Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
1109522
SOCKET ADAPTER DIP TO TO-8
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1109522
DIP, 0.3" (7.62mm) Row Spacing
JEDEC
8
0.100" (2.54mm)
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
20-301550-20
SOCKET ADAPTER SOIC TO 20PLCC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 301550
SOIC
PLCC
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-350001-11-RC
SOCKET ADAPTER SOJ TO 20DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 350000
SOJ
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
28-665000-00
SCK ADAPT 28P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
28
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1107254-40
SOCKET ADAPTER DIP TO 40DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1106396-40
SOCKET ADAPTER DIP TO 40DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1106396
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-666000-00
SOCKET ADAPTER SOIC TO 18SOWIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 666000
SOIC
SOWIC
18
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
14-666000-00
SOCKET ADAPTER SOIC TO 14SOWIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 666000
SOIC
SOWIC
14
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
1106396-32
SOCKET ADAPTER DIP TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1106396
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
44-505-110
SOCKET ADAPTER PLCC TO 44PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
44
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
24-650000-11-RC-P
SOCKET ADAPTER SOIC TO 24DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
24
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
LCQT-QFP0.65-80
SOCKET ADAPTER MULT PKG TO 80QFP
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
80
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
14-354000-10
SOCKET ADAPTER DIP TO 14SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
16-35W000-11-RC
SOCKET ADAPT SOIC-W TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
08-354000-11-RC
SOCKET ADAPTER DIP TO 8SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
8
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-354000-10
CONN ADAPTER 8POS DIP-S01C
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
8
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-351000-10
SOCKET ADAPTER SSOP TO 24DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
SSOP
DIP, 0.3" (7.62mm) Row Spacing
24
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-351000-11-RC
SOCKET ADAPTER SSOP TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
SSOP
DIP, 0.3" (7.62mm) Row Spacing
18
0.026" (0.65mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
224-1275-09-0602J
SOCKET ADAPTER 24DIP TO 24DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
28-650000-11-RC-P
SOCKET ADAPTER SOIC TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.