IC Sockets

Results:
24,020
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
Results remaining24,020
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Operating TemperatureTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
808-AG11D-ESL-LF
1+
¥0.9500
5+
¥0.8972
10+
¥0.8444
Quantity
4,008 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
800
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
8 (2 x 4)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Open Frame
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8444-21B1-RK-TP
CONN SOCKET PLCC 44POS TIN
1+
¥3.0000
5+
¥2.8333
10+
¥2.6667
Quantity
2,773 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
8400
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
44 (4 x 11)
-40°C ~ 105°C
PLCC
160.0µin (4.06µm)
Copper Alloy
Closed Frame
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
110-44-640-41-001000
1+
¥4.5000
5+
¥4.2500
10+
¥4.0000
Quantity
2,594 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
110
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
-55°C ~ 125°C
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
940-44-084-24-000000
1+
¥4.6750
5+
¥4.4153
10+
¥4.1556
Quantity
368 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
940
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
84 (4 x 21)
-55°C ~ 125°C
PLCC
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571552-6
824-AG31D-ESL-LF=800 DIP GF/SN
1+
¥2.8500
5+
¥2.6917
10+
¥2.5333
Quantity
10 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
1051900001
TOP-MOUNT CAMERA SOCKET FOR SMIA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
105190
0.033" (0.85mm)
Gold
Surface Mount
Solder
0.033" (0.85mm)
Gold
12 (2 x 6)
-55°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Phosphor Bronze Alloy
Open Frame
Flash
Phosphor Bronze Alloy
Thermoplastic
1051670001
SMIA65 TOP MNT CAMERA SOCKET
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
105167
0.037" (0.95mm)
Gold
Surface Mount
Solder
-
Gold
12 (2 x 6)
-55°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Copper Alloy
Open Frame
Flash
Copper Alloy
Thermoplastic
1051990001
CONN CAM SOCKET 34POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
105199
0.024" (0.60mm)
Gold
Surface Mount
Solder
0.024" (0.60mm)
-
34 (2 x 8, 2 x 9)
-30°C ~ 85°C
Camera Socket
12.0µin (0.30µm)
Copper Alloy
Closed Frame
-
Copper Alloy
Plastic
1051420132
CONN SOCKET LGA 2011POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
105142
0.040" (1.02mm)
Gold
Surface Mount
Solder
0.040" (1.01mm)
-
2011 (47 x 58)
-
LGA
15.0µin (0.38µm)
Copper Alloy
Open Frame
-
-
Thermoplastic
1-382568-6
CONN IC DIP SOCKET 16POS TIN
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Quantity
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PCB Symbol, Footprint & 3D Model
Diplomate DL
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
-55°C ~ 105°C
DIP, 0.3" (7.62mm) Row Spacing
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
Thermoplastic, Glass Filled
1-1571551-2
CONN IC DIP SOCKET 40POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571551-5
CONN IC DIP SOCKET 18POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
18 (2 x 9)
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
Flash
Beryllium Copper
Closed Frame
Flash
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-1
CONN IC DIP SOCKET 6POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
6 (2 x 3)
-55°C ~ 125°C
DIP, 0.3" (7.62mm) Row Spacing
25.0µin (0.63µm)
Beryllium Copper
Closed Frame
25.0µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
6-1437539-3
CONN IC DIP SOCKET 22POS GOLD
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
800
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
-
22 (2 x 11)
-55°C ~ 105°C
DIP, 0.4" (10.16mm) Row Spacing
5.00µin (0.127µm)
Copper Alloy
Open Frame
-
-
Polyester
643648-8
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Diplomate DL
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
-55°C ~ 105°C
SIP
-
Phosphor Bronze
Closed Frame
-
Phosphor Bronze
Thermoplastic, Glass Filled
8-1437532-2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
-
Through Hole
Wire Wrap
0.100" (2.54mm)
-
40 (2 x 20)
-
DIP, 0.6" (15.24mm) Row Spacing
-
-
Closed Frame
-
-
-
3-1437530-3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
16 (1 x 16)
-
SIP
-
Beryllium Copper
-
-
Beryllium Copper
Thermoplastic
4-1437530-7
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
3 (1 x 3)
-
SIP
-
Beryllium Copper
-
-
Beryllium Copper
Thermoplastic
2-641614-4
CONN IC DIP SOCKET 24POS GOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Diplomate DL
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
24 (2 x 12)
-
DIP, 0.6" (15.24mm) Row Spacing
15.0µin (0.38µm)
Phosphor Bronze
Open Frame
15.0µin (0.38µm)
Phosphor Bronze
-
6-1437536-1
CONN IC DIP SOCKET 28POS TIN
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
500
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
-
28 (2 x 14)
-55°C ~ 105°C
DIP, 0.6" (15.24mm) Row Spacing
-
Beryllium Copper
Closed Frame
-
Brass
-

About  IC Sockets

Sockets play a crucial role in facilitating the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within a circuit. They provide a secure and adaptable interface for these electronic components, allowing for easy maintenance and upgrades. Sockets are available in various mounting types, including chassis, panel, connector, board surface, and through-hole, offering flexibility in their installation and use across different electronic systems. Each mounting type caters to specific application requirements, ensuring compatibility and reliable performance. In addition to mounting types, socket features include board guides, carriers, flanges, open framing, and closed framing, which contribute to the stability, alignment, and protection of the inserted ICs or transistors. These features are designed to enhance the overall functionality and reliability of the sockets in diverse operating environments. Furthermore, sockets are differentiated by post pitch, contact material and finish, termination style, and contact finish, allowing for customization based on specific electrical and mechanical requirements. The variation in these attributes ensures that sockets can accommodate a wide range of ICs and transistors with different specifications and configurations. By considering factors such as post pitch, contact material, termination style, and contact finish, users can select sockets that best suit their application needs, ensuring optimal electrical performance and mechanical compatibility. In summary, sockets serve as essential components for enabling the flexible and reliable integration of ICs and transistors within electronic circuits. Their diverse mounting types, features, and customization options make them indispensable for applications requiring frequent component insertion, removal, and replacement.