RFI and EMI - Shielding and Absorbing Materials

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5,573
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Results remaining5,573
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperatureLengthShapeWidthTypeThickness - OverallAdhesiveMaterialGradeQualificationSeries
50-00-0584-0208
SILVER EMI EPOXY 85G KIT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
EMI Conductive Adhesive
-
-
Epoxy, 2 Part
-
-
CHO-BOND® 584-208
1345 X 6"
RF EMI SHIELDING TAPE 54'X6"
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 130°C
54.000' (16.50m)
-
6.000" (152.40mm)
Shielding Tape
0.004" (0.10mm)
Conductive, Single Sided
Embossed Tin-Plated Copper Foil
-
-
1345
9713 4.5"X36YD
TAPE COND ADHESIVE 4 1/2"X 36YD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
108.005' (32.92m)
Rectangular
4.500" (114.30mm)
Shielding Tape
-
Pressure Sensitive Adhesive (PSA)
Acrylic
-
-
9713
1183 VAR CONFIG
TIN-PLATED COPPER FOIL EMI SHIEL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
2191 VAR CONFIG
RIP-STOP FABRIC EMI SHIELDING TA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
39420002
WE-FAS TC THERMAL CONDUCTIVE AND
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 160°C
0.787" (20.00mm)
Square
0.787" (20.00mm)
Absorbing Sheet
0.079" (2.00mm)
Conductive
-
-
-
WE-FAS
39410001
WE-FAS TC THERMAL CONDUCTIVE AND
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 160°C
2.362" (60.00mm)
Square
2.362" (60.00mm)
Absorbing Sheet
0.039" (1.00mm)
Conductive
-
-
-
WE-FAS
39420001
WE-FAS TC THERMAL CONDUCTIVE AND
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 160°C
2.362" (60.00mm)
Square
2.362" (60.00mm)
Absorbing Sheet
0.079" (2.00mm)
Conductive
-
-
-
WE-FAS
39430001
WE-FAS TC THERMAL CONDUCTIVE AND
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 160°C
2.362" (60.00mm)
Square
2.362" (60.00mm)
Absorbing Sheet
0.118" (3.00mm)
Conductive
-
-
-
WE-FAS
FAM6-297-210-0.1-1A
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 155°C
11.693" (297.00mm)
Rectangular
8.268" (210.00mm)
Absorbing Sheet
0.004" (0.10mm)
Non-Conductive, Single Sided
-
-
-
FAM6
Y800-805B-0229-65-02-0
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Quantity
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PCB Symbol, Footprint & 3D Model
-55°C ~ 160°C
12.000" (304.80mm)
Round
-
Gasket
-
-
Silicone Elastomer Ag/Al
-
-
800
CMT-HT1-108-0750
CHO-MASK II TAPE 0.75 ROLL, HI T
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 82°C
323.983' (98.75m)
Circular
0.750" (19.05mm)
Absorbing Tape
0.003" (0.08mm)
Acrylic, Conductive
Tin-Plated Copper Foil
-
-
CHO-MASK® II
52-03-2040-0000
SILVER ACRYLIC EMI COATING 1PT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
EMI Conductive Coating
-
-
Acrylic
-
-
CHO-SHIELD® 2040
50-01-1086-0000
SILICONE ADHESIVE PRIMER 1PT
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Primer
-
-
Silicone Primer
-
-
CHO-BOND® 1086
90-04-7128-0000
CONDUCTIVE POLYESTER COATING
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
EMI Conductive Coating
-
-
Polyester
-
-
PRO-SHIELD® 7128
90-04-7103-0000
CONDUCTIVE ACRYLIC COATING
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
EMI Conductive Coating
-
-
Acrylic
-
-
PRO-SHIELD® 7103
Y800-805B-0206-65-02-0
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Quantity
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PCB Symbol, Footprint & 3D Model
-55°C ~ 160°C
12.000" (304.80mm)
Round
-
Gasket
-
-
Silicone Elastomer Ag/Al
-
-
800
Y800-802-0209-65-02-0
CONDUCTIVE SILICONE SOLID ROUND
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Quantity
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PCB Symbol, Footprint & 3D Model
-55°C ~ 150°C
12.000" (304.80mm)
Round
-
Gasket
-
-
Silicone Elastomer Ni/Gr
-
-
800
Y800-815D-0220-70-02-0
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Quantity
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PCB Symbol, Footprint & 3D Model
-55°C ~ 160°C
12.000" (304.80mm)
Round
-
Gasket
-
-
Fluorosilicone Elastomer Ag/Al
-
-
800
Y800-815D-0229-70-02-0
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Quantity
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PCB Symbol, Footprint & 3D Model
-55°C ~ 160°C
12.000" (304.80mm)
Round
-
Gasket
-
-
Fluorosilicone Elastomer Ag/Al
-
-
800

RFI and EMI - Shielding and Absorbing Materials

RFI and EMI shielding materials play a crucial role in the protection of sensitive electronic devices and circuits by effectively managing and redirecting electronic noise. These materials are specifically designed to absorb, reflect, or conduct electromagnetic interference (EMI) and radio-frequency interference (RFI) away from or around the sensitive components. A range of shielding material options are available for this purpose. Aluminum, copper, tin, epoxy and ferrite powders, gold fabric, nickel, nitrile, and various forms of polyester are commonly utilized. Each material possesses unique properties that contribute to its effectiveness in shielding against EMI and RFI. These shielding materials are typically available in various forms such as adhesive and non-adhesive sheets, rolls, tapes, and die-cut shapes. This diverse range of formats allows for flexibility in application, enabling the materials to be easily integrated into different electronic systems and configurations. Adhesive sheets and tapes offer a convenient and secure method of attaching the shielding material to the desired surfaces or components. They provide a reliable bond while ensuring that the shielding effectiveness is maintained. Non-adhesive sheets, rolls, and die-cut shapes provide alternative options for shielding applications. They can be used in situations where adhesives are not suitable or necessary, allowing for customized shielding solutions based on specific design requirements. Overall, RFI and EMI shielding materials are essential in safeguarding sensitive devices and circuits from electronic noise. By utilizing materials such as aluminum, copper, tin, epoxy and ferrite powders, gold fabric, nickel, nitrile, and polyester, and with their availability in different formats, including adhesive and non-adhesive sheets, rolls, tapes, and die-cut shapes, these shielding materials provide effective protection against unwanted electromagnetic interference.