Solder

Results:
1,741
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Wire Gauge
Storage/Refrigeration Temperature
Flux Type
Type
Shelf Life
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Process
Shelf Life Start
Cable Type
Shield Type
Jacket (Insulation) Material
Ratings
Voltage
Conductor Material
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Jacket (Insulation) Diameter
Results remaining1,741
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeSeriesMesh TypeTypeCompositionDiameterMelting PointFlux TypeProcessForm
T0051403199
WSW SNPB L1, 0.8MM, 100G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
Weller®
-
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
-
No-Clean
Leaded
Spool, 3.53 oz (100g)
16-7068-0125
SOLDER SOLID WIRE .125" 5LB SPL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
8 AWG, 10 SWG
Solid Core Wire
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.125" (3.18mm)
423 ~ 424°F (217 ~ 218°C)
-
Lead Free
Spool, 5 lbs (2.27kg)
16-7080-0125
SOLDER SOLID WIRE .125" 5LB SPL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
8 AWG, 10 SWG
Solid Core Wire
-
Wire Solder
Sn95Sb5 (95/5)
0.125" (3.18mm)
450 ~ 464°F (232 ~ 240°C)
-
Lead Free
Spool, 5 lbs (2.27kg)
25-9574-0654
SOLDER FLUX-CORED/OR421 .062"4LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
14 AWG, 16 SWG
OR421
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.062" (1.57mm)
441°F (227°C)
Water Soluble
Lead Free
Spool, 4 lbs (1.81kg)
70-4105-0919
SOLDER PASTE NO CLEAN 750GM
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
NP545
4
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 424°F (217 ~ 218°C)
No-Clean
Lead Free
Cartridge, 24.69 oz (700g)
70-0605-0911
SOLDER PASTE NO CLEAN 600GM
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Quantity
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PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
EM907
4
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 424°F (217 ~ 218°C)
No-Clean
Lead Free
Cartridge, 21.16 oz (600g)
25-7080-0069
SOLDER FLUX-CORED/44 .125" 4LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
8 AWG, 10 SWG
44
-
Wire Solder
Sn95Sb5 (95/5)
0.125" (3.18mm)
450 ~ 464°F (232 ~ 240°C)
Rosin Activated (RA)
Lead Free
Spool, 4 lbs (1.81kg)
70-2102-0311
SOLDER PASTE WATER SOLUBLE 600GM
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
R562
3
Solder Paste
Sn62Pb36Ag2 (62/36/2)
-
354°F (179°C)
Water Soluble
Leaded
Cartridge, 21.16 oz (600g)
4902P-15G
LEAD FREE LOW TEMPERATURE SOLDER
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Date of Manufacture
39°F ~ 50°F (4°C ~ 10°C)
-
4902
-
Solder Paste
Bi57Sn42Ag1 (57/42/1)
-
281°F (138°C)
No-Clean
Lead Free
Syringe, 0.53 oz (15g), 5cc
SMDSWLT.047 1OZ
SOLDER WIRE SN42/BI57/AG1 .047"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.047" (1.19mm)
280°F (138°C)
-
Lead Free
Spool, 1 oz (28.35g)
CC9601062PSAC
Canfield Technologies
SAC 305 NO CLEAN FLUX 1 LB .062
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
14 AWG, 16 SWG
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.062" (1.57mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
Lead Free
Spool, 1 lb (454 g)
SMDSWLF.006 1G
SOLDER WIRE SN96.5/AG3/CU0.5
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.006" (0.15mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
Lead Free
Spool, 0.035 oz (1g)
NC191AX15T5
SMOOTH FLOW LEADED SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
-
Smooth Flow™
5
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
Leaded
Syringe, 0.53 oz (15g), 5cc
4887-454G
SOLDER RA 63/37 1 LB
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Quantity
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PCB Symbol, Footprint & 3D Model
60 Months
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
16 AWG, 18 SWG
4880
-
Wire Solder
Sn63Pb37 (63/37)
0.050" (1.27mm)
361°F (183°C)
Rosin Activated (RA)
Leaded
Spool, 1 lb (454 g)
SMD2SWLF.015 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
27 AWG, 28 SWG
SMD2
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean, Water Soluble
Lead Free
Spool, 1 lb (454 g)
395451
63/37 CRYSL 502 3% .032DIA 20AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
20 AWG, 21 SWG
C502
-
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
Leaded
Spool, 1 lb (454 g)
24-7070-0061
SOLDER FLUX-CORED/44 .062" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
14 AWG, 16 SWG
44
-
Wire Solder
Sn95Ag5 (95/5)
0.062" (1.57mm)
430 ~ 473°F (221 ~ 245°C)
Rosin Activated (RA)
Lead Free
Spool, 1 lb (454 g)
44-7050-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
ULTRAPURE®
-
Bar Solder
Sn96.3Ag3.7 (96.3/3.7)
-
430 ~ 444°F (221 ~ 223°C)
-
Lead Free
Bar, 1.66 lbs (750g)
92-7068-8801
SOLDER FLUX-CORED/245 .031" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
50°F ~ 104°F (10°C ~ 40°C)
20 AWG, 22 SWG
245
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
Lead Free
Spool, 17.64 oz (500g)
RC9601031PSAC
Canfield Technologies
SAC 305 ROSIN FLUX 1 LB .031 DIA
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Quantity
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PCB Symbol, Footprint & 3D Model
24 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
20 AWG, 22 SWG
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
Rosin Activated (RA)
Lead Free
Spool, 1 lb (454 g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.