IC Sockets

Results:
24,020
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining24,020
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialOperating TemperatureNumber of Positions or Pins (Grid)TypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
1-390263-4
CONN IC DIP SOCKET 40POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
-40°C ~ 105°C
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Phosphor Bronze
DIP050-628-160BLF
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
28 (2 x 14)
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
1-1903401-4
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.050" (1.27mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Thermoplastic
-
638 (26 x 26)
PGA
Flash
Copper Alloy
Open Frame
-
Copper Alloy
2-382568-5
CONN IC DIP SOCKET 24POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
Diplomate DL
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
-55°C ~ 105°C
24 (2 x 12)
DIP, 0.6" (15.24mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
7-1437536-1
CONN IC DIP SOCKET 36POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
-
-55°C ~ 125°C
36 (2 x 18)
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Brass
1571551-2
CONN IC DIP SOCKET 8POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
8 (2 x 4)
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Nickel
1571552-5
CONN IC DIP SOCKET 18POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
800
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
18 (2 x 9)
DIP, 0.3" (7.62mm) Row Spacing
-
Beryllium Copper
Open Frame
-
Copper
643643-6
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Quantity
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PCB Symbol, Footprint & 3D Model
Diplomate DL
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
Thermoplastic, Glass Filled
-55°C ~ 105°C
11 (1 x 11)
SIP
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
7-1437537-6
CONN IC DIP SOCKET 20POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
800
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
Polyester
-55°C ~ 105°C
20 (2 x 10)
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Copper Alloy
Open Frame
-
-
6-1437542-2
CONN IC DIP SOCKET 40POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
700
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Aluminum Alloy
-55°C ~ 125°C
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
20.0µin (0.51µm)
Beryllium Copper
Carrier, Closed Frame
20.0µin (0.51µm)
Beryllium Copper
7-1437532-8
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
-
Through Hole
Wire Wrap
0.100" (2.54mm)
-
-
-
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
-
-
Closed Frame
-
-
540AG12DES
CONN IC DIP SOCKET 40POS TINLEAD
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
-
-
-55°C ~ 105°C
40 (2 x 20)
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Brass
9-1437530-5
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
Thermoplastic
-
12 (1 x 12)
SIP
-
Beryllium Copper
-
-
Beryllium Copper
1437504-7
CONN TRANSIST TO-5 8POS GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
8060
-
Gold
Through Hole
Solder
-
Gold
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
8 (Round)
Transistor, TO-5
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
2-1437531-5
CONN IC DIP SOCKET 14POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
-55°C ~ 105°C
14 (2 x 7)
DIP, 0.3" (7.62mm) Row Spacing
-
Copper Alloy
Closed Frame
-
Copper Alloy
D83020B-46R
CONN SOCKET PLCC 20POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
20 (4 x 5)
PLCC
-
Phosphor Bronze
Board Guide, Closed Frame
-
Phosphor Bronze
D83044B-46R
CONN SOCKET PLCC 44POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
44 (4 x 11)
PLCC
-
Phosphor Bronze
Board Guide, Closed Frame
-
Phosphor Bronze
D84032B-46R
CONN SOCKET PLCC 32POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
D830
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
32 (4 x 8)
PLCC
-
Phosphor Bronze
Board Guide, Closed Frame
-
Phosphor Bronze
5-1437504-0
CONN SOCKET TRANSIST TO-3 3POS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Silver
Chassis Mount
Solder
-
Silver
Diallyl Phthalate (DAP)
-55°C ~ 125°C
3 (Oval)
Transistor, TO-3
500.0µin (12.70µm)
Beryllium Copper
Closed Frame
-
Beryllium Copper
5-6437504-5
CONN SOCKET TRANSIST TO-3 3POS
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Gold
Chassis Mount
Solder
-
Gold
Phenolic
-55°C ~ 125°C
3 (Oval)
Transistor, TO-3
-
Beryllium Copper
Closed Frame
-
Beryllium Copper

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.