Socket Adapters

Results:
279
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining279
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
242-1281-39-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
18-35W000-10-P
SOCKET ADAPT SOIC-W TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-68340-P
ADAPTER/PANEL QFP TO PGA 144POS
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 68340
QFP
PGA
144
0.026" (0.65mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
32-450001-10-P
SOCKET ADAPTER SOJ TO 32DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 450001
SOJ
DIP, 0.4" (10.16mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
FR4 Epoxy Glass
32-652000-10-P
SOCKET ADAPTER PLCC TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
95-132I25-P
SOCKET ADAPTER QFP TO 132PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 95-132I25
QFP
PGA
132
0.025" (0.64mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
84-505-110-P
SOCKET ADAPTER PLCC TO 84PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
84
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
S 894-13-007-25-050000
SOCKET 7POS W/ .240 SOLDERCUP
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
GX1036
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Quantity
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PCB Symbol, Footprint & 3D Model
GX5103
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Quantity
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PCB Symbol, Footprint & 3D Model
222-3343-19-0602
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Quantity
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PCB Symbol, Footprint & 3D Model
1111163
SOCKET ADAPTER SOCKET TO 40PLCC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111163
Socket, 0.6" (15.24mm) Row Spacing
PLCC
40
-
Gold
-
-
-
-
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
68-505-110-RC-P
SOCKET ADAPTER PLCC TO 68PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-RC
SOCKET ADAPTER PLCC TO 68PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
48-655000-10
SOCKET ADAPTER TSOP TO 48DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 655000
TSOP
DIP, 0.6" (15.24mm) Row Spacing
48
0.020" (0.50mm)
Silver
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-505-110-P
SOCKET ADAPTER PLCC TO 68PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
32-655000-10-P
SOCKET ADAPTER TSOP TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 655000
TSOP
DIP, 0.6" (15.24mm) Row Spacing
32
0.020" (0.50mm)
Silver
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
10-665000-00
SCK ADAPT 10P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
10
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
12-665000-00
SCK ADAPT 12P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
12
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1109252
SOCKET ADAPTER PLCC TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1109252
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
-
-
Through Hole
Solder
0.070" (1.78mm)
Tin-Lead
-
FR4 Epoxy Glass

About  Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.