Pads, Sheets

Results:
8,551
Manufacturer
Series
Outline
Thickness
Thermal Conductivity
Thermal Resistivity
Usage
Material
Color
Type
Backing, Carrier
Shape
Adhesive
Specifications
Results remaining8,551
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ImageProduct DetailPriceAvailabilityECAD ModelShapeColorMaterialThicknessBacking, CarrierUsageTypeAdhesiveThermal ConductivityThermal ResistivityOutlineSeries
62-12-1015-PAD70TPA
THERM-A-GAP PAD70TPA 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.120" (3.05mm)
Aluminum Foil
Thermally Conductive
Gap Filler Pad, Sheet
Adhesive - One Side
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
8810-22"-36YRDS
THERM PAD 32.92M X 558.8MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
White
Acrylic
0.0098" (0.250mm)
Polyester
-
Transfer Tape, Roll
Adhesive - Both Sides
0.6W/m-K
-
32.92m x 558.80mm
8810
8810-7"-108YD
THERM PAD 98.76M X 177.8MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
White
Acrylic
0.0098" (0.250mm)
Polyester
-
Transfer Tape, Roll
Adhesive - Both Sides
0.6W/m-K
-
98.76m x 177.80mm
8810
9890-22"X36YD
THERM PAD 32.92M X 558.8MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Gray
Polymer
0.0100" (0.254mm)
-
Thermally Conductive
Transfer Tape, Roll
Adhesive - Both Sides
0.6W/m-K
0.90°C/W
32.92m x 558.80mm
9890
61-03-0909-PAD30G
THERM-A-GAP PAD30G 3.2 W/M-K GAP
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Quantity
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PCB Symbol, Footprint & 3D Model
Square
Blue
-
0.0300" (0.762mm)
Fiberglass
Thermally Conductive
Gap Filler Pad, Sheet
-
3.2W/m-K
0.40°C/W
228.60mm x 228.60mm
THERM-A-GAP™ PAD 30
8805-7"X36YD
THERM PAD 32.92M X 177.8MM W/ADH
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
White
Acrylic
0.0049" (0.125mm)
Polyester
-
Transfer Tape, Roll
Adhesive - Both Sides
0.6W/m-K
-
32.92m x 177.80mm
8805
TH994LH_288_192_1.5
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Silicone
-
-
-
-
-
6.0W/m-K
-
-
TH994LH
TH994LH_288_192_0.5
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Silicone
-
-
-
-
-
6.0W/m-K
-
-
TH994LH
62-16-1015-PAD70TPA
THERM-A-GAP PAD70TPA 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.160" (4.06mm)
Aluminum Foil
Thermally Conductive
Gap Filler Pad, Sheet
Adhesive - One Side
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
61-16-1015-PAD70TPG
THERM-A-GAP PAD70TPG 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.160" (4.06mm)
Fiberglass
Thermally Conductive
Gap Filler Pad, Sheet
-
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
TCF160-01180118-020-1PC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
61-12-1015-PAD70TPG
THERM-A-GAP PAD70TPG 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.120" (3.05mm)
Fiberglass
Thermally Conductive
Gap Filler Pad, Sheet
-
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
61-10-1015-PAD70TPG
THERM-A-GAP PAD70TPG 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.100" (2.54mm)
Fiberglass
Thermally Conductive
Gap Filler Pad, Sheet
-
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
61-16-1015-PAD60
THERM-A-GAP PAD60 6.0 W/M-K GAP
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Green
-
0.160" (4.06mm)
-
Thermally Conductive
Gap Filler Pad, Sheet
-
6.0W/m-K
0.28°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 60
61-12-1015-PAD60
THERM-A-GAP PAD60 6.0 W/M-K GAP
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Green
-
0.120" (3.05mm)
-
Thermally Conductive
Gap Filler Pad, Sheet
-
6.0W/m-K
0.28°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 60
61-08-1015-PAD60
THERM-A-GAP PAD60 6.0 W/M-K GAP
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Green
-
0.0800" (2.032mm)
-
Thermally Conductive
Gap Filler Pad, Sheet
-
6.0W/m-K
0.28°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 60
61-04-1015-PAD70TPG
THERM-A-GAP PAD70TPG 7.0 W/M-K G
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Quantity
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PCB Symbol, Footprint & 3D Model
Rectangular
Dark Gray
-
0.0400" (1.016mm)
Fiberglass
Thermally Conductive
Gap Filler Pad, Sheet
-
7.0W/m-K
0.27°C/W
381.00mm x 254.00mm
THERM-A-GAP™ PAD 70TP
TGN900-01180118-010-1PC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
TCI800-01180118-010-1PC
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Quantity
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PCB Symbol, Footprint & 3D Model
Square
Silver
-
0.0080" (0.203mm)
-
-
-
-
800W/m-K
0.05°C/W
359.67mm X 359.67mm
-
TCF200-01180118-020-1PC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-

Pads, Sheets

Thermal interface pads and thermal interface materials are designed to provide heat transfer between components and heatsinks. They are made from a variety of different materials and thicknesses, which determine their thermal conductivity and/or resistance. Some thermal interface pads and materials are coated on one or both sides with an adhesive to help maintain contact with the surfaces they are applied to. The main purpose of these thermal interface materials is to fill in small gaps and irregular shapes that exist between components and heatsinks. These imperfections slow down heat transfer, causing the component temperature to rise and decreasing performance. By filling these gaps, thermal interface pads and materials can enhance the efficiency of the interface's heat transfer, resulting in more effective heat dissipation. Thermal interface pads and materials can be made from a variety of materials such as silicon-based compounds, lubricant-like substances, phase-change materials, and synthetic graphite sheets. Each material has its unique combination of thermal properties, such as thermal conductivity and thermal resistance, which determine its effectiveness in promoting heat transfer. Thickness is also a critical factor that affects the thermal performance of thermal interface pads and materials. Thinner pads and materials typically offer lower thermal resistance and better thermal conductivity, while thicker pads and materials may have other advantages, such as better adaptability and less susceptibility to surface roughness. Some thermal interface pads and materials come with adhesive coatings, which serve several purposes. They enhance the contact between the thermal interface pad or material and the surfaces it is applied to, ensuring optimal heat transfer. Adhesives also help maintain the mechanical stability of the thermal interface pad or material, preventing displacement or separation caused by vibration or other external factors. In summary, thermal interface pads, thermal interface materials, and similar materials aim to improve heat transfer efficiency between components and heatsinks by filling in micro-imperfections. They use different materials and thicknesses, where each material provides specific thermal properties. Adhesive coatings help maintain contact and stability. By using thermal interface pads, thermal interface materials, and similar materials, significant improvements in overall thermal management in electronic devices can be achieved, resulting in improved performance, reliability, and lifespan.