Adhesives, Epoxies, Greases, Pastes

Results:
648
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining648
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesColorTypeSize / DimensionFeaturesShelf LifeStorage/Refrigeration TemperatureUsable Temperature RangeThermal Conductivity
V5656
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
V5350
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Thermal Compound
50 gram Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
V5415
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Thermal Compound
15 gram Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
V5314
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Thermal Compound
25 kg Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
V5312
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Thermal Compound
250 gram Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.80W/m-K
V6515
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray, White
Thermal Compound
500 gram Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.50W/m-K
V6515H
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray, White
Thermal Compound
25 kg Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.50W/m-K
V6512
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray, White
Thermal Compound
35 gram Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.50W/m-K
V6514-D
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray, White
Thermal Compound
25 kg Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.50W/m-K
V6515H1
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray, White
Thermal Compound
10 kg Container
-
36 Months
32°F ~ 104°F (0°C ~ 40°C)
-40°F ~ 302°F (-40°C ~ 150°C)
0.50W/m-K
NTE303
1 GRAM THERMAL GREASE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
White
Silicone Grease
1 gram Tube
-
-
-
-40°F ~ 401°F (-40°C ~ 205°C)
-
V5657-PEN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Thermal Compound
-
-
9 Months
64.4°F ~ 77°F (18°C ~ 25°C)
-
-
NTE424
1 OZ HEAT SINK COMPOUND
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Quantity
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PCB Symbol, Footprint & 3D Model
NTE303A
SILICON THERMAL COMP 1OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
TG-N8000-330CC
NON-SILICONE PUTTY 330CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
TG-N8000
Yellow
Non-Silicone Putty
330cc Syringe
-
-
-
-40°C ~ 125°C
8.00W/m-K
65-00-GEL60HF-0300
THERM-A-GAP GEL 60HF 6.2 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
THERM-A-GAP™ GEL 60HF
Black, Gray
Silicone Gel
300cc Cartridge
Low Outgassing (ASTM E595)
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
-67°F ~ 392°F (-55°C ~ 200°C)
6.2W/m-K
8327GL3-180ML
PREMIUM THERMAL GEL, 3 W/(MK)
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Quantity
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PCB Symbol, Footprint & 3D Model
8327GL3
White
Non-Silicone Gel
180 ml Cartridge
-
24 Months
61°F ~ 81°F (16°C ~ 27°C)
-40°F ~ 248°F (-40°C ~ 120°C)
3.50W/m-K
PT610_0.8_0.1
Flame retardant potting epoxy (2
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Quantity
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PCB Symbol, Footprint & 3D Model
PT610
Black, Clear Yellowish
Potting Compound, 2 Part
100 gram Jar, 800 gram Jar
-
12 Months
-
77°F ~ 176°F (25°C ~ 80°C)
-
65-00-GEL60HF-0010
THERM-A-GAP GEL 60HF 6.2 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
THERM-A-GAP™ GEL 60HF
Black, Gray
Silicone Gel
10cc Syringe
Low Outgassing (ASTM E595)
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
-67°F ~ 392°F (-55°C ~ 200°C)
6.2W/m-K
65-00-GEL20-0010
THERM-A-GAP GEL 20 2.4 W/M-K DIS
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Quantity
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PCB Symbol, Footprint & 3D Model
THERM-A-GAP™ GEL 20
Blue
Gel Gap Filler
10cc Syringe
Low Outgassing (ASTM E595)
18 Months
50°F ~ 90°F (10°C ~ 32.22°C)
-67°F ~ 392°F (-55°C ~ 200°C)
2.4W/m-K

Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.