Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
228-1277-19-0602J
RECEPTACLE DIP SOCKET 28POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
LCQT-QFP0.5-60
SOCKET ADAPTER MULT PKG TO 60QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
60
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
LCQT-QFP0.5-40-1
SOCKET ADAPTER MULT PKG TO 40QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
1107254-20
SOCKET ADAPTER DIP TO 20DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-18
SOCKET ADAPTER DIP TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1106396-20
SOCKET ADAPTER DIP TO 20DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1106396
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-14
SOCKET ADAPTER DIP TO 14DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1111841-8
SOCKET ADAPTER MSOP TO 8DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111841
MSOP
DIP, 0.3" (7.62mm) Row Spacing
8
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
218-3341-19-0602J
RECEPTACLE DIP SOCKET 18POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-19-0602J
RECEPTACLE DIP SOCKET 40POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
12-665000-00
SCK ADAPT 12P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
12
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
220-3342-19-0602J
RECEPTACLE DIP SOCKET 20POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
214-3339-09-0602J
SOCKET ADAPTER 14DIP TO 14DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-4493-19-0602J
RECEPTACLE DIP SOCKET 64POS .9"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
64
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-19-0602J
RECEPTACLE DIP SOCKET 24POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
18-354000-11-RC
SOCKET ADAPTER DIP TO 18SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
18
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-35W000-11-RC
SOCKET ADAPT SOIC-W TO 14DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
22-304504-18
SOCKET ADAPTER SOIC TO 22DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304504
SOIC
DIP, 0.4" (10.16mm) Row Spacing
22
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1111903
SOCKET ADAPT SOWIC TO 24DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111903
SOWIC
DIP, 0.4" (10.16mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
26-665000-00
SCK ADAPT 26P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
26
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.