Image Sensors, Camera

Results:
2,299
Manufacturer
Series
Supplier Device Package
Active Pixel Array
Package / Case
Voltage - Supply
Frames per Second
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Type
Sensing Distance
Current - Supply
Shutter
Grade
Mounting Type
Qualification
Resolution
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Height (Max)
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Shell Size, MIL
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Utilized IC / Part
Color
Shielding
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Contents
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Sensor
Ingress Protection
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Function
Shell Size - Insert
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Features
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Voltage - Output (Typ) @ Distance
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Lens Mount
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Voltage - Output Difference (Typ) @ Distance
Results remaining2,299
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypePixel SizePackage / CaseSupplier Device PackageVoltage - SupplyOperating TemperatureGrade
BF3-5M-0204AG-100510
BOARD LEVEL, BF3EMBED INTERFACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
2.74µm x 2.74µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
C800 High Speed, Four Bands Linear image Sensor
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
14µm x 14µm
48-DIP Module
48-DIP Module
5V
0°C ~ 45°C
-
101990962
SENSECAP A1101 VISION AI SENSOR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Thermal
-
Module
-
-
-40°C ~ 85°C
-
101990659
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Imaging
15µm x 15µm
Module
-
-
-
-
101990657
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Imaging
15µm x 15µm
Module
-
-
-
-
101990658
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Imaging
15µm x 15µm
Module
-
-
-
-
MLX75026STH-AAA-200-TR
SINGLE CHIP QVGA TOF SENSOR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Time of Flight
10µm x 10µm
80-TFBGA, FCBGA
80-FCBGA (9.23x7.82)
1.1V ~ 1.3V
-40°C ~ 105°C
Automotive
MLX75026STH-AAA-100-TR
SINGLE CHIP QVGA TOF SENSOR WITH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Time of Flight
10µm x 10µm
80-TFBGA, FCBGA
80-FCBGA (9.23x7.82)
1.1V ~ 1.3V
-40°C ~ 105°C
Automotive
MLX75024RTF-GAA-001-TR
SENSOR TOF GEN2 AUTO QVGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Time of Flight
15µm x 15µm
44-WFBGA, WLBGA
44-WLBGA (6.6x5.5)
3V ~ 3.6V
-40°C ~ 105°C (TA)
Automotive
TCD1103GFG(8Z)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CCD
5.5µm x 64µm
16-GLCC Module
16-GLCC (15.2x6)
3V ~ 4V
-25°C ~ 60°C
-
NOIP1SP0480A-STI
IC IMAGE SENSOR CMOS
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Quantity
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PCB Symbol, Footprint & 3D Model
Python
CMOS
4.8µm x 4.8µm
67-WFBGA, CSPBGA
67-ODCSP (4.93x6.13)
1.7V ~ 1.9V, 3.2V ~ 3.4V
-40°C ~ 85°C (TJ)
-
TR-EVO-3M
TERARANGER EVO 3M
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Time of Flight
-
Module
-
4.75V ~ 5.25V
-
-
MLX75024RTF-GAA-000-TR
SENSOR TOF GEN2 AUTO QVGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
3D Time of Flight
15µm x 15µm
44-WFBGA, WLBGA
44-WLBGA (6.6x5.5)
3V ~ 3.6V
-40°C ~ 105°C (TA)
Automotive
BF3-3M-0064ZC-100020
SINGLE BOARD CAMERA, MANY OPTION
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
2.4µm x 2.4µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-3M-0064ZG-1Y00B0
SINGLE BOARD CAMERA, MANY OPTION
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
2.4µm x 2.4µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-5M-0196ZG-100510
BOARD LEVEL, BF3EMBED INTERFACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
3.45µm x 3.45µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-5M-0064ZG-1Y0510
BOARD LEVEL, BF3EMBED INTERFACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
2.4µm x 2.4µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-5M-0124RC-111510
BOARD LEVEL, BF3EMBED INTERFACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
1.85µm x 1.85µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-5M-0016ZG-1130B0
BOARD LEVEL CAMERA, USB3 MICRO B
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
3.45µm x 3.45µm
Module
-
10V ~ 28V
0°C ~ 45°C
-
BF3-5M-0246AG-111010
BOARD LEVEL, BF3EMBED INTERFACE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
CMOS
2.74µm x 2.74µm
Module
-
10V ~ 28V
0°C ~ 45°C
-

Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.