Cyclone® V SE Series, System On Chip (SoC)

Results:
113
Manufacturer
Series
Speed
Primary Attributes
Operating Temperature
Supplier Device Package
Package / Case
Core Processor
Grade
Qualification
Architecture
Flash Size
RAM Size
Peripherals
Connectivity
Results remaining113
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Cyclone® V SE
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperatureGradeCore ProcessorSpeedFlash SizeRAM SizePeripheralsArchitectureConnectivityPrimary AttributesPackage / CaseSupplier Device PackageQualification
5CSEBA2U23I7N
IC SOC CORTEX-A9 800MHZ 672UBGA
5+
$520.8333
10+
$486.1111
15+
$468.7500
Quantity
10 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 100°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEBA6U19C7N
IC SOC CORTEX-A9 800MHZ 484UBGA
5+
$2083.3333
10+
$1944.4444
15+
$1875.0000
Quantity
2 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 110K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEBA2U19I7SN
IC SOC CORTEX-A9 800MHZ 484UBGA
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 100°C (TJ)
-
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEMA4U23C6N
IC SOC CORTEX-A9 925MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
925MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEBA2U19A7N
IC SOC CORTEX-A9 700MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
484-FBGA
484-UBGA (19x19)
AEC-Q100
5CSEBA2U19C7SN
IC SOC CORTEX-A9 800MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEBA2U19C8SN
IC SOC CORTEX-A9 600MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
600MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEBA2U23C6N
IC SOC CORTEX-A9 925MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
925MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEBA2U23I7SN
IC SOC CORTEX-A9 800MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 100°C (TJ)
-
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEBA4U19A7N
IC SOC CORTEX-A9 700MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
484-FBGA
484-UBGA (19x19)
AEC-Q100
5CSEMA4U23A7N
IC SOC CORTEX-A9 700MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
672-FBGA
672-UBGA (23x23)
AEC-Q100
5CSEMA4U23C7N
IC SOC CORTEX-A9 800MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEMA4U23C8N
IC SOC CORTEX-A9 600MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
600MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSXFC2C6U23A7N
IC SOC CORTEX-A9 700MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
672-FBGA
672-UBGA (23x23)
AEC-Q100
5CSXFC4C6U23A7N
IC SOC CORTEX-A9 700MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
672-FBGA
672-UBGA (23x23)
AEC-Q100
5CSXFC6D6F31A7N
IC SOC CORTEX-A9 700MHZ 896FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 125°C (TJ)
Automotive
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
700MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 110K Logic Elements
896-BGA
896-FBGA (31x31)
AEC-Q100
5CSEBA2U23I7
IC SOC CORTEX-A9 800MHZ 672UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
-40°C ~ 100°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
672-FBGA
672-UBGA (23x23)
-
5CSEBA2U19C6N
IC SOC CORTEX-A9 925MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
925MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 25K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEBA4U19C6N
IC SOC CORTEX-A9 925MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
925MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
484-FBGA
484-UBGA (19x19)
-
5CSEBA4U19C7SN
IC SOC CORTEX-A9 800MHZ 484UBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cyclone® V SE
0°C ~ 85°C (TJ)
-
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
800MHz
-
64KB
DMA, POR, WDT
MCU, FPGA
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
FPGA - 40K Logic Elements
484-FBGA
484-UBGA (19x19)
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.