Socket Adapters

Results:
276
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
Results remaining276
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
32-650000-11-RC
SOCKET ADAPTER SOJ TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOJ
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
84-653000-11-RC
SOCKET ADAPTER PLCC TO 84DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
800-19-6-1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
1110267-N
SOCKET ADAPTER PLCC TO 68DIP 0.9
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1110267-N
PLCC
DIP, 0.9" (22.86mm) Row Spacing
68
-
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-652000-10
SOCKET ADAPTER PLCC TO 68DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
800-12-6-1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
97-AQ132D
SOCKET ADAPTER PQFP TO 132PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 97-AQ132D
PQFP
PGA
132
0.025" (0.64mm)
Gold
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
800-3-6-1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
84-505-111
SOCKET ADAPTER PLCC TO 84PGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 505
PLCC
PGA
84
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
68-652000-11-RC
SOCKET ADAPTER PLCC TO 68DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 652000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
232-1285-09-0602J
RECEPTACLE DIP SOCKET 32POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
32-450001-10-P
SOCKET ADAPTER SOJ TO 32DIP 0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 450001
SOJ
DIP, 0.4" (10.16mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
FR4 Epoxy Glass
24-650000-10-P
SOCKET ADAPTER SOIC TO 24DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-354000-10
SOCKET ADAPTER DIP TO 18SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
18
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-350000-10-HT
SOCKET ADAPTER SOIC TO 18DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 350000
SOIC
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
32-650000-10-P
SOCKET ADAPTER SOIC TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-650000-10-P
SOCKET ADAPTER SOIC TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 650000
SOIC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
290-1294-29-0602J
RECEPTACLE DIP SOCKET 90POS .9"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
90
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-39-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-29-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.