RICOH/Nisshinbo Micro Devices

RICOH/Nisshinbo Micro Devices

Nisshinbo Micro Devices Inc. is a renowned company specializing in the design and manufacture of high-performance semiconductors and electronic components. Established in Japan, Nisshinbo Micro Devices has a strong presence in the global market, providing innovative solutions for various industries such as automotive, industrial, and consumer electronics. The company's product portfolio includes power management ICs, RF components, sensors, and other advanced semiconductor devices. Known for their superior quality and reliability, Nisshinbo Micro Devices' products are widely used in applications such as power supplies, wireless communication, automotive systems, and IoT devices. The company's commitment to research and development enables them to stay at the forefront of technological advancements, constantly delivering cutting-edge solutions to meet customer demands. Nisshinbo Micro Devices also places great emphasis on sustainability, incorporating eco-friendly practices in their manufacturing processes and promoting energy efficiency through their products. With a global network of sales and support centers, the company ensures excellent customer service and technical support. Nisshinbo Micro Devices continues to be a trusted partner for customers seeking high-performance semiconductor solutions that drive innovation and enhance technological advancements.

RF Front End (LNA + PA)

Results:
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RF Type
Supplier Device Package
Qualification
Frequency
Grade
Features
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RICOH/Nisshinbo Micro Devices
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesFeaturesFrequencyPackage / CaseGradeRF TypeSupplier Device PackageQualification
NJG1156PCD-TE1
1+
¥2.5000
5+
¥2.3611
10+
¥2.2222
Quantity
100 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
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-
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10-UFDFN Exposed Pad
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GPS
10-HFFP-CD (2.5x2.5)
-
NJG1159PHH-A-TE1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
2.8V Supply Voltage
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10-UFDFN Module
Automotive
BeiDou, Galileo, GLONASS, GNSS, GPS
10-HFFP-HH (1.5x1.1)
AEC-Q100
NJG1186PJL-TE1
GNSS L5/L2C BAND FRONT-END MODUL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
2.8V Supply Voltage
1.164GHz ~ 1.228GHz
10-SMD, No Lead
-
GLONASS, GPS, GNSS
10-SMD
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About  RF Front End (LNA + PA)

Products in this category encompass integrated circuits that consolidate one or more functions typically present in the segment of a radio frequency (RF) signal chain linked to the system's antenna. These functions may include, but are not limited to, a low-noise amplifier (LNA) and a programmable amplifier (PA). The specific features incorporated into each individual device can vary significantly. Devices designed for specific, narrow applications often integrate a larger portion of the necessary signal chain compared to those engineered for more versatile applications. This enables them to provide a more focused and tailored solution for their intended use case. For instance, certain integrated circuits may encompass a comprehensive set of RF signal processing functions, including amplification, filtering, and modulation/demodulation, catering to specific RF communication standards or protocols. In contrast, more flexible devices may offer programmable or configurable features, allowing them to adapt to a broader range of applications and requirements, albeit with a potentially reduced level of integration for any single application. In essence, these integrated circuits streamline the RF signal chain by consolidating essential functions, thereby optimizing performance and efficiency within RF systems. The degree of integration and flexibility varies across different products, aligning with the diverse needs of RF applications spanning wireless communication, radar systems, and other RF-dependent technologies.