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Zynq® UltraScale+™ Series, Microcontrollers, Microprocessor, FPGA Modules
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Zynq® UltraScale+™
Select | Image | Product Detail | Price | Availability | ECAD Model | Operating Temperature | Series | Size / Dimension | Speed | Module/Board Type | Co-Processor | Flash Size | RAM Size | Connector Type | Core Processor |
|---|
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | MPU Core | - | 256MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 3.543" L x 2.559" W (90.00mm x 65.00mm) | 1.3GHz | MPU Core | ARM® Cortex®-A53 | 512MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E | ||
 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 4.330" L x 2.950" W (110.00mm x 75.00mm) | 1.5GHz, 600MHz | MPU, FPG | ARM® Mali 400 MP2 | 8GB eMMC | 4GB, 1GB | 2 x 240 Pin | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU5EV-1SFVC784I | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU2EG-1SFVC784E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ ZU2CG | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU3CG-1SFVC784E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU4CG-1SFVC784E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU3EG-1SFVC784E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 4.724" L x 4.724" W (120.00mm x 120.00mm) | - | MPU Core | - | 128MB | 16GB | 2 x 400 Pin | Zynq UltraScale+ ZU11EG-1I | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ ZU4CG-1E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ ZU3EG-1E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | MPU Core | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | Zynq UltraScale+ XCZU4EV-1SFVC784E | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ ZU3EG-1I | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | MPU Core | - | 128MB | 4GB | Board-to-Board (BTB) Socket | Zynq™ UltraScale+™ ZU4EV | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 2.047" L x 2.992" W (52.00mm x 76.00mm) | - | FPGA | Zynq-7000 (Z-7030) | 64MB | 1GB | Board-to-Board (BTB) Socket | ARM® Cortex®-A9 | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 85°C | Zynq® UltraScale+™ | 2.047" L x 2.992" W (52.00mm x 76.00mm) | - | FPGA | - | 128MB | 2GB | BGA | Xilinx Zynq UltraScale+ ZU4EG | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | 0°C ~ 70°C | Zynq® UltraScale+™ | 2.047" L x 2.992" W (52.00mm x 76.00mm) | - | FPGA | Xilinx Zynq 7035 SoC XC7Z035-1FBG676C | 64MB | 1GB | Board-to-Board (BTB) Socket | ARM® Cortex®-A9 | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | -40°C ~ 85°C | Zynq® UltraScale+™ | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | FPGA | - | 64MB | 1GB | Samtec ST5 | AMD/Xilinx Zynq™ 7030 |
About Microcontrollers, Microprocessor, FPGA Modules
Modular embedded processor family consists of products that combine a microcontroller, microprocessor, digital signal processor, FPGA, or other computational device with support components like memory, power management, and timing. These products are designed to be integrated into end products, providing product developers access to advanced computing and interface capabilities without requiring high-speed hardware design expertise.
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