IC Sockets

Results:
24,020
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining24,020
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypeMounting TypeFeaturesOperating TemperaturePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialNumber of Positions or Pins (Grid)Contact Finish Thickness - MatingContact Material - MatingContact Finish Thickness - PostContact Material - Post
223-33-308-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
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223-33-314-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
223
DIP, 0.3" (7.62mm) Row Spacing
Through Hole
Closed Frame
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Wire Wrap
0.100" (2.54mm)
Gold
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14 (2 x 7)
30.0µin (0.76µm)
Beryllium Copper
30.0µin (0.76µm)
Brass Alloy
223-33-318-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
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223-33-320-41-101000
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Quantity
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PCB Symbol, Footprint & 3D Model
*
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0475940002
CONN SOCKET LGA 1366POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
47594
LGA
Surface Mount
Open Frame
-
0.040" (1.02mm)
Gold
Solder
0.040" (1.01mm)
-
Liquid Crystal Polymer (LCP)
1366 (32 x 41)
30.0µin (0.76µm)
Copper Alloy
-
-
0475960132
CONN SOCKET LGA 1156POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
47596
LGA
Surface Mount
Open Frame
-
0.036" (0.91mm)
Gold
Solder
0.036" (0.91mm)
-
Thermoplastic
1156 (40 x 40)
15.0µin (0.38µm)
Copper Alloy
-
-
0475960233
CONN SOCKET LGA 1155POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
47596
LGA
Surface Mount
Open Frame
-
0.036" (0.91mm)
Gold
Solder
0.036" (0.91mm)
-
Thermoplastic
1155 (40 x 40)
30.0µin (0.76µm)
Copper Alloy
-
-
233-32
CONN SOCKET PLCC 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
PLCC
Through Hole
Closed Frame
-55°C ~ 105°C
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polybutylene Terephthalate (PBT), Glass Filled
32 (4 x 8)
-
Phosphor Bronze
-
Phosphor Bronze
241-48-1-06
CONN IC DIP SOCKET 48POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
DIP, 0.6" (15.24mm) Row Spacing
Through Hole
Open Frame
-40°C ~ 105°C
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polybutylene Terephthalate (PBT), Glass Filled
48 (2 x 24)
60.0µin (1.52µm)
Phosphor Bronze
60.0µin (1.52µm)
Phosphor Bronze
XR2D-2401-N
CONN IC DIP SOCKET 24POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
XR2
DIP, 0.6" (15.24mm) Row Spacing
Through Hole
Carrier
-55°C ~ 125°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
Polybutylene Terephthalate (PBT), Glass Filled
24 (2 x 12)
29.5µin (0.75µm)
Beryllium Copper
29.5µin (0.75µm)
Beryllium Copper
7-1437535-2
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SIP
Through Hole
Closed Frame
-
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin-Lead
Thermoplastic
16 (1 x 16)
10.0µin (0.25µm)
Beryllium Copper
10.0µin (0.25µm)
Brass
D83028B-46R
CONN SOCKET PLCC 28POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
PLCC
Surface Mount
Board Guide, Closed Frame
-50°C ~ 105°C
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
28 (4 x 7)
-
Phosphor Bronze
-
Phosphor Bronze
D83032B-46R
CONN SOCKET PLCC 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
PLCC
Surface Mount
Board Guide, Closed Frame
-50°C ~ 105°C
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
32 (4 x 8)
-
Phosphor Bronze
-
Phosphor Bronze
D83068B-46R
CONN SOCKET PLCC 68POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
PLCC
Surface Mount
Board Guide, Closed Frame
-50°C ~ 105°C
0.050" (1.27mm)
Tin
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
68 (4 x 17)
-
Phosphor Bronze
-
Phosphor Bronze
5-2013620-2
CONN SOCKET PGA ZIF 989POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
PGA, ZIF (ZIP)
Surface Mount
Open Frame
-
0.039" (1.00mm)
Gold
Solder
0.039" (1.00mm)
Tin-Lead
Thermoplastic
989 (35 x 36)
15.0µin (0.38µm)
Copper Alloy
15.0µin (0.38µm)
Copper Alloy
9-1437504-9
CONN SOCKET TRANSIST TO-3 3POS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Transistor, TO-3
Chassis Mount
Closed Frame
-55°C ~ 125°C
-
Gold
Solder
-
Nickel
Diallyl Phthalate (DAP)
3 (Oval)
30.0µin (0.76µm)
Beryllium Copper
50.0µin (1.27µm)
Beryllium Copper
APA-314-T-D
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Quantity
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PCB Symbol, Footprint & 3D Model
APA
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polybutylene Terephthalate (PBT), Glass Filled
14 (2 x 7)
-
Phosphor Bronze
-
Phosphor Bronze
540-88-084-17-400-2
CONN SOCKET PLCC 84POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
540
PLCC
Surface Mount
Board Guide, Closed Frame
-
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
Polyphenylene Sulfide (PPS)
84 (4 x 21)
-
Phosphor Bronze
-
Phosphor Bronze
114-PRS13021-16
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Quantity
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PCB Symbol, Footprint & 3D Model
PRS
PGA, ZIF (ZIP)
Through Hole
Closed Frame
-65°C ~ 200°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Nickel Bronze
Polyphenylene Sulfide (PPS)
-
30.0µin (0.76µm)
Beryllium Copper
50.0µin (1.27µm)
Beryllium Copper
144-PLS15026-16
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Quantity
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PCB Symbol, Footprint & 3D Model
PLS
PGA, ZIF (ZIP)
Through Hole
Closed Frame
-65°C ~ 200°C
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Nickel Bronze
Polyphenylene Sulfide (PPS)
-
30.0µin (0.76µm)
Beryllium Copper
50.0µin (1.27µm)
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.