Solder

Results:
1,741
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Results remaining1,741
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartSeriesMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
92-6337-0007
SOLDER FLUX-CORED/44 63/37 .015"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
44
-
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
Rosin Activated (RA)
27 AWG, 28 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
SMDBI100-S-1
SOLDER SHOT BI100 1OZ 28G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
SMD
-
Solder Shot
Bi100(100)
-
521°F (271°C)
-
-
Lead Free
Bag, 1 oz (28g)
-
90-7068-8850
SOLDER FLUX-CORED/245 .010 100G
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
245
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.010" (0.25mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
30 AWG, 33 SWG
Lead Free
Spool, 3.53 oz (100g)
50°F ~ 104°F (10°C ~ 40°C)
96-6337-9531
SN63PB37 3.3%/268 .031 500 G
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
268
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean
20 AWG, 22 AWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
SSLFNC-15G
SAC 305 LEAD FREE SOLDER PASTE T
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
3
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL50
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
Smooth Flow™
4
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Jar, 1.76 oz (50g)
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL15
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
Smooth Flow™
4
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA15
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
Smooth Flow™
4
Solder Paste
Bi57Sn42Ag1 (57/42/1)
-
279°F (137°C)
No-Clean
-
-
Syringe, 0.53 oz (15g), 5cc
37°F ~ 46°F (3°C ~ 8°C)
92-6337-7603
SOLDER FLUX-CORED/275 63/37 .020
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
275
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
No-Clean
24 AWG, 25 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-6337-6401
SOLDER FLUX-CORED/331 63/37 .020
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
331
-
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
Water Soluble
24 AWG, 25 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
SMD4300SNL10
SOLDER PASTE WATER SOL LF 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
CHIPQUIK® SMD4300
3
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
-
Lead Free
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
92-6040-0026
SOLDER FLUX-CORED/44 .031" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
44
-
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 374°F (183 ~ 190°C)
Rosin Activated (RA)
20 AWG, 22 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
TS991SNL35T3
THERMALLY STABLE SOLDER PASTE NC
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
CHIPQUIK®
3
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423°F (217°C)
No-Clean
-
-
Syringe, 1.23 oz (34.869g)
37°F ~ 77°F (3°C ~ 25°C)
WS991SNL35T4
THERMALLY STABLE SOLDER PASTE WS
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
CHIPQUIK®
4
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423°F (217°C)
Water Soluble
-
-
Syringe, 1.23 oz (34.869g)
37°F ~ 77°F (3°C ~ 25°C)
WBRC63/3762
SRA ROSIN FLUX CORE SOLDER, 63/3
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.062" (1.57mm)
361°F (183°C)
Rosin Activated (RA)
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
-
SMD2SWLF.012 100G
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
SMD2
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.012" (0.31mm)
441°F (227°C)
No-Clean, Water Soluble
28 AWG, 30 SWG
Lead Free
Spool, 3.53 oz (100g)
-
WB63/37
MADE IN USA 63/37 ALLOY 1 LB SOL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
SUPER-PURE™
-
Bar Solder
Sn63Pb37 (63/37)
-
361°F (183°C)
-
-
-
Bar, 1 lb (454g)
-
SMD4300AX10T5
SOLDER PASTE WATER SOL T5 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
CHIPQUIK® SMD4300
5
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean, Water Soluble
-
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
TS391LT10
THERMALLY STABLE SOLDER PASTE NO
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
4
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
281°F (138°C)
No-Clean
-
Lead Free
Syringe, 1.23 oz (35g), 10cc
68°F ~ 77°F (20°C ~ 25°C)
NC2SW.015 4OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
CHIPQUIK®
-
Wire Solder
Sn60Pb40 (60/40)
0.015" (0.38mm)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
-
Leaded
Spool, 4 oz (113.40g)
-

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.