Sensata Technologies

Sensata Technologies

Sensata Technologies is a global leader in the development and manufacture of innovative sensing and control solutions. With a presence in more than 100 countries, Sensata provides essential products and services for industries such as automotive, aerospace, industrial, and renewable energy. The company's product portfolio includes sensors, encoders, switches, and circuit breakers, among others, known for their accuracy, reliability, and efficiency. With a strong focus on technological innovation and engineering excellence, Sensata is committed to delivering cutting-edge solutions that meet the evolving needs of its customers. The company's dedication to quality and performance has established Sensata as a trusted partner for customers worldwide, enabling safe, efficient, and sustainable operation across diverse industries.

Pads, Sheets

Results:
10
Series
Outline
Usage
Thermal Conductivity
Color
Adhesive
Material
Thickness
Shape
Thermal Resistivity
Backing, Carrier
Type
Results remaining10
Applied Filters:
Sensata Technologies
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesShapeColorMaterialBacking, CarrierUsageTypeOutlineThicknessAdhesiveThermal ResistivityThermal Conductivity
TP01-M
THERM PAD 55.12X42.42MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Rectangular
Pink
-
-
Single Phase SSRs, M50 Power Modules
Pad, Sheet
55.12mm x 42.42mm
0.0050" (0.127mm)
Adhesive - One Side
-
0.7W/m-K
TP01
THERM PAD 55.12X42.42MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Rectangular
Pink
-
-
Single Phase SSRs, M50 Power Modules
Pad, Sheet
55.12mm x 42.42mm
0.0050" (0.127mm)
Adhesive - One Side
-
0.7W/m-K
TP03
THERM PAD 100.84X70.36MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Rectangular
Pink
-
-
Three Phase SSRs
Pad, Sheet
100.84mm x 70.36mm
0.0050" (0.127mm)
Adhesive - One Side
-
0.7W/m-K
HSP-7
THERM PAD 39.4X17MM PINK
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
Pink
Phase Change Compound
-
NOVA22 SSRs
Pad, Sheet
39.40mm x 17.00mm
0.0050" (0.127mm)
Tacky - Both Sides
-
0.07W/m-K
HSP-2
THERM PAD 57.15X44.45MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
Black
-
-
Single Phase SSRs, M50 Power Modules
Pad, Sheet
57.15mm x 44.45mm
0.0050" (0.127mm)
Adhesive - One Side
-
2.0W/m-K
HSP-5
THERM PAD 104.39MMX73.66MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
Black
-
-
Three Phase SSRs
Pad, Sheet
104.39mm x 73.66mm
0.0050" (0.127mm)
Adhesive - One Side
-
2.0W/m-K
HSP-1
THERM PAD 57.15X44.45MM WHT
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
White
-
-
Single Phase SSRs, M50 Power Modules
Pad, Sheet
57.15mm x 44.45mm
0.0039" (0.100mm)
-
-
1.0W/m-K
HSP-6
THERM PAD 33.78X17.02MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
Black
-
-
EL Series SSRs
Pad, Sheet
33.78mm x 17.02mm
0.0050" (0.127mm)
Adhesive - One Side
-
2.0W/m-K
HSP-8
THERM PAD FOR PM67 PINK
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
Pink
-
-
NOVA22 SSRs
Pad, Sheet
-
0.0050" (0.127mm)
-
-
0.07W/m-K
HSP-3
THERM PAD 104.39MMX73.66MM WHT
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Quantity
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PCB Symbol, Footprint & 3D Model
HSP
Rectangular
White
-
-
Three Phase SSRs
Pad, Sheet
104.39mm x 73.66mm
0.0039" (0.100mm)
-
-
1.0W/m-K

About  Pads, Sheets

Thermal interface pads and thermal interface materials are designed to provide heat transfer between components and heatsinks. They are made from a variety of different materials and thicknesses, which determine their thermal conductivity and/or resistance. Some thermal interface pads and materials are coated on one or both sides with an adhesive to help maintain contact with the surfaces they are applied to. The main purpose of these thermal interface materials is to fill in small gaps and irregular shapes that exist between components and heatsinks. These imperfections slow down heat transfer, causing the component temperature to rise and decreasing performance. By filling these gaps, thermal interface pads and materials can enhance the efficiency of the interface's heat transfer, resulting in more effective heat dissipation. Thermal interface pads and materials can be made from a variety of materials such as silicon-based compounds, lubricant-like substances, phase-change materials, and synthetic graphite sheets. Each material has its unique combination of thermal properties, such as thermal conductivity and thermal resistance, which determine its effectiveness in promoting heat transfer. Thickness is also a critical factor that affects the thermal performance of thermal interface pads and materials. Thinner pads and materials typically offer lower thermal resistance and better thermal conductivity, while thicker pads and materials may have other advantages, such as better adaptability and less susceptibility to surface roughness. Some thermal interface pads and materials come with adhesive coatings, which serve several purposes. They enhance the contact between the thermal interface pad or material and the surfaces it is applied to, ensuring optimal heat transfer. Adhesives also help maintain the mechanical stability of the thermal interface pad or material, preventing displacement or separation caused by vibration or other external factors. In summary, thermal interface pads, thermal interface materials, and similar materials aim to improve heat transfer efficiency between components and heatsinks by filling in micro-imperfections. They use different materials and thicknesses, where each material provides specific thermal properties. Adhesive coatings help maintain contact and stability. By using thermal interface pads, thermal interface materials, and similar materials, significant improvements in overall thermal management in electronic devices can be achieved, resulting in improved performance, reliability, and lifespan.