Heat Pipes, Vapor Chambers

Results:
1,341
Manufacturer
Series
Power - Cooling
Width
Length
Height
Thermal Resistance
Diameter
Operating Temperature
Shape
Platform
Attachment Method
Wick Type
Material
Type
Features
Results remaining1,341
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesTypeFeaturesOperating TemperatureLengthShapeHeightMaterialWidthDiameterPlatformAttachment MethodThermal ResistanceWick TypePower - Cooling
126627
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126762
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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7.874" (200.00mm)
Flat
0.374" (9.50mm)
Copper
0.405" (10.29mm)
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Epoxy or Solder
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Sintered
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126476
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126522
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126598
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126632
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126061
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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19.685" (500.00mm)
Flat
0.106" (2.70mm)
Copper
0.434" (11.03mm)
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Epoxy or Solder
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Sintered
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126030
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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17.717" (450.00mm)
Flat
0.098" (2.50mm)
Copper
0.439" (11.14mm)
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Epoxy or Solder
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Sintered
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126244
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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17.717" (450.00mm)
Flat
0.157" (4.00mm)
Copper
0.405" (10.29mm)
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Epoxy or Solder
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Sintered
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126433
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126142
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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17.717" (450.00mm)
Flat
0.126" (3.20mm)
Copper
0.423" (10.74mm)
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Epoxy or Solder
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Sintered
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126475
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126517
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126593
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126293
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126661
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126559
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126342
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126391
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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126060
FLATTENED, COPPER HEATPIPE, SINT
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Quantity
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PCB Symbol, Footprint & 3D Model
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Heat Pipe
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17.717" (450.00mm)
Flat
0.106" (2.70mm)
Copper
0.434" (11.03mm)
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Epoxy or Solder
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Sintered
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Heat Pipes, Vapor Chambers

Thermal heat pipes and vapor chambers are essential devices used for transferring heat between two interfaces. They work by heating a liquid until it becomes a vapor on the hot interface, after which the vapor travels to the cold interface and condenses back into a liquid. This process allows for efficient thermal transfer across a wide range of temperatures and applications. These heat transfer devices come in various shapes such as flat, rectangular, round, and square, with each shape being suitable for different types of systems and spaces. The choice of shape depends on factors such as available space, power requirements, and desired cooling performance. Moreover, thermal heat pipes and vapor chambers are identified by their unique properties such as power cooling, thermal resistance, and wick type. These characteristics determine the efficiency and effectiveness of the device in transferring heat in different environments and applications. Power cooling refers to the rate at which the device can dissipate heat, while thermal resistance measures the ability of the device to resist heat flow. Wick type, on the other hand, refers to the material used to line the interior of the device, which affects the rate and efficiency of heat transfer. In summary, thermal heat pipes and vapor chambers are crucial devices used in various industries for efficient thermal management. Their ability to transfer heat between two interfaces with high efficiency and reliability makes them essential for achieving optimal performance and longevity of electronic devices, power systems, and other applications that require efficient heat dissipation. The choice of device depends on factors such as available space, power requirements, and desired cooling performance, with their unique properties determining their efficiency and effectiveness in different applications.