Toshiba Electronic Devices and Storage Corporation

Toshiba Electronic Devices and Storage Corporation

Toshiba Electronic Devices and Storage Corporation, a subsidiary of Toshiba Corporation, is a prominent company specializing in electronic devices and storage solutions. It offers a wide array of products such as semiconductors, integrated circuits, power devices, sensors, and optoelectronic devices, known for their advanced technology and reliability. With a strong focus on research and development, the company prioritizes energy efficiency and sustainability to meet diverse customer needs. Committed to customer satisfaction, Toshiba provides comprehensive technical support and global service, solidifying its position as a leader in the electronic devices and storage industry.

RF Transceiver ICs

Results:
18
Series
Serial Interfaces
Voltage - Supply
Package / Case
Operating Temperature
Power - Output
Supplier Device Package
Sensitivity
Protocol
Current - Transmitting
Current - Receiving
GPIO
Memory Size
RF Family/Standard
Data Rate (Max)
Frequency
Modulation
Type
Mounting Type
Grade
Qualification
Results remaining18
Applied Filters:
Toshiba Electronic Devices and Storage Corporation
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMounting TypeSupplier Device PackageOperating TemperatureFrequencyData Rate (Max)Power - OutputMemory SizeVoltage - SupplyTypeRF Family/StandardProtocolModulationSensitivitySerial InterfacesCurrent - TransmittingGradePackage / CaseCurrent - ReceivingGPIOQualification
TC35661SBG-501,EL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 85°C
2.4GHz
2Mbps
2dBm
-
1.8V ~ 3.6V
TxRx Only
Bluetooth
Bluetooth v4.0
-
-90dBm
I²C, SPI, UART
63mA
-
64-FBGA
63mA
-
-
TC35661SBG-203,EL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 85°C
2.4GHz
2Mbps
2dBm
-
1.8V ~ 3.3V
TxRx Only
Bluetooth
Bluetooth v3.0
-
-90dBm
I²C, SPI, UART
63mA
-
64-FBGA
63mA
-
-
TC35676FSG-001(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
40-VQFN (5x5)
-40°C ~ 85°C
2.4GHz
921.6kbps
0dBm
192kB Flash, 64kB RAM
1.8V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.1
GFSK
-92dBm
I²C, PWM, SPI, UART
6.3mA
-
40-VFQFN Exposed Pad
6.3mA
15
-
TC35675XBG-001(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
52-TFBGA (4.5x4.5)
-30°C ~ 85°C (TA)
2.4GHz ~ 2.484GHz
921.6kbps
-4dBm
192kB Flash, 64kB RAM
1.8V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.1
ASK
-92dBm
I²C, SPI, UART
6.3mA
-
52-TFBGA
6.3mA
7
-
TC35667FTG-005(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
40-VQFN (6x6)
-40°C ~ 85°C
-
-
0dBm
-
1.8V ~ 3.6V
TxRx Only
Bluetooth
Bluetooth v4.0
-
-92dBm
I²C, PWM, SPI, UART
6.3mA
-
40-VFQFN Exposed Pad
6.3mA
-
-
TC35662IXBG(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-40°C ~ 85°C
2.4GHz
150Mbps
18dBm
-
3.3V
TxRx + MCU
Bluetooth, WiFi
802.11a/b/g/n, Bluetooth v4.2
-
-95dBm
I²C, I²S, SPI, UART, USB
-
-
-
-
-
-
TC35667FSG-006(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
40-VQFN (5x5)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
40-VFQFN Exposed Pad
-
-
-
TC35678FXG-002(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
60-QFN (7x7)
-40°C ~ 85°C
2.4GHz
-
0dBm
256kB Flash, 384kB ROM, 192kB RAM
2V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.2
GFSK
-94dBm
I²C, SPI
3.3mA
-
60-VFQFN Exposed Pad
3.3mA
17
-
TC35678FSG-002
IC RF TXRX+MCU BLUETOOTH 60VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
60-QFN (7x7)
-40°C ~ 85°C
2.4GHz
-
0dBm
256kB Flash, 384kB ROM, 192kB RAM
2V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.2
GFSK
-93dBm
I²C, SPI
3.3mA
-
60-VFQFN Exposed Pad
3.3mA
17
-
TC35420AXLG,EL
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
-
-
-
-
-
-
-
-
-
WiFi
-
-
-
SDIO
-
-
Module
-
-
-
TC35681FSG-002(ELC
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
40-VQFN (5x5)
-40°C ~ 120°C
2.4GHz ~ 2.484GHz
2Mbps
8dBm
144kB SRAM
2V
TxRx + MCU
Bluetooth
Bluetooth v5.0
-
-105dBm
ADC, HCI, I²C, PWM, SPI, UART
5.2mA ~ 26mA
-
40-VFQFN Exposed Pad
5.1mA ~ 5.6mA
18
-
TC35670FTG-006(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
40-VQFN (6x6)
-30°C ~ 85°C
-
-
0dBm
32kB RAM
1.8V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.1
-
-92dBm
ADC, I²C, SPI, UART, PCM
-
-
40-VFQFN Exposed Pad
-
-
-
TC35661SBG-503(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
64-TFBGA (5x5)
-20°C ~ 85°C (TA)
2.4GHz ~ 2.4835GHz
4.33Mbps
2dBm
-
1.7V ~ 1.9V, 2.7V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.2
-
-95dBm
I²C, SPI, UART
24mA ~ 30mA
-
64-TFBGA
54mA
19
-
TC35661IDBG-007(EH
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
64-LFBGA (7x7)
-40°C ~ 85°C
-
-
2dBm
-
2.7V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.2 + EDR
-
-90dBm
HCI, I2C, I2S, SPI, UART, PCM
-
-
64-LFBGA
-
-
-
TC35661SBG-551(EL)
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
64-TFBGA (5x5)
-40°C ~ 85°C (TA)
2.4GHz ~ 2.4835GHz
4.33Mbps
1dBm
-
1.7V ~ 1.9V, 2.7V ~ 3.6V
TxRx + MCU
Bluetooth
Bluetooth v4.2
-
-95dBm
I²C, I²S, JTAG, SPI, UART, USB
24mA ~ 30mA
-
64-TFBGA
54mA
19
-
TJM35420XLQ,EL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
TxRx + MCU
-
-
-
-
SDIO
-
-
Module
-
-
-
TC32306FTG,EL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
36-QFN (5.3x5.3)
-40°C ~ 110°C
315MHz, 434MHz, 868MHz, 915MHz
-
10dBm
-
2V ~ 3.3V, 2.4V ~ 5.5V
TxRx Only
General ISM < 1GHz
-
ASK, FSK
-121dBm
SPI
4.8mA ~ 12mA
-
36-VFQFN Exposed Pad
9.2mA ~ 11.1mA
-
-
TC35680FSG-002(ELG
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Quantity
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PCB Symbol, Footprint & 3D Model
TC
Surface Mount
40-VQFN (5x5)
-40°C ~ 85°C
2.4GHz ~ 2.484GHz
2Mbps
8dBm
128kB Flash, 144kB SRAM
1.2V
TxRx + MCU
Bluetooth
Bluetooth v5.0
-
-105dBm
ADC, HCI, I²C, PWM, SPI, UART
5.2mA ~ 26mA
-
40-VFQFN Exposed Pad
5.1mA ~ 5.6mA
18
-

About  RF Transceiver ICs

RF Transceiver ICs, or Radio Frequency Transceiver Integrated Circuits, are semiconductor devices that combine both a transmitter and a receiver within a single package. These ICs are specifically designed to efficiently operate within various RF families or standards, including AISG, Bluetooth, ISM, VHF, Wi-Fi, cellular networks, RADAR systems, 802.15.4 (Zigbee), and Z-Wave. The primary purpose of RF Transceiver ICs is to enable wireless communication by transmitting and receiving RF signals. By integrating both transmitter and receiver functions into a single chip, these ICs offer a compact and cost-effective solution for wireless communication applications. RF Transceiver ICs are further categorized based on the type of modulation used and the specific protocol versions they support. Modulation refers to the process of encoding information onto an RF carrier signal. Common modulation schemes include amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM). The specific protocol versions indicate compatibility with different communication protocols and standards within each RF family. Some RF Transceiver ICs also incorporate a built-in microcontroller, which adds additional functionality and control capabilities. The integrated microcontroller allows for more advanced features, such as protocol handling, data processing, error correction, and system management. This integration simplifies the overall system design and reduces the need for external components. RF Transceiver ICs play a vital role in various wireless communication applications, enabling devices to transmit and receive data wirelessly over different RF frequencies and protocols. They are widely used in applications such as wireless connectivity, IoT (Internet of Things) devices, remote control systems, wireless sensor networks, and many other wireless communication systems. In summary, RF Transceiver ICs are semiconductor devices that integrate both transmitter and receiver functions into a single chip. They enable wireless communication within specific RF families or standards and are categorized based on modulation type and protocol versions. With the inclusion of a built-in microcontroller, these ICs offer enhanced functionality and control capabilities, making them essential components in wireless communication systems.