Silicon Capacitors

Results:
322
Manufacturer
Series
Capacitance
Size / Dimension
Package / Case
Height
Voltage - Breakdown
ESR (Equivalent Series Resistance)
Operating Temperature
Applications
Tolerance
ESL (Equivalent Series Inductance)
Features
Results remaining322
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ImageProduct DetailPriceAvailabilityECAD ModelToleranceCapacitancePackage / CaseSeriesVoltage - BreakdownFeaturesHeightESL (Equivalent Series Inductance)ApplicationsOperating TemperatureSize / DimensionESR (Equivalent Series Resistance)
SC01000912
CAP SILICON 10PF 20% SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
10 pF
Nonstandard
SC
-
High Reliability
0.006" (0.15mm)
-
High Temperature
-65°C ~ 200°C
0.012" L x 0.012" W (0.30mm x 0.30mm)
-
939114722410-T3S
CAP SILICON 1000PF 15% 30V 0201
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
1000 pF
0201 (0603 Metric)
BBSC
30 V
High Reliability, Low Profile
0.006" (0.14mm)
100pH
High Stability
-55°C ~ 150°C
0.024" L x 0.012" W (0.60mm x 0.30mm)
500 mOhms
935142521410-T3T
CAP SILICON 1000PF 15% 150V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
1000 pF
0202 (0505 Metric)
WBSC
150 V
High Reliability, Low Profile
0.011" (0.27mm)
50pH
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0.020" L x 0.020" W (0.50mm x 0.50mm)
50 mOhms
905R6M-14-2
CAP SILICON 5.6PF 20% SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
5.6 pF
Nonstandard SMD
90
-
-
0.008" (0.20mm)
-
High Stability
-55°C ~ 150°C
0.030" L x 0.030" W (0.76mm x 0.76mm)
-
MBC50-1B12
CAP SILICON 1PF 20% 50V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
1 pF
Nonstandard Chip
MBC50
50 V
-
0.179" (4.55mm)
-
High Stability
-55°C ~ 200°C
1.417" L x 0.512" W (36.00mm x 13.00mm)
-
9033R0M-14-3
CAP SILICON 33PF 20% NONSTANDARD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
33 pF
Nonstandard
90
-
-
0.004" (0.10mm)
-
High Stability
-55°C ~ 150°C
0.055" L x 0.036" W (1.40mm x 0.91mm)
-
906R0M-14-2
CAP SILICON 6PF 20% 50V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
6 pF
Nonstandard Chip
90
-
High Reliability
0.005" (0.13mm)
-
High Stability
-55°C ~ 150°C
0.010" L x 0.010" W (0.25mm x 0.25mm)
-
911R5K
CAP SILICON 1.5PF 10% SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±10%
1.5 pF
Nonstandard SMD
91
-
-
0.007" (0.18mm)
-
High Stability
-55°C ~ 150°C
0.010" L x 0.010" W (0.25mm x 0.25mm)
-
SC10002430
CAP SILICON 100PF 20% 100V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
100 pF
Nonstandard Chip
SC
100 V
High Reliability
0.006" (0.15mm)
-
High Temperature
-65°C ~ 200°C
0.030" L x 0.030" W (0.76mm x 0.76mm)
-
SC00260912
CAP SILICON 2.6PF 20% 100V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±20%
2.6 pF
Nonstandard Chip
SC
100 V
High Reliability
0.006" (0.15mm)
-
High Temperature
-65°C ~ 200°C
0.012" L x 0.012" W (0.30mm x 0.30mm)
-
935174730410-T3A
CAP SILICON 1000PF 15% 30V 0202
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
1000 pF
0202 (0505 Metric)
ATSC
30 V
-
0.012" (0.30mm)
-
High Stability, High Temperature, Wirebond and Embedded
-55°C ~ 200°C
0.025" L x 0.025" W (0.63mm x 0.63mm)
-
935154634522-T3T
CAP SILICON 0.022UF 15% 50V 0504
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
0.022 µF
0504 (1210 Metric)
UWSC
50 V
High Reliability, Low Profile
0.005" (0.12mm)
6pH
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0.049" L x 0.039" W (1.25mm x 1.00mm)
14 mOhms
RFCS04028200CJTWS
CAP SILICON 8.2PF 25V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
±5%
8.2 pF
0402 (1005 Metric)
RFCS
25 V
-
0.016" (0.41mm)
-
-
-55°C ~ 125°C
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04028000DBTWS
CAP SILICON 0.8PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
±0.1pF
0.8 pF
0402 (1005 Metric)
RFCS
50 V
-
0.016" (0.41mm)
-
-
-55°C ~ 125°C
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04027000DBTWS
CAP SILICON 0.7PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
±0.1pF
0.7 pF
0402 (1005 Metric)
RFCS
50 V
-
0.016" (0.41mm)
-
-
-55°C ~ 125°C
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04026800CJTWS
CAP SILICON 6.8PF 25V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
±5%
6.8 pF
0402 (1005 Metric)
RFCS
25 V
-
0.016" (0.41mm)
-
-
-55°C ~ 125°C
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04026000DBTWS
CAP SILICON 0.6PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
±0.1pF
0.6 pF
0402 (1005 Metric)
RFCS
50 V
-
0.016" (0.41mm)
-
-
-55°C ~ 125°C
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
935152783522-T3N
CAP SILICON 0.022UF 15% 30V 0201
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
0.022 µF
0201 (0603 Metric)
UBSC
30 V
High Reliability, Low Profile
0.017" (0.44mm)
100pH
High Stability
-55°C ~ 150°C
0.031" L x 0.024" W (0.80mm x 0.60mm)
300 mOhms
935174732547-T3A
CAP SILICON 0.047UF 15% 30V 0505
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
0.047 µF
0505 (1313 Metric)
ATSC
30 V
-
0.012" (0.30mm)
-
High Stability, High Temperature, Wirebond and Embedded
-55°C ~ 200°C
0.052" L x 0.052" W (1.32mm x 1.32mm)
-
935154832410-W0T
CAP SILICON 1000PF 15% 30V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
±15%
1000 pF
Nonstandard Chip
UWSC
30 V
High Reliability, Low Profile
0.005" (0.12mm)
6pH
High Stability, Vertical Silicon Cap, Wirebond
-55°C ~ 150°C
0.010" L x 0.010" W (0.25mm x 0.25mm)
14 mOhms

Silicon Capacitors

Silicon and thin-film capacitors are specialized devices that are manufactured using tools, methods, and materials commonly associated with semiconductor device production. This enables the production of capacitors with near-ideal characteristics and exceptional parameter stability. However, these capacitors have a limited range of available values and tend to be more expensive compared to ceramic-based capacitors, which are their primary competitors. The manufacturing process of silicon and thin-film capacitors allows for extreme precision and control over the production parameters. This results in capacitors that exhibit excellent stability in terms of capacitance, voltage ratings, and other electrical properties. They are designed to maintain their specified values over time and under varying conditions, making them ideal for applications that require precise and reliable performance. Despite their advantages, silicon and thin-film capacitors have a relatively narrow range of available capacitance values compared to ceramic-based capacitors. This limitation may restrict their use in certain applications that require a broader range of capacitance options. Furthermore, the cost of manufacturing silicon and thin-film capacitors is generally higher due to the specialized processes and materials involved. As a result, these capacitors are often considered more expensive compared to ceramic-based alternatives. In summary, silicon and thin-film capacitors are produced using semiconductor manufacturing techniques, allowing for the creation of capacitors with near-ideal characteristics and excellent parameter stability. While they have a limited range of capacitance values, they are well-suited for applications that demand precise and reliable performance. However, their higher cost compared to ceramic-based capacitors is an important consideration when selecting the appropriate capacitor for a given application.