RF Front End (LNA + PA)

Results:
455
Manufacturer
Series
Supplier Device Package
Frequency
Package / Case
RF Type
Features
Grade
Qualification
Mounting Type
Current - Supply
Voltage - Supply
Test Frequency
Noise Figure
P1dB
Gain
Results remaining455
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesFeaturesFrequencyRF TypePackage / CaseSupplier Device PackageGradeQualification
AD9082BBPZ-2D2AC
MXFE DUAL 12 GSPS RFDAC QUAD 4GS
1+
$3072.1690
5+
$2901.4930
10+
$2730.8169
Quantity
3 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
-
General Purpose
324-FBGA Exposed Pad
324-BGA-ED (15x15)
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-
TLH5018HN/V1WY
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
BTS7203HHP
RX ANALOG FRONT-END IC, 2.3-2.7
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
3.3V Supply Voltage
2.3GHz ~ 2.7GHz
5G, LTE
32-VFQFN Exposed Pad
32-HVQFN (5x5)
-
-
LX5602LQ-TR
WIRELESS LAN FRONT-END MODULE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
LX5553LU
WIRELESS LAN FRONT-END MODULE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
2.4GHz ~ 2.5GHz
802.11b/g/n
Module
Module
-
-
AFE7688IABJ
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
-
-
-
-
-
-
AFE8316A1RGT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
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-
AFE8316A1RGTR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
LX5584HLQ-TR
2.5G FRONT-END MODULE 5V, 2.5X2.
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SP3T
2.4GHz ~ 2.5GHz
802.11n/ac
16-VFQFN
16-QFN (2.5x2.5)
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-
LX5584BLQ-TR
2.5G FRONT-END MODULE 5V, 3X3X0.
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SP3T
2.4GHz ~ 2.5GHz
802.11n/ac
16-VFQFN Exposed Pad
16-QFN (3x3)
-
-
LX5589ALQ-TR
5G FRONT-END MODULE 3.3V, 2.5X2.
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SPDT
5.15GHz ~ 5.85GHz
802.11n/ac
16-VFQFN
16-QFN (2.5x2.5)
-
-
LX5591LQ-TR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SPDT
2.4GHz ~ 2.5GHz, 5.15GHz ~ 5.85GHz
802.11n/ac
28-VFQFN Exposed Pad
-
-
-
RA81F0112STGNK#BB0
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
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-
STA5635ATR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
2-Bit ADC(s)
1.525GHz ~ 1.559GHz
Galileo, GLONASS, GNSS, GPS
32-VFQFN Exposed Pad
32-VFQFPN (5x5)
Automotive
AEC-Q100
STA5635A
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Quantity
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PCB Symbol, Footprint & 3D Model
-
2-Bit ADC(s)
1.525GHz ~ 1.559GHz
Galileo, GLONASS, GNSS, GPS
32-VFQFN Exposed Pad
32-VFQFPN (5x5)
Automotive
AEC-Q100
KA29242K-PR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SP3T
2.4GHz
Bluetooth, WLAN
10-XFBGA, CSP
10-CSP (0.807x0.601)
-
-
KA29223K-PR
LNA+SW(SP3T)-IC FOR WLAN 2.4GHZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SP3T
2.4GHz
Bluetooth, WLAN
11-XFBGA, CSP
11-CSP (0.711x0.923)
-
-
KA29222K-PR
LNA+SW(SPDT)-IC FOR WLAN 5GHZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SPDT
5GHz
WLAN
11-XFBGA, CSP
11-CSP (0.711x0.923)
-
-
TSL8329M
RF FRONT END 2-4.2GHZ 5G 40QFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
5V Supply Voltage
2GHz ~ 4.2GHz
4G/5G, Cellular
40-VFQFN Exposed Pad
40-QFN (6x6)
-
-
RA81F0112STGNK#KB0
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
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RF Front End (LNA + PA)

Products in this category encompass integrated circuits that consolidate one or more functions typically present in the segment of a radio frequency (RF) signal chain linked to the system's antenna. These functions may include, but are not limited to, a low-noise amplifier (LNA) and a programmable amplifier (PA). The specific features incorporated into each individual device can vary significantly. Devices designed for specific, narrow applications often integrate a larger portion of the necessary signal chain compared to those engineered for more versatile applications. This enables them to provide a more focused and tailored solution for their intended use case. For instance, certain integrated circuits may encompass a comprehensive set of RF signal processing functions, including amplification, filtering, and modulation/demodulation, catering to specific RF communication standards or protocols. In contrast, more flexible devices may offer programmable or configurable features, allowing them to adapt to a broader range of applications and requirements, albeit with a potentially reduced level of integration for any single application. In essence, these integrated circuits streamline the RF signal chain by consolidating essential functions, thereby optimizing performance and efficiency within RF systems. The degree of integration and flexibility varies across different products, aligning with the diverse needs of RF applications spanning wireless communication, radar systems, and other RF-dependent technologies.