Silicon Capacitors

Results:
322
Manufacturer
Series
Capacitance
Size / Dimension
Package / Case
Height
Voltage - Breakdown
ESR (Equivalent Series Resistance)
Operating Temperature
Applications
Tolerance
ESL (Equivalent Series Inductance)
Features
Results remaining322
Select
ImageProduct DetailPriceAvailabilityECAD ModelFeaturesApplicationsToleranceOperating TemperaturePackage / CaseCapacitanceSeriesVoltage - BreakdownESL (Equivalent Series Inductance)HeightSize / DimensionESR (Equivalent Series Resistance)
RFCS04022200CJTT1
CAP SILICON 2.2PF 5% 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±5%
-55°C ~ 125°C
0402 (1005 Metric)
2.2 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
MBC50-8B12
CAP SILICON 8PF 20% 50V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
High Stability
±20%
-55°C ~ 200°C
Nonstandard Chip
8 pF
MBC50
50 V
-
0.179" (4.55mm)
1.417" L x 0.512" W (36.00mm x 13.00mm)
-
MBC50-6B12
CAP SILICON 6PF 20% 50V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
High Stability
±20%
-55°C ~ 200°C
Nonstandard Chip
6 pF
MBC50
50 V
-
0.179" (4.55mm)
1.417" L x 0.512" W (36.00mm x 13.00mm)
-
90150RK
CAP SILICON 150PF 10% SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
-
High Stability
±10%
-55°C ~ 150°C
Nonstandard SMD
150 pF
90
-
-
0.007" (0.18mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
-
9115R0K-BOO
CAP SILICON 15PF 100V SMD
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability
High Stability
-
-55°C ~ 150°C
Nonstandard Chip
15 pF
-
-
-
-
0.020" L x 0.020" W (0.51mm x 0.51mm)
-
935133424547
IPDiA
CAP SILICON 0.047UF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability
High Temperature
±15%
-55°C ~ 250°C
0402 (1005 Metric)
0.047 µF
XTSC
11 V
100pH
0.016" (0.41mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
400 mOhms
935131426610
IPDiA
CAP SILICON 0.1UF 15% 11V 0805
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability
High Stability
±15%
-55°C ~ 150°C
0805 (2012 Metric)
0.1 µF
HSSC
11 V
100pH
0.016" (0.41mm)
0.087" L x 0.055" W (2.20mm x 1.40mm)
400 mOhms
935151424610-T3N
CAP SILICON 0.1UF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability, Low Profile
High Stability
±15%
-55°C ~ 150°C
0402 (1005 Metric)
0.1 µF
UBSC
11 V
100pH
0.017" (0.44mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
300 mOhms
939113424610-T3N
CAP SILICON 0.1UF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability, Low Profile
High Stability
±15%
-55°C ~ 150°C
0402 (1005 Metric)
0.1 µF
BBSC
11 V
100pH
0.017" (0.44mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
500 mOhms
935155424610-T3N
CAP SILICON 0.1UF 15% 11V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability, Low Profile
High Stability
±15%
-55°C ~ 150°C
0402 (1005 Metric)
0.1 µF
ULSC
11 V
100pH
0.017" (0.44mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
500 mOhms
935174733610-T3A
CAP SILICON 0.1UF 15% 30V 0605
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Quantity
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PCB Symbol, Footprint & 3D Model
-
High Stability, High Temperature, Wirebond and Embedded
±15%
-55°C ~ 200°C
0605 (1513 Metric)
0.1 µF
ATSC
30 V
-
0.012" (0.30mm)
0.063" L x 0.052" W (1.59mm x 1.32mm)
-
RFCS04022200BJTTS
CAP SILICON 22PF 5% 10V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±5%
-55°C ~ 125°C
0402 (1005 Metric)
22 pF
RFCS
10 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04024000DBTT1
CAP SILICON 0.4PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±0.1pF
-55°C ~ 125°C
0402 (1005 Metric)
0.4 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04022000DBTTS
CAP SILICON 0.2PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±0.1pF
-55°C ~ 125°C
0402 (1005 Metric)
0.2 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04025000DBTT1
CAP SILICON 0.5PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±0.1pF
-55°C ~ 125°C
0402 (1005 Metric)
0.5 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04028200CJTT1
CAP SILICON 8.2PF 5% 25V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±5%
-55°C ~ 125°C
0402 (1005 Metric)
8.2 pF
RFCS
25 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04028200CJTTS
CAP SILICON 8.2PF 5% 25V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±5%
-55°C ~ 125°C
0402 (1005 Metric)
8.2 pF
RFCS
25 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04028000DBTT1
CAP SILICON 0.8PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±0.1pF
-55°C ~ 125°C
0402 (1005 Metric)
0.8 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
RFCS04026000DBTT1
CAP SILICON 0.6PF 50V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
±0.1pF
-55°C ~ 125°C
0402 (1005 Metric)
0.6 pF
RFCS
50 V
-
0.016" (0.41mm)
0.040" L x 0.020" W (1.02mm x 0.51mm)
-
935152724547-T3N
CAP SILICON 0.047UF 15% 30V 0402
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Quantity
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PCB Symbol, Footprint & 3D Model
High Reliability, Low Profile
High Stability
±15%
-55°C ~ 150°C
0402 (1005 Metric)
0.047 µF
UBSC
30 V
100pH
0.006" (0.14mm)
0.047" L x 0.028" W (1.20mm x 0.70mm)
300 mOhms

Silicon Capacitors

Silicon and thin-film capacitors are specialized devices that are manufactured using tools, methods, and materials commonly associated with semiconductor device production. This enables the production of capacitors with near-ideal characteristics and exceptional parameter stability. However, these capacitors have a limited range of available values and tend to be more expensive compared to ceramic-based capacitors, which are their primary competitors. The manufacturing process of silicon and thin-film capacitors allows for extreme precision and control over the production parameters. This results in capacitors that exhibit excellent stability in terms of capacitance, voltage ratings, and other electrical properties. They are designed to maintain their specified values over time and under varying conditions, making them ideal for applications that require precise and reliable performance. Despite their advantages, silicon and thin-film capacitors have a relatively narrow range of available capacitance values compared to ceramic-based capacitors. This limitation may restrict their use in certain applications that require a broader range of capacitance options. Furthermore, the cost of manufacturing silicon and thin-film capacitors is generally higher due to the specialized processes and materials involved. As a result, these capacitors are often considered more expensive compared to ceramic-based alternatives. In summary, silicon and thin-film capacitors are produced using semiconductor manufacturing techniques, allowing for the creation of capacitors with near-ideal characteristics and excellent parameter stability. While they have a limited range of capacitance values, they are well-suited for applications that demand precise and reliable performance. However, their higher cost compared to ceramic-based capacitors is an important consideration when selecting the appropriate capacitor for a given application.