Versal™ Prime Series, System On Chip (SoC)

Results:
182
Manufacturer
Series
Supplier Device Package
Package / Case
Speed
Operating Temperature
Primary Attributes
RAM Size
Core Processor
Architecture
Flash Size
Grade
Peripherals
Qualification
Connectivity
Results remaining182
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Versal™ Prime
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperatureGradeFlash SizeRAM SizeArchitectureCore ProcessorPeripheralsConnectivitySpeedPackage / CaseSupplier Device PackagePrimary AttributesQualification
XCVM1502-1MLIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.3GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1LSIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2LSEVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2MLEVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2MSIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2LLENFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1LLIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2MLIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2LLEVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2MLINFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2LLEVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1LLIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-2MLIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1802-2LLIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
Versal™ Prime FPGA, 1.9M Logic Cells
-
XCVM1802-2LLIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
-
-
Versal™ Prime FPGA, 1.9M Logic Cells
-
XCVM1802-2LLIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
450MHz, 1.08GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1.9M Logic Cells
-
XCVM1502-2MSEVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1MLINFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.3GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1LSINFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ Prime FPGA, 1M Logic Cells
-
XCVM1502-1LLINFVB1369
IC VERSALPRIME ACAP FPGA 1369BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 110°C (TJ)
-
-
256KB
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
400MHz, 1GHz
1369-BFBGA, FCBGA
1369-FCBGA (35x35)
Versal™ Prime FPGA, 1M Logic Cells
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.