Silicon Capacitors

Results:
322
Manufacturer
Series
Capacitance
Size / Dimension
Package / Case
Height
Voltage - Breakdown
ESR (Equivalent Series Resistance)
Operating Temperature
Applications
Tolerance
ESL (Equivalent Series Inductance)
Features
Results remaining322
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesFeaturesApplicationsOperating TemperaturePackage / CaseCapacitanceToleranceVoltage - BreakdownESL (Equivalent Series Inductance)HeightSize / DimensionESR (Equivalent Series Resistance)
RFCS04021200CBTT1
CAP SILICON 1.2PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
RFCS
-
-
-55°C ~ 125°C
0402 (1005 Metric)
1.2 pF
±0.1pF
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
935133424310
CAP SILICON 100PF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
XTSC
High Reliability
High Temperature
-55°C ~ 250°C
0402 (1005 Metric)
100 pF
±15%
11 V
100pH
0.016" (0.41mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
400 mOhms
935131424533
CAP SILICON 0.033UF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
HSSC
High Reliability
High Stability
-55°C ~ 150°C
0402 (1005 Metric)
0.033 µF
±15%
11 V
100pH
0.016" (0.41mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
400 mOhms
RFCS04021200CBTTS
CAP SILICON 1.2PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
RFCS
-
-
-55°C ~ 125°C
0402 (1005 Metric)
1.2 pF
±0.1pF
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
935146528247-W0T
CAP SILICON 47PF 15% 150V 0201
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Quantity
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PCB Symbol, Footprint & 3D Model
WLSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0201 (0603 Metric)
47 pF
±15%
150 V
50pH
0.005" (0.12mm)
0.020" L x 0.010" W (0.50mm x 0.25mm)
50 mOhms
939114722456-T3S
CAP SILICON 5600PF 15% 30V 0201
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Quantity
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PCB Symbol, Footprint & 3D Model
BBSC
High Reliability, Low Profile
High Stability
-55°C ~ 150°C
0201 (0603 Metric)
5600 pF
±15%
30 V
100pH
0.006" (0.14mm)
0.024" L x 0.012" W (0.60mm x 0.30mm)
500 mOhms
935154521410-T3T
CAP SILICON 1000PF 150V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
UWSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0202 (0505 Metric)
1000 pF
-
150 V
6pH
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
14 mOhms
935142831510-T3T
CAP SILICON 10000PF 15% 30V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
WBSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0202 (0505 Metric)
10000 pF
±15%
30 V
50pH
0.011" (0.27mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
50 mOhms
935146521310-T3T
CAP SILICON 100PF 15% 150V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
WLSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0202 (0505 Metric)
100 pF
±15%
150 V
50pH
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
50 mOhms
935146831510-T3T
CAP SILICON 10000PF 15% 30V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
WLSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0202 (0505 Metric)
10000 pF
±15%
30 V
50pH
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
50 mOhms
935146832410-W0T
CAP SILICON 1000PF 15% 30V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
WLSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
Nonstandard Chip
1000 pF
±15%
30 V
50pH
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
50 mOhms
935146632410-W0T
CAP SILICON 1000PF 15% 50V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
WLSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
Nonstandard Chip
1000 pF
±15%
50 V
50pH
0.005" (0.12mm)
0.012" L x 0.012" W (0.29mm x 0.29mm)
50 mOhms
935154630510-T3T
CAP SILICON 10000PF 15% 50V 0303
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Quantity
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PCB Symbol, Footprint & 3D Model
UWSC
High Reliability, Low Profile
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0303 (0808 Metric)
10000 pF
±15%
50 V
6pH
0.005" (0.12mm)
0.031" L x 0.031" W (0.80mm x 0.80mm)
14 mOhms
GC84300-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
300 pF
±10%
100 V
-
0.007" (0.18mm)
0.050" L x 0.050" W (1.27mm x 1.27mm)
-
GC84015-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
15 pF
±10%
100 V
-
0.007" (0.18mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
-
GC84050-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
50 pF
±10%
100 V
-
0.007" (0.18mm)
0.025" L x 0.025" W (0.64mm x 0.64mm)
-
GC84001-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
1 pF
±10%
100 V
-
0.007" (0.18mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
-
GC84005-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
5 pF
±10%
100 V
-
0.007" (0.18mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
-
GC84010-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
10 pF
±10%
100 V
-
0.007" (0.18mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
-
GC84100-00
SI CAPACITOR NON HERMETIC CHIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-55°C ~ 150°C
Nonstandard SMD
100 pF
±10%
100 V
-
0.007" (0.18mm)
0.030" L x 0.030" W (0.76mm x 0.76mm)
-

About  Silicon Capacitors

Silicon and thin-film capacitors are specialized devices that are manufactured using tools, methods, and materials commonly associated with semiconductor device production. This enables the production of capacitors with near-ideal characteristics and exceptional parameter stability. However, these capacitors have a limited range of available values and tend to be more expensive compared to ceramic-based capacitors, which are their primary competitors. The manufacturing process of silicon and thin-film capacitors allows for extreme precision and control over the production parameters. This results in capacitors that exhibit excellent stability in terms of capacitance, voltage ratings, and other electrical properties. They are designed to maintain their specified values over time and under varying conditions, making them ideal for applications that require precise and reliable performance. Despite their advantages, silicon and thin-film capacitors have a relatively narrow range of available capacitance values compared to ceramic-based capacitors. This limitation may restrict their use in certain applications that require a broader range of capacitance options. Furthermore, the cost of manufacturing silicon and thin-film capacitors is generally higher due to the specialized processes and materials involved. As a result, these capacitors are often considered more expensive compared to ceramic-based alternatives. In summary, silicon and thin-film capacitors are produced using semiconductor manufacturing techniques, allowing for the creation of capacitors with near-ideal characteristics and excellent parameter stability. While they have a limited range of capacitance values, they are well-suited for applications that demand precise and reliable performance. However, their higher cost compared to ceramic-based capacitors is an important consideration when selecting the appropriate capacitor for a given application.