X2Y® Series, Ceramic Capacitors

Results:
283
Manufacturer
Series
Capacitance
Size / Dimension
Thickness (Max)
Voltage - Rated
Package / Case
Tolerance
Temperature Coefficient
Operating Temperature
Features
Applications
Height - Seated (Max)
Lead Spacing
Mounting Type
Ratings
Failure Rate
Lead Style
Results remaining283
Applied Filters:
X2Y®
Select
ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)Operating TemperatureRatingsPackage / CaseVoltage - RatedTemperature CoefficientCapacitanceToleranceMounting TypeSeriesApplicationsFeaturesLead StyleFailure RateSize / DimensionThickness (Max)Lead Spacing
EMCP500G5R6D1GV001T
CAP CER 5.6PF 50V C0G/NP0 0603
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
C0G, NP0
5.6 pF
±0.5pF
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCT101G100M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
10 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMCT100W184M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
10V
X7R
0.18 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMCT101G270M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
27 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMCP101W221M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
X7R
220 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMDD500G102M1GV001E
CAP CER 1000PF 50V C0G/NP0 1206
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
1206 (3216 Metric)
50V
C0G, NP0
1000 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.124" L x 0.063" W (3.15mm x 1.60mm)
0.050" (1.27mm)
-
EMDD100W474M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
1206 (3216 Metric)
10V
X7R
0.47 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.124" L x 0.063" W (3.15mm x 1.60mm)
0.050" (1.27mm)
-
EMDK500W404M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
1410 (3524 Metric)
50V
X7R
0.4 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.140" L x 0.098" W (3.56mm x 2.49mm)
0.070" (1.78mm)
-
EMCP160X224M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 85°C
-
0603 (1608 Metric)
16V
X5R
0.22 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP101G330M1GV001T
CAP CER 33PF 100V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
C0G, NP0
33 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCF500G1R8D1GV001T
CAP CER 1.8PF 50V C0G/NP0 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
C0G, NP0
1.8 pF
±0.5pF
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
EMCT101G121M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
120 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMCT101G101M1GV001E
CAP CER 100PF 100V C0G/NP0 0805
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
100 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMCF500W471M1GV001T
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
X7R
470 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
EMCT101W222M1GV001E
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
X7R
2200 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
EMDF101W224M1GV001E
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
1210 (3225 Metric)
100V
X7R
0.22 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.125" L x 0.098" W (3.18mm x 2.49mm)
0.070" (1.78mm)
-
EMCP500W222M1GV001T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
X7R
2200 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP101G470M1GV001T
CAP CER 47PF 100V C0G/NP0 0603
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
C0G, NP0
47 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMDD101W223M1GV001E
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
1206 (3216 Metric)
100V
X7R
0.022 µF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.124" L x 0.063" W (3.15mm x 1.60mm)
0.050" (1.27mm)
-
EMCT101G470M1GV001E
CAP CER 47PF 100V C0G/NP0 0805
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
-
0805 (2012 Metric)
100V
C0G, NP0
47 pF
±20%
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.