Ceramic Capacitors

Results:
558
Series
Capacitance
Thickness (Max)
Size / Dimension
Voltage - Rated
Package / Case
Applications
Tolerance
Temperature Coefficient
Ratings
Features
Operating Temperature
Height - Seated (Max)
Lead Spacing
Mounting Type
Lead Style
Failure Rate
Results remaining558
Applied Filters:
Johanson Dielectrics Inc.
Select
ImageProduct DetailPriceAvailabilityECAD ModelHeight - Seated (Max)ToleranceCapacitanceOperating TemperatureRatingsPackage / CaseVoltage - RatedTemperature CoefficientMounting TypeSeriesApplicationsFeaturesLead StyleFailure RateSize / DimensionThickness (Max)Lead Spacing
EMCT250W104M1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.1 µF
-55°C ~ 125°C
-
0805 (2012 Metric)
25V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
SCEF502W472K4GV001E
CAP CER 4700PF 250VAC X7R 2220
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
4700 pF
-55°C ~ 125°C
X1, Y2
2220 (5750 Metric)
250VAC
X7R
Surface Mount, MLCC
SC-BME
Safety
-
-
-
0.225" L x 0.200" W (5.72mm x 5.08mm)
0.150" (3.81mm)
-
SCDP302W152K4GV001E
CAP CER 1500PF 250VAC X7R 1808
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
1500 pF
-55°C ~ 125°C
X2
1808 (4520 Metric)
250VAC
X7R
Surface Mount, MLCC
SC-BME
Safety
-
-
-
0.185" L x 0.080" W (4.70mm x 2.03mm)
0.085" (2.16mm)
-
SCDP302W102K4GV001E
CAP CER 1000PF 250VAC X7R 1808
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
1000 pF
-55°C ~ 125°C
X2
1808 (4520 Metric)
250VAC
X7R
Surface Mount, MLCC
SC-BME
Safety
-
-
-
0.185" L x 0.080" W (4.70mm x 2.03mm)
0.085" (2.16mm)
-
TDCT500W103K1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
10000 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
X7R
Surface Mount, MLCC
SMD-PME
General Purpose
-
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.050" (1.27mm)
-
EMCP500W471M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
470 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP500W472M1GV001T
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
4700 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP101W222M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
2200 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
100V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP500G100M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
10 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
C0G, NP0
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCF500W472M1GV001T
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
4700 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.045" L x 0.025" W (1.14mm x 0.64mm)
0.020" (0.51mm)
-
EMCT500W103M1GV001E
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±20%
10000 pF
-55°C ~ 125°C
-
0805 (2012 Metric)
50V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.080" L x 0.050" W (2.03mm x 1.27mm)
0.040" (1.02mm)
-
TDCF250W102K1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
1000 pF
-55°C ~ 125°C
-
0402 (1005 Metric)
25V
X7R
Surface Mount, MLCC
SMD-PME
General Purpose
-
-
-
0.040" L x 0.020" W (1.02mm x 0.51mm)
0.025" (0.64mm)
-
TDCP500W472K1GV001T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
±10%
4700 pF
-55°C ~ 125°C
-
0603 (1608 Metric)
50V
X7R
Surface Mount, MLCC
SMD-PME
General Purpose
-
-
-
0.063" L x 0.032" W (1.60mm x 0.81mm)
0.035" (0.89mm)
-
EMCP250W223M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.022 µF
-55°C ~ 125°C
-
0603 (1608 Metric)
25V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP100W104M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.1 µF
-55°C ~ 125°C
-
0603 (1608 Metric)
10V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
EMCP160W473M1GV001T
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±20%
0.047 µF
-55°C ~ 125°C
-
0603 (1608 Metric)
16V
X7R
Surface Mount, MLCC
X2Y®
Bypass, Decoupling
Low ESL (X2Y)
-
-
0.064" L x 0.035" W (1.63mm x 0.89mm)
0.026" (0.66mm)
-
VPDD202G101J1GV001E
CAP CER 100PF 2KV C0G/NP0 1206
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±5%
100 pF
-55°C ~ 125°C
-
1206 (3216 Metric)
2000V (2kV)
C0G, NP0
Surface Mount, MLCC
HVS-PME
SMPS Filtering
High Voltage
-
-
0.125" L x 0.062" W (3.18mm x 1.57mm)
0.067" (1.70mm)
-
TCDD6R3X226K1GV001E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
±10%
22 µF
-55°C ~ 85°C
-
1206 (3216 Metric)
6.3V
X5R
Surface Mount, MLCC
TANCERAM®
SMPS Filtering
-
-
-
0.125" L x 0.062" W (3.17mm x 1.57mm)
0.070" (1.78mm)
-
RLDM102W122K3QN001T
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Quantity
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PCB Symbol, Footprint & 3D Model
0.222" (5.64mm)
±10%
1200 pF
-55°C ~ 125°C
-
Radial
1000V (1kV)
X7R
Through Hole
SMPS T-BME
General Purpose
High Voltage
Straight
-
0.250" L x 0.270" W (6.35mm x 6.86mm)
-
0.170" (4.32mm)
RLDM102G391J3QN001T
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Quantity
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PCB Symbol, Footprint & 3D Model
0.222" (5.64mm)
±5%
390 pF
-55°C ~ 125°C
-
Radial
1000V (1kV)
C0G, NP0
Through Hole
SMPS T-BME
General Purpose
High Voltage
Straight
-
0.250" L x 0.270" W (6.35mm x 6.86mm)
-
0.170" (4.32mm)

About  Ceramic Capacitors

Capacitors are essential passive electronic components that have the ability to store electric charge. Ceramic capacitors, specifically, are constructed using alternating layers of ceramic material as the dielectric and metal layers as the non-polarized electrodes. Ceramic capacitors find extensive use in various applications such as automotive electronics, bypassing, decoupling, filtering, radio frequency (RF) circuits, and electrostatic discharge (ESD) protection. They are particularly valued for their compact size, high capacitance values, and excellent performance across a wide range of frequencies. Through-hole versions of ceramic capacitors are commonly found in disc or "blob" shapes, featuring two wire leads for easy insertion into circuit boards. This form factor allows for convenient soldering and secure mechanical connection. Ceramic capacitors offer numerous advantages, including high reliability, low cost, and stability under different environmental conditions. The dielectric material used in these capacitors determines their temperature coefficient and voltage characteristics. Manufacturers typically provide datasheets specifying the capacitance values, voltage ratings, tolerances, and other important parameters to aid in proper selection and implementation. In summary, ceramic capacitors are widely used in electronics for various purposes such as automotive applications, signal filtering, and ESD protection. They consist of alternating layers of ceramic and metal, with through-hole versions having a disc or blob-like shape and two wire leads for easy integration into circuit boards. These capacitors exhibit excellent performance, compact size, and reliability, making them a popular choice in electronic designs.