SmartFusion®2 Series, System On Chip (SoC)

Results:
675
Manufacturer
Series
Supplier Device Package
Package / Case
Primary Attributes
Operating Temperature
Flash Size
Peripherals
Grade
Qualification
Core Processor
Speed
Architecture
RAM Size
Connectivity
Results remaining675
Applied Filters:
SmartFusion®2
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperaturePackage / CaseGradeSupplier Device PackageCore ProcessorFlash SizeRAM SizeSpeedConnectivityArchitecturePeripheralsPrimary AttributesQualification
M2S090-FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
$458.3333
10+
$427.7778
15+
$412.5000
Quantity
30 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
484-BGA
-
484-FPBGA (23x23)
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 90K Logic Modules
-
M2S060TS-FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
$666.6667
10+
$622.2222
15+
$600.0000
Quantity
27 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
484-BGA
-
484-FPBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S050-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
$1562.5000
10+
$1458.3333
15+
$1406.2500
Quantity
21 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
484-BGA
-
484-FPBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 50K Logic Modules
-
M2S005S-VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
5+
$3750.0000
10+
$3500.0000
15+
$3375.0000
Quantity
20 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
400-LFBGA
-
400-VFBGA (17x17)
ARM® Cortex®-M3
128KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR
FPGA - 5K Logic Modules
-
M2S150TS-1FCG1152I
IC SOC CORTEX-M3 166MHZ 1152BGA
5+
$1562.5000
10+
$1458.3333
15+
$1406.2500
Quantity
3 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
-
1152-FCBGA (35x35)
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 150K Logic Modules
-
M2S060T-1VFG400I
IC SOC CORTEX-M3 166MHZ 400VFBGA
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
400-LFBGA
-
400-VFBGA (17x17)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S050T-1FG896
IC SOC CORTEX-M3 166MHZ 896FBGA
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
896-BGA
-
896-FBGA (31x31)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 50K Logic Modules
-
M2S060T-1FGG484M
IC SOC CORTEX-M3 166MHZ 484FBGA
Contact us
Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-55°C ~ 125°C (TJ)
484-BGA
-
484-FPBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S090TS-1FG676I
IC SOC CORTEX-M3 166MHZ 676FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
676-BGA
-
676-FBGA (27x27)
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 90K Logic Modules
-
M2S090TS-1FGG676I
IC SOC CORTEX-M3 166MHZ 676FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
676-BGA
-
676-FBGA (27x27)
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 90K Logic Modules
-
M2S150TS-1FC1152I
IC SOC CORTEX-M3 166MHZ 1152BGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
-
1152-FCBGA (35x35)
ARM® Cortex®-M3
512KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 150K Logic Modules
-
M2S060T-VFG784
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060T-1VFG784
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060T-VFG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060TS-VFG784
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060T-1VFG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060TS-VFG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060TS-1VFG784
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S060TS-1VFG784I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
-40°C ~ 100°C (TJ)
784-FBGA
-
784-VFBGA (23x23)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 60K Logic Modules
-
M2S050T-FG896
IC SOC CORTEX-M3 166MHZ 896FBGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
SmartFusion®2
0°C ~ 85°C (TJ)
896-BGA
-
896-FBGA (31x31)
ARM® Cortex®-M3
256KB
64KB
166MHz
CANbus, Ethernet, I²C, SPI, UART/USART, USB
MCU, FPGA
DDR, PCIe, SERDES
FPGA - 50K Logic Modules
-

About  System On Chip (SoC)

System on Chip (SoC) refers to an integrated circuit that combines various components of a computer system onto a single chip. It typically includes a processor core, memory, input/output interfaces, and other peripherals necessary for the system's operation. SoC technology enables the creation of compact, power-efficient, and highly integrated embedded systems. Functionality and Features: SoCs integrate multiple system components into a single chip, providing a complete solution in a compact form factor. They often include a processor core, such as an ARM Cortex-A series or a RISC-V core, along with memory units (RAM and/or flash memory), input/output interfaces (USB, Ethernet, UART, etc.), timers, interrupts, analog-to-digital converters (ADCs), and other peripherals required for specific applications. SoCs can be customized and programmed to perform diverse functions based on the application requirements. Usage Scenarios: SoCs are commonly used in embedded systems where space, power efficiency, and integration are crucial. They find applications in a wide range of scenarios, including consumer electronics (smartphones, tablets, smart TVs), automotive systems (infotainment, engine control, Advanced Driver-Assistance Systems), industrial automation, medical devices, Internet of Things (IoT) devices, and more. SoCs enable the development of feature-rich, compact, and cost-effective embedded systems. Application Fields: SoCs are utilized across various industries and fields. In consumer electronics, they power smartphones, tablets, wearable devices, and home appliances. Automotive systems rely on SoCs for in-car entertainment, navigation, and safety features. Industrial automation utilizes SoCs for control systems, robotics, and monitoring equipment. Medical devices, such as implantable devices and diagnostic tools, benefit from the compactness and integration provided by SoCs. SoCs also play a significant role in IoT devices, enabling connectivity, sensor integration, and intelligent processing. Key Advantages: Integration: SoCs integrate multiple system components into a single chip, reducing size, complexity, and power consumption. Compactness: The combination of various components onto a single chip enables the creation of compact and portable embedded systems. Power Efficiency: SoCs are designed to optimize power consumption, making them suitable for battery-powered and energy-efficient applications. Customizability: SoCs can be customized and programmed to meet specific application requirements, offering flexibility and adaptability. Cost-Effectiveness: SoCs provide a cost-effective solution by integrating multiple components onto a single chip, reducing the need for additional hardware. In summary, an Embedded System on Chip (SoC) is an integrated circuit that combines multiple system components onto a single chip. SoCs offer compactness, power efficiency, customization, and cost-effectiveness, making them ideal for a wide range of embedded system applications across various industries.