Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
28-450001-11-RC
SOCKET ADAPTER SOJ TO 28DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 450001
SOJ
DIP, 0.4" (10.16mm) Row Spacing
28
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
PA-SOD6SM18-44
ADAPTER 44SOIC TO 44DIP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
SOIC
DIP
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
14-665000-00
SCK ADAPT 14P SOIC-W TO SOIC 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
14
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
28-354000-21-RC
SOCKET ADAPTER DIP TO 28SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
28
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-354000-11-RC
SOCKET ADAPTER DIP TO 28SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
28
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-655000-10
SOCKET ADAPTER TSOP TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 655000
TSOP
DIP, 0.6" (15.24mm) Row Spacing
32
0.020" (0.50mm)
Silver
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-651000-10
SOCKET ADAPTER SSOP TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 651000
SSOP
DIP, 0.6" (15.24mm) Row Spacing
28
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-652000-10
SOCKET ADAPTER PLCC TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
24-354000-21-RC
SOCKET ADAPTER DIP TO 24SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
24
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-354000-11-RC
SOCKET ADAPTER DIP TO 24SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
24
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-354W00-10
CONN ADAPTER 24PIN DIP TO SOWIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354W00
DIP, 0.3" (7.62mm) Row Spacing
SOWIC
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-652000-10
SOCKET ADAPTER PLCC TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-354000-21-RC
SOCKET ADAPTER DIP TO 20SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
20
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-354000-20
SOCKET ADAPTER DIP TO 20SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
20
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-354000-10
CONN ADAPTER 20POS DIP-SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
20
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
240-1280-39-0602J
RECEPTACLE DIP SOCKET 40POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
14-354000-21-RC
SOCKET ADAPTER DIP TO 14SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-354000-11-RC
SOCKET ADAPTER DIP TO 14SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
228-1290-29-0602J
RECEPTACLE DIP SOCKET 28POS .4"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-5248-19-0602J
RECEPTACLE DIP SOCKET 24POS .3"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.