Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMounting TypeConvert From (Adapter End)Convert To (Adapter End)Pitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostHousing MaterialBoard MaterialNumber of Pins
97-80C251
SOCKET ADAPTER DIP TO PLCC
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Quantity
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PCB Symbol, Footprint & 3D Model
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16-35W000-11-RC-P (220 UP)
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
Through Hole
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
0.050" (1.27mm)
-
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16
28-350002-11-RC-P
SOCKET ADAPTER SOIC TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 350000
Through Hole
SOIC
DIP, 0.3" (7.62mm) Row Spacing
0.050" (1.27mm)
-
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
28
16-307349-11-RC-P (170 UP)
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 307349
Through Hole
PLCC
DIP, 0.3" (7.62mm) Row Spacing
0.050" (1.27mm)
Gold
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16
16-307349-11-RC
SOCKET ADAPTER PLCC TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 307349
Through Hole
PLCC
DIP, 0.3" (7.62mm) Row Spacing
0.050" (1.27mm)
Gold
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16
97-AQ132D-P
SCKT ADPT PQFP-132PGA PANELIZED
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 97-AQ132D
Through Hole
PQFP
PGA
0.025" (0.64mm)
Gold
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
132
MIKROE-231
SOCKET ADAPTER AT90PWM2 TO 40DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
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AT90PWM2
DIP
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40
18-35W000-11-RC
SOCKET ADAPT SOIC-W TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
Through Hole
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
0.050" (1.27mm)
-
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
18
1107254-16
SOCKET ADAPTER DIP TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
Through Hole
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
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16
LCQT-QFP0.5-52
SOCKET ADAPTER MULT PKG TO 52QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Through Hole
Multiple Packages
QFP
0.020" (0.50mm)
-
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
52
LCQT-QFP0.65-52
SOCKET ADAPTER MULT PKG TO 52QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Through Hole
Multiple Packages
QFP
0.026" (0.65mm)
-
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
52
LCQT-QFP0.5-80
SOCKET ADAPTER MULT PKG TO 80QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Through Hole
Multiple Packages
QFP
0.020" (0.50mm)
-
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
80
1111841
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111841
Through Hole
MSOP
DIP, 0.3" (7.62mm) Row Spacing
0.020" (0.50mm)
-
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
-
28-505-110
SOCKET ADAPTER PLCC TO 28PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
Through Hole
PLCC
PGA
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
28
DX1036
SOIC28 SOCKET ADAPTER FOR SUPERP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SOIC
SOIC
0.050" (1.27mm)
-
Solder
0.050" (1.27mm)
-
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32
S 894-13-007-25-050000
SOCKET 7POS W/ .240 SOLDERCUP
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Quantity
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PCB Symbol, Footprint & 3D Model
*
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Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.