LED Thermal Products

Results:
410
Manufacturer
Series
For Use With/Related Products
Type
Shape
Operating Temperature
Applications
Response Time
Current Rating (Amps)
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Breaking Capacity @ Rated Voltage
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Size / Dimension
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Results remaining410
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypeFor Use With/Related ProductsShape
LP0001/01-LI2000A-0.2
STAR THERMAL PAD LED STAR BRD
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LED Star Board
Star
PG1W-012-060-07
ROUND FANSINK CREE CXA 20/25
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Fansink
Cree CXA 20/25
Round
NX501105
ROUND HEAT SINK BRIDGELUX LEDIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Heat Sink
-
Round
NX300159
ROUND HEAT SINK BRIDGELUX VERO
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Quantity
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PCB Symbol, Footprint & 3D Model
SynJet®
Heat Sink
Bridgelux Vero 29, Molex Helieon, Philips Twistable, Zhaga B2
Round
NX301117
ROUND HEAT SINK BRIDGELUX VERO
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Quantity
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PCB Symbol, Footprint & 3D Model
SynJet®
Heat Sink
Bridgelux Vero 29
Round
LP0002/01-PC99-0.12
SQUARE THERMAL PAD LED SQUARE
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LED Square 25.4mm Board Module
Square
TG-CPCB1
STAR THERM CLAD BOARD LED SERIES
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Thermal Clad Board
LUXEON LED Series
Star
HP30S-CALBL-002
RND HEAT SINK FORTIMO LED TDLM
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Quantity
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PCB Symbol, Footprint & 3D Model
SynJet®
Heat Sink
Fortimo Twistable LED TDLM
Round
2154168-1
RECT HEAT SINK LN24 INTEMATIX
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Quantity
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PCB Symbol, Footprint & 3D Model
Nevalo
Heat Sink
LN24, Intematix
Rectangular
LP0006/01-TG-A373F-0.25-2A
THERM PAD LUXEON LXK8-PWXX-0024
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LUXEON LXK8-PWxx-0024
-
19758-M
ROUND HEAT SINK BRIDGELUX LED
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Quantity
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PCB Symbol, Footprint & 3D Model
19000
Heat Sink
Bridgelux LED Light Engines
Round
LP0003/01-LI2000-0.15
THERM PAD LUXEON LXK8-PWXX-0004
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LUXEON LXK8-PWxx-0004
-
LP0004/01-TG-A373F-0.3-2A
THERM PAD LUXEON LXK8-PWXX-0008
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LUXEON LXK8-PWxx-0008
-
803129
STAR THERM CLAD BOARD SEOUL SEMI
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal Clad® IMS®
Thermal Clad Board
Seoul Semiconductor Z-Power
Star
LP0003/01-TG-A373F-0.3-2A
THERM PAD LUXEON LXK8-PWXX-0004
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LUXEON LXK8-PWxx-0004
-
LP0007/01-LI98-0.15
THERMAL PAD LUXEON H14/H24
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Quantity
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PCB Symbol, Footprint & 3D Model
LP
Thermally Conductive Pad
LUXEON H14 and H24
-
DUALLED-6850
LED FAN HEAT SINK 68X50MM
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Quantity
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PCB Symbol, Footprint & 3D Model
DUAL LED
Heat Sink
LED Modules
Round
DUALLED-5850
LED FAN HEAT SINK 58X50MM
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Quantity
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PCB Symbol, Footprint & 3D Model
DUAL LED
Heat Sink
LED Modules
Round
NX300100
ROUND HEAT SINK SPOTLIGHTS
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Quantity
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PCB Symbol, Footprint & 3D Model
SynJet®
Heat Sink
Spotlights
Round
19755-XXL
ROUND HEAT SINK BRIDGELUX LED
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Quantity
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PCB Symbol, Footprint & 3D Model
19000
Heat Sink
Bridgelux LED Light Engines
Round

LED Thermal Products

LED thermal products are specifically engineered to effectively dissipate heat generated by LED components. These products employ various methods to efficiently transfer heat away from the LEDs, ensuring optimal performance and longevity. One common approach is to utilize a heat sink, which can come in different shapes such as rectangular, round, square, or star configurations. The heat sink provides a larger surface area for heat dissipation and often incorporates fins or ridges to enhance thermal conductivity. By placing the LED component on the heat sink, the heat generated during operation can be effectively conducted away from the LED junction, preventing excessive temperature buildup. Another method involves using a thermal clad board or a thermally conductive pad. These materials possess high thermal conductivity properties and are designed to facilitate the transfer of heat away from the LED. By placing the LED component on a thermal clad board or applying a thermally conductive pad between the LED and the mounting surface, heat can be efficiently transferred away from the LED, ensuring optimal thermal management. In addition, some LED thermal products may incorporate fan sinks, which combine a heat sink with an integrated fan. The fan enhances heat dissipation by actively blowing air over the heat sink, accelerating the cooling process. By employing these various thermal management techniques, LED thermal products effectively mitigate the heat generated by LED components, preventing performance degradation and extending the lifespan of the LEDs. In summary, LED thermal products encompass a range of solutions designed to dissipate heat generated by LED components. These products employ heat sinks, thermal clad boards, thermally conductive pads, and fan sinks to efficiently transfer heat away from the LEDs, ensuring optimal performance and longevity.