Versal™ Prime Series, System On Chip (SoC)

Results:
182
Manufacturer
Series
Supplier Device Package
Package / Case
Speed
Operating Temperature
Primary Attributes
RAM Size
Core Processor
Architecture
Flash Size
Grade
Peripherals
Qualification
Connectivity
Results remaining182
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Versal™ Prime
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperatureGradeFlash SizeRAM SizeSpeedArchitectureCore ProcessorPeripheralsConnectivityPrimary AttributesPackage / CaseSupplier Device PackageQualification
XCVM1802-1LLIVFVC1760
IC VERSAL AICORE FPGA 1760BGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
400MHz, 1GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-1LLIVSVD1760
IC VERSAL AICORE FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
400MHz, 1GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-2LLEVSVD1760
IC VERSAL AICORE FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
256KB
450MHz, 1.08GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-2MLIVFVC1760
IC VERSAL AICORE FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-2HSIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
800MHz, 1.65GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-1LLIVSVA2197
IC VERSAL AICORE FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
400MHz, 1GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
-
XCVM1802-2LLEVSVA2197
IC VERSAL AICORE FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
256KB
450MHz, 1.08GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
-
XCVM1802-2HSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
800MHz, 1.65GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-2MLIVSVD1760
IC VERSAL AICORE FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-2MLIVSVA2197
IC VERSAL AICORE FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
-
XCVM1802-2HSIVSVA2197
IC VERSALPRIME ACAP FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
256KB
800MHz, 1.65GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
-
XCVM1402-1MSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
-
600MHz, 1.3GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1402-2MSEVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
-
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1402-2LSENBVB1024
IC VERSALPRIME ACAP FPGA 1024BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
-
450MHz, 1.08GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1024-BFBGA
1024-BGA (31x31)
-
XCVM1402-2MLENBVB1024
IC VERSALPRIME ACAP FPGA 1024BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
-
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1024-BFBGA
1024-BGA (31x31)
-
XCVM1402-1LSINBVB1024
IC VERSALPRIME ACAP FPGA 1024BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
-
400MHz, 1GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1024-BFBGA
1024-BGA (31x31)
-
XCVM1402-1MLINBVB1024
IC VERSALPRIME ACAP FPGA 1024BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
-
600MHz, 1.3GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1024-BFBGA
1024-BGA (31x31)
-
XCVM1402-1LSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
-40°C ~ 100°C (TJ)
-
-
-
400MHz, 1GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1402-2MLEVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
-
600MHz, 1.4GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.2M Logic Cells
1760-BFBGA, FCBGA
1760-FCBGA (40x40)
-
XCVM1802-1MSEVSVA2197
IC VERSAL AICORE FPGA 2197BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Versal™ Prime
0°C ~ 100°C (TJ)
-
-
256KB
600MHz, 1.3GHz
MPU, FPGA
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Versal™ Prime FPGA, 1.9M Logic Cells
2197-BFBGA, FCBGA
2197-FCBGA (45x45)
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.