Adhesives, Epoxies, Greases, Pastes

Results:
648
Manufacturer
Series
Size / Dimension
Thermal Conductivity
Usable Temperature Range
Type
Storage/Refrigeration Temperature
Color
Shelf Life
Features
Results remaining648
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ImageProduct DetailPriceAvailabilityECAD ModelColorShelf LifeStorage/Refrigeration TemperatureSeriesTypeSize / DimensionUsable Temperature RangeThermal ConductivityFeatures
A16872-05
TPUTTY 403 600CC CARTRIDGE
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Quantity
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PCB Symbol, Footprint & 3D Model
White
24 Months
-
Tputty™ 403
Liquid Gap Filler
600cc Cartridge
-49°F ~ 302°F (-45°C ~ 150°C)
2.30W/m-K
Low Outgassing (ASTM E595)
A16858-08
TFLEX CR200 8 MIL 200CC CARTRIDG
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Yellow
-
-
Tflex™ CR200
Liquid Gap Filler
200cc Cartridge
-40°F ~ 392°F (-40°C ~ 200°C)
2.00W/m-K
-
A16858-02
TFLEX CR200 200CC CARTRIDGE
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Yellow
-
-
Tflex™ CR200
Liquid Gap Filler
200cc Cartridge
-40°F ~ 392°F (-40°C ~ 200°C)
2.00W/m-K
-
S606N-30
NON SILICONE THERMAL GREASE 30G
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Quantity
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PCB Symbol, Footprint & 3D Model
White
18 Months
77°F (25°C) or Below
S606N
Non-Silicone Grease
30 gram Jar
-49°F ~ 392°F (-45°C ~ 200°C)
2.50W/m-K
-
S606B-50
SILICONE THERMAL GREASE 50G JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
White
18 Months
77°F (25°C) or Below
S606
Silicone Grease
50 gram Jar
-40°F ~ 356°F (-40°C ~ 180°C)
1.80W/m-K
-
S606-30
SILICONE THERMAL GREASE 30G JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
White
18 Months
77°F (25°C) or Below
S606
Silicone Grease
30 gram Jar
-40°F ~ 356°F (-40°C ~ 180°C)
3.60W/m-K
-
A16241-02
THERMAL GREASE 30CC TGREASE 2500
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
-
Tgrease™ 2500
Non-Silicone Grease
30cc Jar
-67°F ~ 302°F (-50°C ~ 150°C)
3.80W/m-K
Low Outgassing (ASTM E595)
8463-7G
GREASE SILVER CONDUCTIVE 0.25OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
Silver
60 Months
14°F ~ 104°F (-10°C ~ 40°C)
-
Silicone Grease
7 gram Syringe
-58°F ~ 392°F (-50°C ~ 200°C)
0.46W/m-K
Odorless
152-1A-NC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
36 Months
-
DeltaBond™ 152
Acrylic Adhesive
1 oz Packet
-
0.83W/m-K
-
A17262-03
TFLEX CR607 CARTRIDGE 400CC,EFD
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Blue
6 Months
-
Tflex™ CR607
Silicone Gap Filler
400cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
6.40W/m-K
-
GF3500LV-00-240-50CC
GAP FILLER 3500LV 50CC CARTRIDGE
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Quantity
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PCB Symbol, Footprint & 3D Model
Blue
5 Months
77°F (25°C)
Gap Filler 3500LV
Liquid Gap Filler, 2 Part
50cc Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
3.50W/m-K
Low Outgassing
A15819-05
THERMAL GREASE 3KG TGREASE 1500
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Quantity
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PCB Symbol, Footprint & 3D Model
White
-
-
Tgrease™ 1500
Silicone Compound
3 kg Container
257°F (125°C)
1.20W/m-K
Low Outgassing (ASTM E595)
S606B-1000
SILICONE THERMAL GREASE 1KG
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Quantity
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PCB Symbol, Footprint & 3D Model
White
24 Months
77°F (25°C) or Below
S606
Silicone Grease
1 kg Container
-40°F ~ 356°F (-40°C ~ 180°C)
1.80W/m-K
-
A17262-02
TFLEX CR607 CARTRIDGE 200CC,EFD
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Quantity
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PCB Symbol, Footprint & 3D Model
White, Blue
6 Months
-
Tflex™ CR607
Silicone Gap Filler
200cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
6.40W/m-K
-
103800F00000G
2.0 OZ. TUBE GREASE NON-SILICONE
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Quantity
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PCB Symbol, Footprint & 3D Model
White
24 Months
-
-
Non-Silicone Grease
2 oz Tube
-40°F ~ 356°F (-40°C ~ 180°C)
1.40W/m-K
-
TC4-2G
HEAT SINK THERMAL COMPOUND - DEE
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Quantity
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PCB Symbol, Footprint & 3D Model
Silver
60 Months
68°F ~ 77°F (20°C ~ 25°C)
CHIPQUIK®
Silicone Compound
2 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
79.00 W/m-K
-
TC1-20G
HEAT SINK COMPOUND - HIGH DENSIT
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Quantity
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PCB Symbol, Footprint & 3D Model
White
60 Months
37°F ~ 77°F (3°C ~ 25°C)
-
Silicone Compound
20 gram Syringe
-
0.67W/m-K
-
P0200-19
HEAT SINK COMP. SARAN PKG 2GR
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Quantity
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PCB Symbol, Footprint & 3D Model
-
12 Months
-
P0200
Non-Silicone Compound
2 gram Package
-
-
-
1188119
STYCAST 2850FT BLK18# 8.16KG
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Quantity
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PCB Symbol, Footprint & 3D Model
Black
18 Months
64.4°F ~ 77°F (18°C ~ 25°C)
LOCTITE® Stycast 2850FT
Epoxy, 2 Part (Order Catalyst Separately)
8.16 kg Container
-85°F ~ 221°F (-65°C ~ 105°C)
-
-
65-00-CIP35-0200
THERM-A-FORM CIP35 POTTING 200CC
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Quantity
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PCB Symbol, Footprint & 3D Model
Green
12 Months
-
THERM-A-FORM™ CIP35
Silicone Compound, 2 Part
200cc Cartridge
-67°F ~ 392°F (-55°C ~ 200°C)
3.50W/m-K
Low Outgassing (ASTM E595)

Adhesives, Epoxies, Greases, Pastes

Products in this category, which include fluids, gels, or semi-solids, are specifically designed to enhance and optimize heat transfer between different objects. They are commonly used in applications such as facilitating heat dissipation between transistors and heatsinks or improving thermal conductivity between printed circuit board assemblies and device enclosures. These thermal management products come in various forms and compositions, each with its own unique properties and functions. Some materials, such as thermal pastes or thermal greases, are specifically formulated to fill gaps or imperfections between surfaces, ensuring optimal contact and maximizing thermal conductivity. This helps eliminate air pockets that can hinder heat transfer, resulting in improved performance and reliability of the system. Additionally, certain products in this family offer additional functionalities beyond heat transfer enhancement. For example, some materials have adhesive properties that enable them to bond surfaces together, providing mechanical stability and improved thermal performance. This is particularly useful in situations where traditional mechanical attachment methods may not be feasible or desired. Furthermore, certain thermal management products possess mechanical cushioning and shock-absorbing properties. They act as a protective layer between components, minimizing the impact of mechanical stress or vibrations on sensitive electronics. This helps prevent damage and ensures the long-term reliability of the system. Moreover, some materials in this category provide environmental sealing capabilities, protecting electronic components from external contaminants such as moisture, dust, or other particles. This is crucial for maintaining the integrity and longevity of the devices, particularly in harsh or demanding environments. In summary, the products in this family play a vital role in optimizing thermal management by enhancing heat transfer, filling gaps, providing adhesive bonding, offering mechanical cushioning, and ensuring environmental sealing. Their diverse range of functions contributes to improved performance, reliability, and lifespan of various systems and devices across industries such as electronics, telecommunications, automotive, and more.