Adhesives, Epoxies, Greases, Pastes

Results:
648
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining648
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ImageProduct DetailPriceAvailabilityECAD ModelColorShelf LifeStorage/Refrigeration TemperatureTypeSeriesSize / DimensionUsable Temperature RangeThermal ConductivityFeatures
A14399-01
THERMAL GREASE 10CC TGREASE 2500
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
-
Non-Silicone Grease
Tgrease™ 2500
10cc Syringe
-67°F ~ 302°F (-50°C ~ 150°C)
3.80W/m-K
Low Outgassing (ASTM E595)
PT366_0.5_0.25
Black potting epoxy (2-parts)
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, Clear Yellowish
12 Months
-
Potting Compound, 2 Part
PT366
250 gram Jar, 500 gram Jar
-40°F ~ 302°F (-40°C ~ 150°C)
-
-
TG-N8000-1000
NON-SILICONE PUTTY 1KG POT YELLO
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Quantity
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PCB Symbol, Footprint & 3D Model
Yellow
-
-
Non-Silicone Putty
TG-N8000
1 kg Jar
-40°C ~ 125°C
8.00W/m-K
-
65-00-GEL40NS-0300
THERM-A-GAP GEL 40NS 4.0 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
Non-Silicone Gel
THERM-A-GAP™ GEL 40NS
300cc Cartridge
-58°F ~ 257°F (-50°C ~ 125°C)
4.0W/m-K
Low Outgassing (ASTM E595)
65-02-GEL60HF-0180
THERM-A-GAP GEL 60HF 6.2 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
Silicone Gel
THERM-A-GAP™ GEL 60HF
180cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
6.2W/m-K
Low Outgassing (ASTM E595)
8327GL5-180ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
24 Months
61°F ~ 81°F (16°C ~ 27°C)
Non-Silicone Gel
8327GL5
180 ml Cartridge
-67°F ~ 302°F (-55°C ~ 150°C)
5.10W/m-K
-
TG-N8000-55CC
NON-SILICONE PUTTY 55CC SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Yellow
-
-
Non-Silicone Putty
TG-N8000
55cc Syringe
-40°C ~ 125°C
8.00W/m-K
-
65-02-GEL60HF-0030
THERM-A-GAP GEL 60HF 6.2 W/M-K D
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Quantity
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PCB Symbol, Footprint & 3D Model
Black, Gray
12 Months
50°F ~ 90°F (10°C ~ 32.22°C)
Silicone Gel
THERM-A-GAP™ GEL 60HF
30cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
6.2W/m-K
Low Outgassing (ASTM E595)
8327GL5-30ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
24 Months
61°F ~ 81°F (16°C ~ 27°C)
Non-Silicone Gel
8327GL5
30 ml Cartridge
-67°F ~ 302°F (-55°C ~ 150°C)
5.10W/m-K
-
8327GL6-25ML
NON-SILICONE LIQUID THERMAL GEL,
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
61°F ~ 81°F (16°C ~ 27°C)
Non-Silicone Gel
8327GL6
25 ml Jar
-40°F ~ 248°F (-40°C ~ 120°C)
6.00W/m-K
-
TG-NSP35-1LB
THERMAL NON-SILICONE PUTTY 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
60 Months
-
Non-Silicone Putty
TG
1 lb Can
-40°F ~ 392°F (-40°C ~ 200°C)
3.50W/m-K
-
DM-TIM-15015-SYP-10
Dycotec Materials Ltd
NON-SILICONE THERMAL GEL, 2.5 W/
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
-
-
Non-Silicone Paste
DM-TIM
10cc Syringe
-40°C ~ 125°C
1.50W/m-K
-
2750519
TGF3000SF-00-1500-1200CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
6 Months
77°F (25°C)
Liquid Gap Filler, 2 Part
Gap Filler 3000SF
1200cc Cartridge
-40°F ~ 212°F (-40°C ~ 100°C)
3.00W/m-K
-
2711513
GF4500CVO-00-240-50CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Pink
6 Months
77°F (25°C)
Liquid Gap Filler, 2 Part
Gap Filler 4500CVO
50cc Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
4.50W/m-K
-
TG-HHDSG-30
DISPENSING SYS 30CC EFD SYRINGES
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Quantity
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PCB Symbol, Footprint & 3D Model
-
120 Months
-
-
TG
-
-
-
-
GF2000-00-15-50CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Pink
6 Months
77°F (25°C)
Liquid Gap Filler, 2 Part
Gap Filler 2000
50cc Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
2.0W/m-K
-
1188267
CATALYST 9 UNPIG 1LB INDIV
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
18 Months
-
Catalyst
STYCAST™ 2651™
-
-40°F ~ 266°F (-40°C ~ 130°C)
-
-
152-1B-NC
DELTABOND BIPACK (1 OZ W B TYPE
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Quantity
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PCB Symbol, Footprint & 3D Model
-
36 Months
-
Acrylic Adhesive
DeltaBond™ 152
1 oz Packet
302°F (150°C)
0.90W/m-K
-
103700F00000G
1.5 OZ. SYRINGE GREASE NON-SILIC
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Quantity
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PCB Symbol, Footprint & 3D Model
White
24 Months
-
Non-Silicone Grease
-
1.5 oz Syringe
-40°F ~ 356°F (-40°C ~ 180°C)
1.40W/m-K
-
TG-NSP35-4OZ
THERMAL NON-SILICONE PUTTY 4OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
Gray
60 Months
-
Non-Silicone Putty
TG
4 oz Tube
-40°F ~ 392°F (-40°C ~ 200°C)
3.50W/m-K
-

Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.