Liquid Cooling, Heating

Results:
290
Manufacturer
Series
Dimensions - Overall
Weight
Power - Cooling
Operating Temperature
Current
Fluid Capacity
Flow Rate
Voltage
Thermal Resistance @ GPM
Features
Product Type
Connection Type
Ratings
Power Input
Results remaining290
Select
ImageProduct DetailPriceAvailabilityECAD ModelVoltageWeightConnection TypeFlow RatePower InputThermal Resistance @ GPMOperating TemperatureCurrentFluid CapacitySeriesFeaturesProduct TypeDimensions - OverallRatingsPower - Cooling
9012704.02
CORIO CD-600F REFRIGERATED/HEATI
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Quantity
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PCB Symbol, Footprint & 3D Model
115V
-
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3.96GPM (15.0LPM)
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-35°C ~ 150°C
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7500ML (253.6 oz)
CORIO
Flow Diverter, USB A, USB B
Refrigerated/Heating Circulator
18.50" L x 13.00" W x 27.00" H (469.9mm x 330.2mm x 685.8mm)
CE, cULus
460 W
9013704.02
CORIO CP-600F REFRIGERATED/HEATI
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Quantity
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PCB Symbol, Footprint & 3D Model
115V
-
-
7.13GPM (27.0LPM)
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-35°C ~ 200°C
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7500ML (253.6 oz)
CORIO
Adjustable Pump, Flow Diverter, USB A, USB B, RS232
Refrigerated/Heating Circulator
18.50" L x 13.00" W x 27.00" H (469.9mm x 330.2mm x 685.8mm)
CE
440 W
9661017.2
FL1701 CHILLER, 1.7KW, 115V
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Quantity
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PCB Symbol, Footprint & 3D Model
115 ~ 230VAC
172 lbs (78.0 kg)
-
6.08GPM (23.0LPM)
-
-
-20°C ~ 40°C
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Temperature Control
Active, Recirculating Chiller
29.90" L x 19.70" W x 25.20" H (759.5mm x 500.4mm x 640.1mm)
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1700 W
9661012.13
FL1201 CHILLER, 1.2KW, 115V
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Quantity
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PCB Symbol, Footprint & 3D Model
115 ~ 230VAC
172 lbs (78.0 kg)
-
6.08GPM (23.0LPM)
-
-
-20°C ~ 40°C
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FL
Temperature Control
Active, Recirculating Chiller
29.90" L x 19.70" W x 25.20" H (759.5mm x 500.4mm x 640.1mm)
-
1200 W
9012707.02
CORIO CD-1000F REFRIGERATED/HEAT
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Quantity
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PCB Symbol, Footprint & 3D Model
115V
-
-
3.96GPM (15.0LPM)
-
-
-40°C ~ 150°C
16 A
7500ML (253.6 oz)
CORIO
Flow Diverter, USB A, USB B
Refrigerated/Heating Circulator
19.30" L x 16.50" W x 29.10" H (490.2mm x 419.1mm x 739.1mm)
CE
980 W
9032706.02
MAGIO MS-900F REFRIGERATED/HEATI
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Quantity
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PCB Symbol, Footprint & 3D Model
115V
-
-
16 A
800 W
9021706.02
DYNEO DD-900F REFRIGERATED/HEATI
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Quantity
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PCB Symbol, Footprint & 3D Model
115V
-
-
16 A
800 W
CS949-107-N-0A
Liquid Cold plate two bent 24"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
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-
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CS949
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Passive, Cold Plate
24.00" L x 7.75" W x 0.38" H (609.6mm x 196.9mm x 9.7mm)
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-
CS949-103-N-0A
Liquid Cold Plate, one bent 6" x
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Quantity
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PCB Symbol, Footprint & 3D Model
-
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CS949
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Passive, Cold Plate
6.00" L x 3.00" W x 0.38" H (152.4mm x 76.2mm x 9.7mm)
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CS949-109-N-0A
Liquid Cold plate two bent 6"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
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CS949
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Passive, Cold Plate
6.00" L x 7.75" W x 0.38" H (152.4mm x 196.9mm x 9.7mm)
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Liquid Cooling, Heating

Thermal liquid cooling encompasses a diverse array of technologies, including heat exchangers, immersion chillers, recirculating chillers, recirculating chiller/heaters, and cold plates, catering to a wide range of power ratings from 22W to 5000W. These systems are designed to manage the transfer of heat within electronic and mechanical equipment by utilizing a liquid coolant. The flow rates of these thermal liquid cooling systems vary significantly, ranging from 0.61 gallons per minute (2.3 liters per minute) to 3.96 gallons per minute (15.0 liters per minute). This wide range allows for flexibility in accommodating different cooling requirements across various applications. Moreover, the thermal resistance of these systems also spans a broad spectrum, from 0.0055°C/W at 2.0 gallons per minute to 0.084°C/W at 1.5 gallons per minute. This variation in thermal resistance provides the capability to tailor the cooling performance based on specific heat dissipation needs and environmental conditions. These thermal liquid cooling solutions are utilized across industries where precise temperature control and efficient heat dissipation are critical. They find applications in cooling high-power electronic components, laser systems, medical equipment, and industrial machinery, among others. In summary, thermal liquid cooling systems encompass a diverse range of technologies designed to manage heat transfer within electronic and mechanical equipment. With varying flow rates and thermal resistance, these solutions offer flexibility and precision in addressing the cooling needs of different applications, contributing to the reliability and optimal performance of critical systems.