Aries Electronics, Inc.

Aries Electronics, Inc.

Aries Electronics, Inc. is a renowned manufacturer of a broad spectrum of interconnect products and services, specializing in the development of high-performance adapters, connectors, and sockets for electronic applications. The company’s comprehensive range of offerings includes custom and standard connectors, as well as a variety of programming and testing sockets designed to cater to the needs of diverse industries such as telecommunications, aerospace, military, and medical technology. Aries Electronics is recognized for its commitment to providing top-quality, reliable solutions, often customized to meet the unique requirements of its clients. With a dedication to innovation and precision engineering, the company consistently delivers products that adhere to industry standards while pioneering new technological advancements. Additionally, Aries Electronics places significant emphasis on customer satisfaction, offering tailored support and consultation services to ensure seamless integration of their products. As a trusted leader in the field, Aries Electronics continues to drive progress and set the standard for excellence in electronic interconnect solutions.

IC Sockets

Results:
4,324
Series
Operating Temperature
Type
Contact Material - Post
Number of Positions or Pins (Grid)
Contact Finish Thickness - Post
Contact Finish - Post
Features
Housing Material
Contact Finish Thickness - Mating
Termination
Contact Material - Mating
Contact Finish - Mating
Mounting Type
Pitch - Post
Pitch - Mating
Results remaining4,324
Applied Filters:
Aries Electronics, Inc.
Select
ImageProduct DetailPriceAvailabilityECAD ModelPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostHousing MaterialNumber of Positions or Pins (Grid)Operating TemperatureSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish - PostContact Finish Thickness - PostContact Material - Post
169-PRS13001-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
114-PRS13021-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
144-PLS15026-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
144-PRS15026-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
181-PLS15003-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
223-PLS18039-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
225-PLS15001-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
289-PLS17001-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
34-PRS17034-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
68-PRS11033-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
84-PRS11032-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
22-4501-21
CONN IC DIP SOCKET 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (2 x 11)
-55°C ~ 125°C
501
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
Gold
10.0µin (0.25µm)
Phosphor Bronze
22-4501-31
CONN IC DIP SOCKET 22POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Polyamide (PA46), Nylon 4/6, Glass Filled
22 (2 x 11)
-55°C ~ 125°C
501
DIP, 0.4" (10.16mm) Row Spacing
10.0µin (0.25µm)
Phosphor Bronze
Closed Frame
Gold
10.0µin (0.25µm)
Phosphor Bronze
144-PRS12001-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
60-1518-10
CONN IC DIP SOCKET 60POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyamide (PA46), Nylon 4/6, Glass Filled
60 (2 x 30)
-
518
DIP, 0.2" (5.08mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
Tin
200.0µin (5.08µm)
Brass
181-PGM18041-10
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyamide (PA46), Nylon 4/6, Glass Filled
-
-55°C ~ 105°C
PGM
PGA
10.0µin (0.25µm)
Beryllium Copper
-
Tin
200.0µin (5.08µm)
Brass
68-PLS13117-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
68-PRS13117-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
181-PLS15006-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PLS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
181-PRS15003-16
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Polyphenylene Sulfide (PPS)
-
-65°C ~ 200°C
PRS
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.