footprint & 3D Model
Solid Solder Wire
-
-
-
0.118" (3.00mm)
Wire Solder
Sn63Pb37 (63/37)
361°F (183°C)
-
9 AWG, 11 SWG
Leaded
Spool, 11.02 lbs (5kg)
50°F ~ 104°F (10°C ~ 40°C)
70-4722-0911
SOLDER PASTE WATER SOL 600GM
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Quantity
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PCB Symbol, Footprint & 3D Model
WP601-ZH
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
-
Lead Free
Cartridge, 21.16 oz (600g)
32°F ~ 50°F (0°C ~ 10°C)
SMD2SW.031 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
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Quantity
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PCB Symbol, Footprint & 3D Model
SMD2
-
-
-
0.031" (0.79mm)
Wire Solder
Sn60Pb40 (60/40)
361 ~ 370°F (183 ~ 188°C)
No-Clean, Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
-
T0051388399
WSW SAC L0 SN3,0AG0,5CU3,5%
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Quantity
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PCB Symbol, Footprint & 3D Model
Weller®
-
-
-
0.012" (0.31mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
No-Clean
-
Lead Free
Spool, 3.53 oz (100g)
-
NC4SW.020 1LB
SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
0.020" (0.51mm)
Wire Solder
Pb93.5Sn5Ag1.5 (93.5/5/1.5)
565 ~ 574°F (296 ~ 301°C)
No-Clean
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
-
NC191SNL50T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
Smooth Flow™
6 Months
Date of Manufacture
5
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Jar, 1.76 oz (50g)
37°F ~ 46°F (3°C ~ 8°C)
EXB-SN96.5AG3.0CU0.5-0.5LB
SOLDER BAR SN96.5/AG3.0/CU0.5 0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Super Low Dross™
-
-
-
-
Bar Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Bar, 0.5 lb (227g)
-
SMD2060-25000
SOLDER SPHERES SAC305 .030" DIAM
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Quantity
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PCB Symbol, Footprint & 3D Model
SMD2
24 Months
Date of Manufacture
-
0.030" (0.76mm)
Solder Sphere
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Jar
-
24-7040-0027
SOLDER FLUX-CORED/44 .031" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
44
-
-
-
0.031" (0.79mm)
Wire Solder
Sn96.5Ag3.5 (96.5/3.5)
430°F (221°C)
Rosin Activated (RA)
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.