Solder

Results:
1,741
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Wire Gauge
Storage/Refrigeration Temperature
Flux Type
Type
Shelf Life
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Process
Shelf Life Start
Cable Type
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Jacket (Insulation) Material
Ratings
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Jacket (Insulation) Diameter
Results remaining1,741
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
SMD3SW.020 .4OZ
SOLDER WIRE POCKET PACK 62/36/2
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
24 AWG, 25 SWG
Leaded
Tube, 0.4 oz (11.34g)
16-6040-0125
SOLDER 60/40 8AWG 5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
Solid Core Wire
Wire Solder
Sn60Pb40 (60/40)
0.125" (3.18mm)
361 ~ 374°F (183 ~ 190°C)
-
8 AWG, 10 SWG
Leaded
Spool, 5 lbs (2.27kg)
SMDSW.031 1OZ
SOLDER WIRE NO-CLEAN 63/37 1OZ.
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean, Water Soluble
20 AWG, 22 SWG
Leaded
Spool, 1 oz (28.35g)
SMD2SW.020 1OZ
SOLDER WIRE 60/40 TIN/LEAD NO-CL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD2
Wire Solder
Sn60Pb40 (60/40)
0.020" (0.51mm)
361 ~ 370°F (183 ~ 188°C)
No-Clean, Water Soluble
-
Leaded
Spool, 1 oz (28.35g)
RASWLF.020 1OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
422 ~ 428°F (217 ~ 220°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Lead Free
Spool, 1 oz (28.35g)
WBARS993/7-1/2LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SUPER-PURE™
Bar Solder
Sn99.3Cu0.7 (99.3/0.7)
-
-
-
-
Lead Free
Bar, 0.5 lb (266.79g)
BARSN42BI57AG1-8OZ
SOLDER BAR SN42/BI57/AG1 8OZ 227
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Super Low Dross™
Bar Solder
Bi57Sn42Ag1 (57/42/1)
-
280°F (138°C)
-
-
Lead Free
Bar, 0.5 lb (227g)
SMD2SWLF.015 4OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD2
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean, Water Soluble
-
Lead Free
Spool, 4 oz (113.40g)
SMD3SW.031 1OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
-
Leaded
Spool, 1 oz (28.35g)
SMDSWLF.015 .3OZ
LF SOLDER WIRE POCKET PACK 96.5/
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
27 AWG, 28 SWG
Lead Free
Tube, 0.3 oz (8.51g)
96-6337-9515
SN63PB37 3.3%/268 .015 500 G
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
-
268
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean
26 AWG, 27 SWG
Leaded
Spool, 17.64 oz (500g)
92-7068-9014
SOLDER FLUX-CORED/245 .031" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 17.64 oz (500g)
24-7050-0061
SOLDER FLUX-CORED/44 .062" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
44
Wire Solder
Sn96.3Ag3.7 (96.3/3.7)
0.062" (1.57mm)
430 ~ 444°F (221 ~ 223°C)
Rosin Activated (RA)
14 AWG, 16 SWG
Lead Free
Spool, 1 lb (454 g)
24-7340-9713
SOLDER FLUX-CORED/285 .031" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
285
Wire Solder
Pb93.5Sn5Ag1.5 (93.5/5/1.5)
0.031" (0.79mm)
565 ~ 574°F (296 ~ 301°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
24-7050-0066
SOLDER FLUX-CORED/44 .093" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
44
Wire Solder
Sn96.3Ag3.7 (96.3/3.7)
0.093" (2.36mm)
430 ~ 444°F (221 ~ 223°C)
Rosin Activated (RA)
11 AWG, 13 SWG
Lead Free
Spool, 1 lb (454 g)
24-7068-7619
SOLDER FLUX-CORED/275 .025" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
275
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.025" (0.64mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
22 AWG, 23 SWG
Lead Free
Spool, 1 lb (454 g)
24-7068-7600
SOLDER FLUX-CORED/275 .031" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
275
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
24-7068-8846
SOLDER FLUX-CORED/245 .0240" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.040" (1.02mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 1 lb (454 g)
24-6337-9746
SOLDER FLUX-CORED/285 63/37 .025
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
-
285
Wire Solder
Sn63Pb37 (63/37)
0.025" (0.64mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
22 AWG, 23 SWG
Leaded
Spool, 1 lb (454 g)
24-7150-9710
SOLDER FLUX-CORED/285 .031" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
-
285
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.