IC Sockets

Results:
24,020
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining24,020
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperaturePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Mounting TypeTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
1-345830-1
CONN IC DIP SOCKET 16POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
-
-
-
-
16 (2 x 8)
Through Hole, Right Angle, Vertical
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
-
Closed Frame
-
-
1437508-6
CONN TRANSIST TO-5 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
8058
-55°C ~ 125°C
-
Gold
Solder
-
Gold
Polytetrafluoroethylene (PTFE)
8 (Round)
Through Hole
Transistor, TO-5
-
Beryllium Copper
Closed Frame
-
Brass
1437538-2
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Quantity
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PCB Symbol, Footprint & 3D Model
800
-55°C ~ 105°C
0.100" (2.54mm)
-
Solder
0.100" (2.54mm)
-
Polyester
28 (2 x 14)
Through Hole
DIP, 0.6" (15.24mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
1437542-6
CONN IC DIP SOCKET 6POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
700
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Aluminum Alloy
6 (2 x 3)
Through Hole
DIP, 0.3" (7.62mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
2-1437530-7
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Quantity
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PCB Symbol, Footprint & 3D Model
500
-
0.100" (2.54mm)
-
Solder
0.100" (2.54mm)
-
Thermoplastic
7 (1 x 7)
Through Hole
SIP
-
Beryllium Copper
-
-
Beryllium Copper
3-1437530-2
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Quantity
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PCB Symbol, Footprint & 3D Model
500
-
0.100" (2.54mm)
-
Solder
0.100" (2.54mm)
-
Thermoplastic
15 (1 x 15)
Through Hole
SIP
-
Beryllium Copper
-
-
Beryllium Copper
3-1437537-0
CONN IC DIP SOCKET 14POS TINLEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
800
-55°C ~ 105°C
0.100" (2.54mm)
Tin-Lead
Solder
0.100" (2.54mm)
-
Polyester
14 (2 x 7)
Surface Mount
DIP, 0.3" (7.62mm) Row Spacing
-
Copper Alloy
Open Frame
-
-
4-1437532-3
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Quantity
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PCB Symbol, Footprint & 3D Model
500
-
0.100" (2.54mm)
-
-
0.100" (2.54mm)
-
-
28 (2 x 14)
Through Hole
DIP, 0.6" (15.24mm) Row Spacing
-
-
Closed Frame
-
-
5-1437542-8
CONN IC DIP SOCKET 32POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
700
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Aluminum Alloy
32 (2 x 16)
Through Hole
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
6-1437531-6
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Quantity
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PCB Symbol, Footprint & 3D Model
500
-55°C ~ 105°C
0.100" (2.54mm)
-
Solder
0.100" (2.54mm)
-
-
18 (2 x 9)
Through Hole
DIP, 0.3" (7.62mm) Row Spacing
-
Copper Alloy
Closed Frame
-
Copper Alloy
169-PRS13001-16
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Quantity
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PCB Symbol, Footprint & 3D Model
PRS
-65°C ~ 200°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Nickel Bronze
Polyphenylene Sulfide (PPS)
-
Through Hole
PGA, ZIF (ZIP)
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
50.0µin (1.27µm)
Beryllium Copper
2-5916783-6
CONN SOCKET PGA ZIF 370POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Liquid Crystal Polymer (LCP)
370 (19 x 19)
Through Hole
PGA, ZIF (ZIP)
15.0µin (0.38µm)
Copper Alloy
Open Frame
15.0µin (0.38µm)
Copper Alloy
2-5916783-8
CONN SOCKET PGA ZIF 370POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Liquid Crystal Polymer (LCP)
370 (19 x 19)
Through Hole
PGA, ZIF (ZIP)
Flash
Copper Alloy
Open Frame
Flash
Copper Alloy
69802-452LF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-55°C ~ 125°C
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
52 (4 x 13)
Surface Mount
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
210-88-316-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
210-88-422-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
210-88-628-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
210-88-632-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
210-88-964-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
223-33-306-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.