Adapter, Breakout Boards

Results:
1,705
Manufacturer
Series
Size / Dimension
Package Accepted
Number of Positions
Pitch
Proto Board Type
Board Thickness
Type
Operating Temperature
Color
Material
Torque - Rated (oz-in / mNm)
Diameter - Shaft
Q @ Freq
Encoder Type
Contact Finish
Voltage - Rated
Ratings
Package / Case
Torque - Max Momentary (oz-in / mNm)
Material - Core
Current - Saturation (Isat)
Termination Style
Contact Finish Thickness
Shielding
Mounting Type
Mounting Hole Spacing
Length - Shaft and Bearing
DC Resistance (DCR)
Height - Seated (Max)
Current Rating (Amps)
Wire Gauge
RPM
Supplier Device Package
Function
Inductance
Power - Rated
Specifications
Motor Type
Frequency - Self Resonant
Contact End
Height
Features
Length (Inches)
Width
Inductance Frequency - Test
Tolerance
Length
Gear Reduction Ratio
Results remaining1,705
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesNumber of PositionsMaterialPitchBoard ThicknessProto Board TypePackage AcceptedSize / Dimension
PA0212
TSOP-66 II TO DIP-66 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
66
FR4 Epoxy Glass
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
TSOP
1.000" x 3.300" (25.40mm x 83.82mm)
DR200D254P24M
DUAL ROW 2.00MM PITCH 24-PIN MAL
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
24
FR4 Epoxy Glass
0.079" (2.00mm)
0.063" (1.60mm)
Connector to DIP
2mm Header
1.200" L x 0.700" W (30.48mm x 17.78mm)
DR100D254P20F
DUAL ROW 1.00MM PITCH 20-PIN FEM
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
20
FR4 Epoxy Glass
0.039" (1.00mm)
0.063" (1.60mm)
Connector to DIP
1mm Header
1.000" L x 0.700" W (25.40mm x 17.78mm)
CN0003
DVI-I DUAL LINK ADAPTER BOARD
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
-
FR4 Epoxy Glass
-
0.063" (1.60mm)
Connector to SIP
-
1.500" L x 1.000" W (38.10mm x 25.40mm)
IPC0135
TQFP-44 TO DIP-44 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
44
FR4 Epoxy Glass
0.039" (1.00mm)
0.062" (1.57mm) 1/16"
SMD to DIP
TQFP
1.000" x 2.200" (25.40mm x 55.88mm)
IPC0019
QFN-32 TO DIP-36 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
32
FR4 Epoxy Glass
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
SMD to DIP
QFN
1.000" x 1.800" (25.40mm x 45.72mm)
IPC0134
TQFP-44 TO DIP-44 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
44
FR4 Epoxy Glass
0.031" (0.80mm)
0.062" (1.57mm) 1/16"
SMD to DIP
TQFP
1.000" x 2.200" (25.40mm x 55.88mm)
IPC0141
POWERSSO-36 TO DIP-40 SMT ADAPTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
36
FR4 Epoxy Glass
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
SMD to DIP
PowerSSO
1.000" x 2.000" (25.40mm x 50.80mm)
IPC0100
QFN-32 TO DIP-36 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
32
FR4 Epoxy Glass
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
SMD to DIP
QFN
1.000" x 1.800" (25.40mm x 45.72mm)
PA0070
QFN-40 TO DIP-40 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
40
FR4 Epoxy Glass
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
SMD to DIP
QFN
1.000" x 2.000" (25.40mm x 50.80mm)
IPC0049C
POWERSOIC-20 TO DIP-24 SMT ADAPT
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
24
-
0.050" (1.27mm)
-
SMD to DIP
HSOP, PSOP, SOIC
1.200" L x 0.700" W (30.48mm x 17.78mm)
IPC0145
QFN-36 TO DIP-36 SMT ADAPTER
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
36
FR4 Epoxy Glass
0.031" (0.80mm)
0.062" (1.57mm) 1/16"
SMD to DIP
QFN
1.000" x 1.800" (25.40mm x 45.72mm)
PA0071C
QFN-40 TO DIP-40 SMT ADAPTER (0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
40
-
0.020" (0.50mm)
-
SMD to DIP
QFN
2.000" L x 0.700" W (50.80mm x 17.78mm)
IPC0014C
QFN-24 TO DIP-28 SMT ADAPTER (0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
28
-
0.020" (0.50mm)
-
SMD to DIP
QFN
1.400" L x 0.400" W (35.56mm x 10.16mm)
IPC0041C
QFN-24 TO DIP-28 SMT ADAPTER (0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
28
-
0.020" (0.50mm)
-
SMD to DIP
QFN
1.400" L x 0.400" W (35.56mm x 10.16mm)
PA0041C
TSSOP-56 TO DIP-56 SMT ADAPTER (
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
56
-
0.020" (0.50mm)
-
SMD to DIP
TSSOP
2.800" L x 0.700" W (71.12mm x 17.78mm)
FPC050P060ST-S
FPC/FFC SMT CONNECTOR (0.5 MM PI
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
60
-
0.020" (0.50mm)
-
Connector to DIP
FFC/FPC Connector
-
IPC0012C
QFN-20 TO DIP-24 SMT ADAPTER (0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
24
-
0.026" (0.65mm)
-
SMD to DIP
QFN
1.200" L x 0.400" W (30.48mm x 10.16mm)
PA0092C
TQFP-32 TO DIP-32 SMT ADAPTER (0
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
32
-
0.020" (0.50mm)
-
SMD to DIP
TQFP
1.600" L x 0.700" W (40.64mm x 17.78mm)
IPC0006C
QFN-16 TO DIP-20 SMT ADAPTER (0.
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Quantity
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PCB Symbol, Footprint & 3D Model
Proto-Advantage
20
-
0.020" (0.50mm)
-
SMD to DIP
QFN
1.000" L x 0.400" W (25.40mm x 10.16mm)

Adapter, Breakout Boards

The products in this category are designed to facilitate easier access to the electrical contacts of connectors, integrated circuits, or similar devices. They achieve this by creating connections between a component placement area, which is usually intended for fine-pitch, surface-mounted integrated circuits, and an interconnect area with a considerably larger distance between pin centers. The main purpose of these products is to simplify the process of interconnecting these two areas, thereby improving the efficiency of prototyping and testing electronic components. One typical use case involves enabling the use of solderless breadboards as a prototyping method for components that do not come in breadboard-compatible packaging. By utilizing these accessories, engineers and designers can quickly and easily establish connections between various components without the need for soldering or additional wiring. This streamlines the prototyping process and reduces the time and effort required. These products are available in a variety of configurations, including headers, sockets, and adapters, to accommodate different types of connectors and devices. In summary, products in this category offer a practical and efficient solution for accessing the electrical contacts of connectors and integrated circuits, enabling smoother prototyping and testing of electronic components.