Solder

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1,741
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Results remaining1,741
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
91-7059-8815
SOLDER FLUX-CORED/245 .015" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7)
0.015" (0.38mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
RASW.031 .7OZ
SOLDER WIRE POCKET PACK 63/37 TI
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Rosin Activated (RA)
21 AWG, 20 SWG
Leaded
Tube, 0.7 oz (19.85g)
-
SMD291AX10T5
SOLDER PASTE NO CLEAN T5 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
5
-
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL10
SOLDER PASTE NO-CLEAN 10CC SYR
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
3
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
SMDIN52SN48
INDIUM SOLDER WIRE (IN52/SN48) 0
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
SMD
Wire Solder
In52Sn48 (52/48)
0.031" (0.79mm)
244°F (118°C)
-
20 AWG, 21 SWG
Lead Free
Spool
-
92-6040-0017
SOLDER FLUX-CORED/44 .025" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
44
Wire Solder
Sn60Pb40 (60/40)
0.025" (0.64mm)
361 ~ 374°F (183 ~ 190°C)
Rosin Activated (RA)
22 AWG, 23 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
91-7068-9820
SOLDER FLUX-CORED/296 .020" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
296
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 8.8 oz (250g)
-
91-7068-7615
SOLDER FLUX-CORED/275 .015" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
275
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
91-7068-7604
SOLDER FLUX-CORED/275 .020" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
275
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
91-7068-6400
SOLDER FLUX-CORED/331 .020" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
331
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
24 AWG, 25 SWG
Lead Free
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
SMD2055-25000
SOLDER SPHERES SAC305 DIAMETER 2
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Date of Manufacture
-
SMD2
Solder Sphere
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.025" (0.64mm)
423 ~ 428°F (217 ~ 220°C)
-
-
Lead Free
Jar
-
91-6337-9727
SOLDER FLUX-CORED/285 .015" 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
285
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
27 AWG, 28 SWG
Leaded
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
91-6337-8807
SOLDER FLUX-CORED/245 63/37 .020
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
No-Clean
24 AWG, 25 SWG
Leaded
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
91-6337-6415
SOLDER FLUX-CORED/331 63/37.015"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
331
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
Water Soluble
27 AWG, 28 SWG
Leaded
Spool, 8.8 oz (250g)
50°F ~ 104°F (10°C ~ 40°C)
SMDSW.020 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
No-Clean, Water Soluble
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
-
RASW.020 1LB
SOLDER WIRE 63/37 TIN/LEAD ROSIN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
-
SMDSW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean, Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
-
SMD291AX10T4
SLDR PST NO-CLEAN 63/37 T4 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
4
-
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
EXB-SN63PB37
SOLDER BAR SN63/PB37 1LB (454G)
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
Super Low Dross™
Bar Solder
Sn63Pb37 (63/37)
-
361°F (183°C)
-
-
Leaded
Bar, 1 lb (454g)
-
SMDLTLFPT5
SOLDER PASTE NO CLEAN SN42/BI57.
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
5
SMD
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
281°F (138°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
37°F ~ 46°F (3°C ~ 8°C)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.