Microphones

Results:
1,960
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Results remaining1,960
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ImageProduct DetailPriceAvailabilityECAD ModelOutput TypeTerminationRatingsCurrent - SupplySeriesShapeVoltage - RatedHeight (Max)Size / DimensionTypeDirectionFrequency RangeSensitivityS/N RatioImpedanceVoltage RangePort Location
MB4015NSC-3
MIC COND ANALOG NC -46DB 4MM D
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
500 µA
MB
Circular
2 V
0.067" (1.70mm)
0.157" Dia (4.00mm)
Electret Condenser
Noise Cancelling
100 Hz ~ 10 kHz
-46dB ±3dB @ 94dB SPL
55dB
2.2 kOhms
2 V ~ 10 V
Top
FB-FO-25541-000
MIC BOOM ANALOG NC -54DB 8.6MM D
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Wire Leads
-
300 µA
FB
Circular
-
-
0.339" Dia (8.60mm)
Boom
Noise Cancelling
300 Hz ~ 4 kHz
-54dB ±3dB @ 74dB SPL
-
2.5 kOhms
1.3 V ~ 10 V
Bottom, Top
BL-23497-000
MICROPHONE PIEZO ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Wire Leads
-
160 µA
BL
Circular
3 V
1.008" (25.60mm)
0.500" Dia (12.70mm)
Piezo
Omnidirectional
20 Hz ~ 10 kHz
-69dB ±3dB @ 74dB SPL
-
4 kOhms
-
Top
MD6022APC-0
MICROPHONE COND OMNI -42DB 6MM D
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Quantity
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PCB Symbol, Footprint & 3D Model
-
PC Pins
-
-
-
Circular
2 V
0.087" (2.20mm)
0.236" Dia (6.00mm)
Electret Condenser
Omnidirectional
100 Hz ~ 10 kHz
-42dB ±3dB
55dB
2.2 kOhms
-
Top
FB-DO-23511-000
MIC BOOM ANLG NC -56DB 8.64MM D
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Wire Leads
IP67 - Dust Tight, Waterproof
-
FB
Circular
-
0.340" (8.64mm)
0.340" Dia (8.64mm)
Boom
Noise Cancelling
300 Hz ~ 4 kHz
-56dB ±3dB @ 74dB SPL
-
-
1.3 V ~ 10 V
Bottom, Top
FG-23742-D36
MICROPHONE COND ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Wire Leads
-
50 µA
FG
Circular
1.3 V
0.102" (2.60mm)
0.101" Dia (2.57mm)
Electret Condenser
Omnidirectional
100 Hz ~ 10 kHz
-63dB ±3dB @ 74dB SPL
-
4.4 kOhms
1.3 V ~ 3 V
Top
SP0102BE3-5
MIC SISONIC SMD 1.5-5.5V 0-HGHT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SPM0102ND3-2
MICROPHONE MEMS ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
250 µA
SiSonic™
Rectangular
-
0.067" (1.70mm)
0.186" L x 0.148" W (4.72mm x 3.76mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 8 kHz
-42dB ±4dB @ 94dB SPL
59dB
100 Ohms
1.5 V ~ 5.5 V
Top
SPM0102NE3-2
MIC SISONIC SMD 1.5-5.5V MINI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SPM0103ND3-2
MICROPHONE MEMS ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
350 µA
SiSonic™
Rectangular
-
0.067" (1.70mm)
0.186" L x 0.148" W (4.72mm x 3.76mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 8 kHz
-22dB ±4dB @ 94dB SPL
59dB
100 Ohms
1.5 V ~ 5.5 V
Top
SP0103BE3-5
MIC SISONIC SMD 1.5-5.5V 0-HGHT
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
350 µA
SiSonic™
Rectangular
-
0.073" (1.85mm)
0.242" L x 0.148" W (6.15mm x 3.76mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 10 kHz
-22dB ±4dB @ 94dB SPL
59dB
100 Ohms
1.5 V ~ 5.5 V
Top
SPM0103NE3-2
MIC SISONIC SMD 1.5-5.5V MINI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
BT-21751-005
MIC OMNI .9-10V -40DB SENS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
*
-
-
-
-
-
-
-
-
-
-
-
-
EA-21868-C36
MIC ELECTRET PORT ON SIDE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
*
-
-
-
-
-
-
-
-
-
-
-
-
EA-21939-C36
MICROPHONE COND ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
50 µA
EA
Rectangular
1.3 V
0.089" (2.26mm)
0.219" L x 0.157" W (5.56mm x 3.99mm)
Electret Condenser
Omnidirectional
100 Hz ~ 4.8 kHz
-59dB ±3dB @ 74dB SPL
-
3.5 kOhms
1.3 V ~ 10 V
Side
EK-23024-C05
MICROPHONE COND ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
-
-
50 µA
EK
-
1.3 V
0.089" (2.26mm)
0.219" L x 0.157" W (5.56mm x 3.99mm)
Electret Condenser
Omnidirectional
100 Hz ~ 5.5 kHz
-53dB ±2dB
-
4.4 kOhms
-
Top
EK-23024-C48
MIC OMNI .9-10VDC -33DB SENS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
*
-
-
-
-
-
-
-
-
-
-
-
-
EK-23029-C36
MIC OMNI .9-10VDC -45DB SENS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
*
-
-
-
-
-
-
-
-
-
-
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-
EK-23033-C36
MICROPHONE COND ANALOG OMNI
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Quantity
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PCB Symbol, Footprint & 3D Model
Analog
Solder Pads
-
50 µA
EK
Rectangular
1.3 V
0.089" (2.26mm)
0.219" L x 0.157" W (5.56mm x 3.99mm)
Electret Condenser
Omnidirectional
100 Hz ~ 10 kHz
-53dB ±2dB @ 74dB SPL
-
4.4 kOhms
1.3 V ~ 10 V
Side
EK-23032-C01
MIC OMNI .9-10VDC -33DB SENS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
*
-
-
-
-
-
-
-
-
-
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About  Microphones

Microphones are electronic devices that convert sound waves into electrical signals. This conversion allows for various applications, including storing, transmitting, and rebroadcasting audio. Microphones come in a wide range of designs to suit different needs. There are large boom-style microphones, commonly used in professional recording studios and broadcasting settings, known for their high-quality audio capture. On the other hand, there are smaller and more popular MEMS (MicroElectroMechanical System) microphones, often found in consumer electronics like smartphones and wearable devices due to their compact size and efficiency. These microphones are differentiated by several factors. Impedance refers to the electrical resistance of the microphone's output signal and impacts its compatibility with different audio systems. Voltage rating determines the maximum voltage that can be applied to the microphone without causing damage. Sensitivity refers to the microphone's ability to capture sound accurately and is usually measured in decibels per Pascal (dB/Pa). The frequency range indicates the range of frequencies the microphone can effectively capture, ensuring accurate reproduction of different audio sources. Port location refers to the placement of the microphone's input or output ports, which can affect its suitability for specific applications. Overall size and mounting type play a role in determining the microphone's physical form, making it suitable for different setups and installations. Additionally, microphones offer various output interfaces to connect with audio systems. Analog output interfaces provide a continuous electrical signal that corresponds to the captured sound. I2S (Inter-IC Sound), PDM (Pulse-Density Modulation), and TDM (Time-Division Multiplexing) are digital output interfaces that allow for efficient transmission of audio data between microphones and other devices. By considering these factors, individuals and professionals can choose the right microphone to meet their specific requirements, ensuring optimal sound capture and quality in various applications.