SmartFusion®2 Series, System On Chip (SoC)

Results:
675
Manufacturer
Series
Supplier Device Package
Package / Case
Primary Attributes
Operating Temperature
Flash Size
Peripherals
Grade
Qualification
Core Processor
Speed
Architecture
RAM Size
Connectivity
Results remaining675
Applied Filters:
SmartFusion®2
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesPackage / CasePeripheralsSupplier Device PackageOperating TemperatureGradeCore ProcessorFlash SizeRAM SizeSpeedConnectivityArchitecturePrimary AttributesQualification
M2S010-TQG144I
IC SOC CORTEX-M3 166MHZ 144TQFP
5+
¥479.1667
10+
¥447.2222
15+
¥431.2500
Quantity
220 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
144-LQFP
-
144-TQFP (20x20)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 10K Logic Modules
-
M2S010-VFG256I
IC SOC CORTEX-M3 166MHZ 256FBGA
5+
¥191.6667
10+
¥178.8889
15+
¥172.5000
Quantity
218 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
256-LFBGA
DDR, PCIe, SERDES
256-FPBGA (14x14)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 10K Logic Modules
-
M2S050-FCSG325I
IC SOC CORTEX-M3 166MHZ 325BGA
5+
¥833.3333
10+
¥777.7778
15+
¥750.0000
Quantity
176 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
325-TFBGA, FCBGA
DDR, PCIe, SERDES
325-FCBGA (11x11)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 50K Logic Modules
-
M2S090TS-1FGG484M
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥625.0000
10+
¥583.3333
15+
¥562.5000
Quantity
150 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-55°C ~ 125°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 90K Logic Modules
-
M2S005S-TQG144I
IC SOC CORTEX-M3 166MHZ 144TQFP
5+
¥41.6667
10+
¥38.8889
15+
¥37.5000
Quantity
144 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
144-LQFP
-
144-TQFP (20x20)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
128KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 5K Logic Modules
-
M2S090T-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥500.0000
10+
¥466.6667
15+
¥450.0000
Quantity
125 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 90K Logic Modules
-
M2S050T-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥375.0000
10+
¥350.0000
15+
¥337.5000
Quantity
120 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 50K Logic Modules
-
M2S010-VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
¥87.6250
10+
¥81.7833
15+
¥78.8625
Quantity
90 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
400-LFBGA
DDR, PCIe, SERDES
400-VFBGA (17x17)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 10K Logic Modules
-
M2S025T-1VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
¥204.1667
10+
¥190.5556
15+
¥183.7500
Quantity
80 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
400-LFBGA
DDR, PCIe, SERDES
400-VFBGA (17x17)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 25K Logic Modules
-
M2S005-FGG484
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥125.0000
10+
¥116.6667
15+
¥112.5000
Quantity
70 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR
484-FPBGA (23x23)
0°C ~ 85°C (TJ)
-
ARM® Cortex®-M3
128KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 5K Logic Modules
-
M2S005-VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
¥66.6667
10+
¥62.2222
15+
¥60.0000
Quantity
70 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
400-LFBGA
DDR
400-VFBGA (17x17)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
128KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 5K Logic Modules
-
M2S060T-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥458.3333
10+
¥427.7778
15+
¥412.5000
Quantity
55 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 60K Logic Modules
-
M2S090TS-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥775.2083
10+
¥723.5278
15+
¥697.6875
Quantity
54 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 90K Logic Modules
-
M2S090T-1FG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥604.1667
10+
¥563.8889
15+
¥543.7500
Quantity
53 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 90K Logic Modules
-
M2S090-FG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥510.4167
10+
¥476.3889
15+
¥459.3750
Quantity
50 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 90K Logic Modules
-
M2S025TS-FGG484
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥1041.6667
10+
¥972.2222
15+
¥937.5000
Quantity
48 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
0°C ~ 85°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 25K Logic Modules
-
M2S050T-FGG484
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥281.2500
10+
¥262.5000
15+
¥253.1250
Quantity
48 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BGA
DDR, PCIe, SERDES
484-FPBGA (23x23)
0°C ~ 85°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 50K Logic Modules
-
M2S010-VFG256
IC SOC CORTEX-M3 166MHZ 256FBGA
5+
¥68.7500
10+
¥64.1667
15+
¥61.8750
Quantity
38 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
256-LBGA
DDR, PCIe, SERDES
256-FPBGA (17x17)
0°C ~ 85°C (TJ)
-
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 10K Logic Modules
-
M2S150-FCVG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
¥3120.8333
10+
¥2912.7778
15+
¥2808.7500
Quantity
34 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
484-BFBGA
DDR, PCIe, SERDES
484-FBGA (19x19)
-40°C ~ 100°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 150K Logic Modules
-
M2S150TS-1FCG1152
IC SOC CORTEX-M3 166MHZ 1152BGA
5+
¥1041.6667
10+
¥972.2222
15+
¥937.5000
Quantity
34 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
1152-BBGA, FCBGA
DDR, PCIe, SERDES
1152-FCBGA (35x35)
0°C ~ 85°C (TJ)
-
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
FPGA - 150K Logic Modules
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.