Pads, Sheets

Results:
8,554
Manufacturer
Series
Outline
Thickness
Thermal Conductivity
Thermal Resistivity
Usage
Material
Color
Type
Backing, Carrier
Shape
Adhesive
Specifications
Results remaining8,554
Select
ImageProduct DetailPriceAvailabilityECAD ModelUsageColorShapeAdhesiveBacking, CarrierSeriesTypeOutlineThicknessMaterialThermal ResistivityThermal Conductivity
A18212-07
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Square
-
-
Tflex™ SF10
Gap Filler Pad, Sheet
457.00mm x 457.00mm
0.0689" (1.750mm)
Non-Silicone, Ceramic Filled
-
10W/m-K
A18212-03
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Square
-
-
Tflex™ SF10
Gap Filler Pad, Sheet
457.00mm x 457.00mm
0.0295" (0.750mm)
Non-Silicone, Ceramic Filled
-
10W/m-K
A18213-20
THERM PAD 229MMX229MM GRAY
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
Square
-
-
Tflex™ SF10
Gap Filler Pad, Sheet
229.00mm x 229.00mm
0.197" (5.00mm)
Non-Silicone, Ceramic Filled
-
10W/m-K
PCS04-SF.20-TC2.0-SIL1
Timtel Thermal
THERM FILM 215.9 X 279.4 DK Brow
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermally Conductive
Dark Brown
Rectangular
Tacky - One Side
-
SF-TC2.0
Thermal Film, Sheet
215.90mm x 279.40mm
0.008" (0.20mm)
Silicone
-
2.0W/m-K
21-250-400-0816
THERM PAD 203MMX406MM GRAY
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermally Conductive
Gray
Rectangle
Tacky - Both Sides
-
-
Interface Pad, Sheet
0.157" (4.00mm)
21-869-400-1071
THERM PAD 203MMX304MM PINK
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermally Conductive
Pink
Rectangle
Tacky - Both Sides
-
-
Interface Pad, Sheet
0.157" (4.00mm)
21-217-400-0816
THERM PAD 203MMX406MM GRAY
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermally Conductive
Gray
Rectangle
Tacky - Both Sides
-
-
Interface Pad, Sheet
0.157" (4.00mm)
A18498-01
KIT,TGARD 210B,WHT,A0 TO238,1000
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
A14445-01
TGARD 210,A0 SE,17.0X16.0IN,OG,O
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
A15037-013
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
A15038-013
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
-
-
-
-
-
-
-
QB1020A40WYTD\1000
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Quantity
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PCB Symbol, Footprint & 3D Model
Heat Transfer
-
Rectangular
-
-
Q-Bridge
Thermal Bridge Jumper
2.54mm x 5.08mm
0.0402" (1.020mm)
Aluminum Nitride
2°C/W, 3°C/W
320W/m-K, 508W/m-K
TH994LH_288_192_4.0
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Gray
-
-
-
TH994LH
-
-
-
Silicone
-
6.0W/m-K
TH994LH_288_192_1.0
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermally Conductive
Gray
Rectangular
Tacky - Both Sides
-
TH994LH
-
288.00mm x 192.00mm
0.0394" (1.000mm)
Silicone
-
6.0W/m-K

Pads, Sheets

Thermal interface pads and thermal interface materials are designed to provide heat transfer between components and heatsinks. They are made from a variety of different materials and thicknesses, which determine their thermal conductivity and/or resistance. Some thermal interface pads and materials are coated on one or both sides with an adhesive to help maintain contact with the surfaces they are applied to. The main purpose of these thermal interface materials is to fill in small gaps and irregular shapes that exist between components and heatsinks. These imperfections slow down heat transfer, causing the component temperature to rise and decreasing performance. By filling these gaps, thermal interface pads and materials can enhance the efficiency of the interface's heat transfer, resulting in more effective heat dissipation. Thermal interface pads and materials can be made from a variety of materials such as silicon-based compounds, lubricant-like substances, phase-change materials, and synthetic graphite sheets. Each material has its unique combination of thermal properties, such as thermal conductivity and thermal resistance, which determine its effectiveness in promoting heat transfer. Thickness is also a critical factor that affects the thermal performance of thermal interface pads and materials. Thinner pads and materials typically offer lower thermal resistance and better thermal conductivity, while thicker pads and materials may have other advantages, such as better adaptability and less susceptibility to surface roughness. Some thermal interface pads and materials come with adhesive coatings, which serve several purposes. They enhance the contact between the thermal interface pad or material and the surfaces it is applied to, ensuring optimal heat transfer. Adhesives also help maintain the mechanical stability of the thermal interface pad or material, preventing displacement or separation caused by vibration or other external factors. In summary, thermal interface pads, thermal interface materials, and similar materials aim to improve heat transfer efficiency between components and heatsinks by filling in micro-imperfections. They use different materials and thicknesses, where each material provides specific thermal properties. Adhesive coatings help maintain contact and stability. By using thermal interface pads, thermal interface materials, and similar materials, significant improvements in overall thermal management in electronic devices can be achieved, resulting in improved performance, reliability, and lifespan.