Heat Sinks

Results:
113,763
Manufacturer
Series
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Width
Fin Height
Length
Power Dissipation @ Temperature Rise
Package Cooled
Diameter
Attachment Method
Material Finish
Type
Shape
Material
Thread/Screw/Hole Size
Length - Center to Center
Mounting Type
For Use With/Related Products
Height
Accessory Type
Results remaining113,763
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMaterialDiameterLengthWidthTypePackage CooledAttachment MethodShapeFin HeightPower Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterial Finish
SA000-13007
PUSHPIN HEATSINK 43X43X10MM
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Aluminum
-
1.705" (43.30mm)
1.713" (43.50mm)
Top Mount
-
Push Pin
Square, Fins
0.394" (10.00mm)
-
-
-
-
MPC222225T
AMEC Thermasol
CERAMIC HEAT SINK - FLAT TYPE
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
MPC
Ceramic
-
0.866" (22.00mm)
0.866" (22.00mm)
Top Mount
-
-
Square
0.108" (2.75mm)
-
-
-
-
40408
BOM ASSY 4623 DUAL HTSNK 19MM
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
960-23-18-F-AB-0
HEATSINK 23X18MM FRONT PUSH PIN
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
960
Aluminum
-
0.906" (23.00mm)
0.906" (23.00mm)
Top Mount
BGA
Push Pin
Square, Pin Fins
0.709" (18.00mm)
-
4.50°C/W @ 200 LFM
-
Black Anodized
529701B02500G
HEATSINK TO-218 SOLDER PIN
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Aluminum
-
1.000" (25.40mm)
1.650" (41.91mm)
Board Level, Vertical
TO-218
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
12.0W @ 70°C
4.00°C/W @ 200 LFM
5.50°C/W
Black Anodized
508500B00000G
HEATSINK 24-PIN DIP GLUE-ON BLK
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Aluminum
-
1.250" (31.75mm)
0.530" (13.46mm)
Top Mount
24-DIP
Thermal Tape, Adhesive (Not Included)
Rectangular, Fins
0.190" (4.83mm)
1.0W @ 40°C
15.00°C/W @ 500 LFM
34.00°C/W
Black Anodized
HSB10-232306
HEAT SINK, BGA, 23 X 23 X 6 MM
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
HSB
Aluminum Alloy
-
0.906" (23.00mm)
0.906" (23.00mm)
Top Mount
BGA
Adhesive
Square, Pin Fins
0.236" (6.00mm)
3.0W @ 75°C
9.60°C/W @ 200 LFM
25.46°C/W
Black Anodized
XL25W-12-12-10
CERAMIC HEAT SINK 12X12X10MM WHI
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
XL-25
Ceramic
-
0.472" (12.00mm)
0.472" (12.00mm)
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape
Square
0.394" (10.00mm)
-
-
-
-
574602B03300G
HEATSINK TO-220 CLIP-ON/TAB
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Aluminum
-
0.690" (17.53mm)
0.860" (21.84mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.395" (10.03mm)
3.0W @ 60°C
6.00°C/W @ 600 LFM
21.60°C/W
Black Anodized
960-19-23-S-AB-0
HEATSINK 19X23MM SIDE PUSH PIN
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
960
Aluminum
-
0.748" (19.00mm)
0.748" (19.00mm)
Top Mount
BGA
Push Pin
Square, Pin Fins
0.905" (23.00mm)
-
4.80°C/W @ 200 LFM
-
Black Anodized
574902B04300G
HEATSINK TO-220 VERT MNT W/TAB
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Quantity
1 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
Aluminum
-
1.375" (34.93mm)
0.860" (21.84mm)
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.395" (10.03mm)
2.5W @ 40°C
6.00°C/W @ 400 LFM
16.00°C/W
Black Anodized
ATS-07H-121-C3-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.969" (50.00mm)
1.969" (50.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.394" (10.00mm)
-
9.56°C/W @ 100 LFM
-
Blue Anodized
ATS-08H-78-C1-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
0.984" (25.00mm)
0.984" (25.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.378" (35.00mm)
-
7.64°C/W @ 100 LFM
-
Blue Anodized
ATS-08H-151-C1-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.378" (35.00mm)
1.378" (35.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.181" (30.00mm)
-
3.90°C/W @ 100 LFM
-
Blue Anodized
ATS-08H-174-C1-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.181" (30.00mm)
1.181" (30.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.378" (35.00mm)
-
3.98°C/W @ 100 LFM
-
Blue Anodized
ATS-20C-100-C2-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.772" (45.00mm)
1.772" (45.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
-
8.70°C/W @ 100 LFM
-
Blue Anodized
ATS-20C-205-C2-R0
Contact us
Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
2.362" (60.00mm)
2.362" (60.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.236" (6.00mm)
-
13.00°C/W @ 100 LFM
-
Blue Anodized
ATS-21C-70-C2-R0
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Quantity
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PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.772" (45.00mm)
1.772" (45.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
-
8.70°C/W @ 100 LFM
-
Blue Anodized
ATS-21C-100-C2-R0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.772" (45.00mm)
1.772" (45.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
-
8.70°C/W @ 100 LFM
-
Blue Anodized
ATS-01D-66-C2-R0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
pushPIN™
Aluminum
-
1.575" (40.00mm)
1.575" (40.00mm)
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.378" (35.00mm)
-
5.77°C/W @ 100 LFM
-
Blue Anodized

Heat Sinks

Passive heat exchangers play a crucial role in dissipating the heat generated by electronic components and maintaining their optimal operating temperature. These devices transfer the excess heat to a fluid medium, typically air or a liquid coolant, effectively removing it from the component. The design of passive heat exchangers is focused on maximizing the contact surface area between the heat exchanger and the surrounding medium. By increasing the surface area, more heat can be transferred and dissipated efficiently. This is achieved through various design elements such as fins, ridges, or extended surfaces that protrude from the main body of the heat exchanger. These features enhance the heat transfer process by providing additional surface area for the heat to be transferred to the fluid medium. To ensure effective heat transfer, passive heat exchangers are commonly made from materials with high thermal conductivity, such as copper or aluminum. These materials allow for efficient transmission of heat from the electronic component to the heat exchanger and then to the surrounding medium. Copper and aluminum are preferred due to their excellent thermal properties, lightweight nature, and cost-effectiveness. Passive heat exchangers can take different forms depending on the application and cooling requirements. They can be found in various electronic systems, including computer processors, graphics cards, power electronics, and LED lighting, among others. The specific design and configuration of the heat exchanger may vary based on factors such as power dissipation levels, available space, and desired cooling performance. In summary, passive heat exchangers are essential components in electronics that facilitate the transfer of heat generated by electronic components to a fluid medium. They are designed to maximize the contact surface area and are typically constructed using materials with high thermal conductivity. By efficiently dissipating heat, these heat exchangers help maintain the optimal operating temperature of electronic devices, ensuring their reliability and longevity.